System |
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CPU | Intel® 11 Gen. Tiger Lake-H Processors, up to 8 cores, integrated Intel® UHD Graphics Intel® Xeon® W-11865MRE, 45W Tiger Lake 11th Gen, 8C, Freq. 2.6/4.7 GHz, 24MB cache |
Memory type | Up to 96GB DDR4 SO-DIMM, non-ECC and ECC |
CHIPSET | Intel® RM590E (support ECC, with Xeon CPU) /QM580E |
GPU | NVIDIA RTX™ A4500 GA104-955 GPU 8GB/16GB GDDR6 memory, 5888 CUDA cores |
On Board Storage | Soldered 64 GB NVMe |
Expansion Slot | 2x Full-size mini PCIe (1 with mSATA supported) -1 with mSATA/USB2.0/PCIeX1 support -1 with SIM/USB2.0/PCIeX1 support 1x 2280 M key (SATA only) |
Storage |
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SATA | 2x 2.5” SSD, Hot Swappable SSD/HDD slot |
M.2 | 1x 2280 M key (SATA only) |
Front I/O |
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X1 | 2x GbE LAN + 2x USB2.0 + 1x COM(RS232) with D38999 connector |
X2 | 1x VGA + 4x DI/4x DO + 3x RS422 with D38999 connector |
X3 | 1x USB3.0 , with D38999 connector |
X4 | 1x USB3.0 , with D38999 connector |
X5 | 1x DC-in , with D38999 connector |
LED | 1x SSD/HDD LED indicator |
switch | 1x IP65 power button , with LED indicator |
SSD | 2x 2.5”Easy swap SSD Tray |
Power |
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Power input | MIL-STD-461 18V~36V DC-Input |
Application, Operating System |
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Application | Military Platforms Requiring Compliance to MIL-STD-810 Where Harsh Temperature, Shock, Vibration, Altitude, Dust and MIL-461 EMI Conditions. |
Operating System | Windows® 10 64-bit / Linux (support by request) |
Physical |
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Dimension | 250(L) x 325 (W) x 100 (H)mm |
Weight | 11 KG |
Chassis | Aluminum Alloy |
Heatsink | Heatsink Aluminum Alloy, Corrosion Resistant |
Environmental |
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Green Product | RoHS, WEEE compliance |
Operating Temp. | -20°C to +60°C |
Storage Temp. | -40°C to +85°C |
Relative Humidity | 5% to 95%, non-condensing |
MIL-STD-810 | Method 507.5, Procedure II ( Temperature & Humidity ) Method 516.6 Shock-Procedure V Non-Operating ( Mechanical Shock ) Method 516.6 Shock-Procedure I Operating ( Mechanical Shock ) Method 514.6 Vibration Category 24/Non-Operating ( Category 20 & 24, Vibration ) Method 514.6 Vibration Category 20/Operating ( Category 20 & 24, Vibration ) Method 501.5, Procedure I ( Storage/High Temperature ) Method 501.5, Procedure II ( Operation/High Temperature ) Method 502.5, Procedure I ( Storage/Low Temperature ) Method 502.5, Procedure II ( Operation/Low Temperature ) Method 503.5, Procedure I ( Temperature shock ) |
Reliability | No Moving Parts; Passive Cooling. Designed & Manufactured using ISO 9001 / 2000 Certified Quality Program. |
MIL-STD-461 | CE102 : 10 KHz – 10 MHz RE102-4 : 1.5 MHz -30 MHz – 5 GHz RS103 : 200 MHz – 3.0 GHz – 5.0 GHz, 50 V/m equal for all frequencies |
Designed to Meet Items ( Options ) |
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CS101, CS114, CS115, CS116 |
CE106, RE103, RS101 | |
MIL-STD-1275 | Steady State | 20V-33V |
| Surge Low | 18V/500ms |
| Surge High | 100V/500ms |