THOR100S-X11

Ultra Short Depth Rugged SFF 1U/2 Military Computer

 

  • Ultra Short Depth 200mm 1U Half Rugged Computer
  • Intel® 11th Tiger Lake (U) i7-1185G7E
  • Up to DDR4-32GB
  • 1x SATA III SSD up to 2TB
  • Anti-Vibration up to 10 Grms, Shock 75G
  • IP65 Classified
  • MIL-STD-461, DC-DC 18V~36V
  • Extended operating temperature: -40°C to +70°C
  • Size : 220 x 200 x 44 mm (WxDxH)

Intel Gold

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Technical Profile

THOR100S-X11 is powered by the robust Intel 11th generation Tiger Lake-UP3 i7-1185G7E processor seamlessly integrated onto the motherboard. This compact and fan less rugged system boasts exceptional performance, featuring a quad-core processor with a clock speed of 4.4GHz. Noteworthy is its low power consumption, ranging from 12W to a maximum of 28W.

 

Emphasizing its rugged design and advanced functionality, the THOR100S-X11 is equipped with a MIL-STD Amphenol type D38999 mini DP connector, ensuring durability in the face of challenging environments. The system’s full IP65 protection enables it to withstand harsh conditions with ease.

 

Designed to operate in extreme temperatures, the THOR100S-X11 supports an extended range from -40 to 70°C. Additionally, its MIL-STD-461 power adheres to a wide input range of 18V to 36V DC, safeguarding the system against voltage surges and enhancing the reliability of critical components. In essence, the THOR100S-X11 stands as a resilient and high-performance solution for demanding applications.

 

Robust Product Design Ready For Military Application
MIL-STD-461

 

MIL-STD-1275

Specifications

System

 

CPUIntel® Core™ i7-1185G7E Processor (4 Core/ 8 Threads, 12M Cache up to 4.40 GHz), 15W/28W
Memory TypeDDR4 3200MHz / 1x 260-pin SO-DIMM/Max.32GB (Non-ECC)
Expansion Slot1x M.2 2230 E-key (Wifi & BT, PCIe/USB)

1x M.2 2242/2260/2280/3042/3052 B-key

(Storage/5G/LTE, USB2.0/PCIe x 1/SATAIII)

 

Display

 

ChipsetIntel® Iris Xe Graphics
Mini DPUp to 5120 x 3200 @60Hz
 

Storage

 

SDD1x SATA III SDD – Up to 2TB Capacity
 

Ethernet

 

ChipsetIntel® I219LM Giga LAN+I225LM 2.5G
 

Front I/O

 

X1Mini DP with D38999 connector
X2LAN with M12 connector
X3LAN with M12 connector
X42x USB2.0 + 1x RS232 with M12 connector
X5DC-IN with D38999 connector
ButtonWater Resistive Power Button with dual-color LED Backlight
 

Rear I/O

 

Gound Screw1
 

Power Requirement

 

Power Input18V~36V DC-IN
Power TypeAT/ATX Mode Select by Jumper
 

Power Requirement, Operation System

 

ApplicationsMilitary Platforms Requiring Compliance to MIL-STD-810
Embedded Computing, Process Control, Intelligent Automation and manufacturing applications where Harsh Temperature, Shock, Vibration, Altitude, Dust and EMI Conditions.
Operating SystemWindows® 11 64-bit, Linux(Support by request)
 

Physical

 

Dimension220 x 200 x 44 mm
Weight2 kg
Chassis-40°C to 70°C (ambient with air flow)
Storage Temp.-40°C to 85°C
Relative Humidity5% to 95%, non-condensing
Ingress ProtectionIP65
 

Environmental

 

EMCMIL-STD-461 :

CE102 basic curve, 10kHz – 30 MHz

RE102-4, (1.5 MHz) -30 MHz – 5 GHz

RS103, 1.5 MHz – 5 GHz, 50 V/m equal for all frequencies

EN 61000-4-2: Air discharge: 8 kV, Contact discharge: 6kV

EN 61000-4-3: 10V/m

EN 61000-4-4: Signal and DC-Net: 1 kV

EN 61000-4-5: Leads vs. ground potential 1kV, Signal und DC-Net: 0.5 kV

CE and FCC

ReliabilityNo Moving Parts; Passive Cooling.

Designed & Manufactured using ISO 9001/2000 Certified Quality Program.

EMCCE compliant
Green ProductRoHS, WEEE compliance
Operating Temp.-40 to 70°C (ambient with air flow)
Storage Temp.-40 to 85°C
Relative Humidity5% to 95%, non-condensing.

CPU

The THOR100S-X11 offers highly effectively heat conductive and heat convective thermal solutions to meet the demands of customers’ extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.

 

THOR100S-X11

Order Information

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