THOR100-X3

Video Frame Grabber Computer -1U/half Size, MIL-STD 810, IP65 Rugged System with Intel® Core™ i7-7600U Kaby Lake Processor, Vehicle-based Video Capture Card Support, 9V to 36V DC-in, Wide Temp. -40°C to 70°C

 

  • Intel® Core™ i7-7600U (2.8 GHz, up to 3.9 GHz, 2-cores, 4 threads)
  • 8 video channels to be captured at full D1 size, all at full frame rate (optional)
  • 2x DDR4 up to 32GB
  • Amphenol M12 connector applied
  • IP65 classify
  • Wide range 9V to 36V DC-in
  • Extended operating temperature. -40°C to 70°C

Intel Gold

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Technical Profile

Introduction

 

THOR100-X3 is driven by Intel 7th generation Kaby Lake i7-7600U processor soldering onboard which is an extremely compact Core I-based fanless rugged system. Kaby Lake processor supports outstanding CPU and graphics performance, providing dual cores 3.9GHz clock speed while consuming low power consumption 7.5W. THOR100-X3 highlight on its rugged design and high functionality, the system especially installed MIL-STD Amphenol type connector and full IP65 protection allow system withstand in any kind of harsh environment. THOR100-X3 supports extended temperature from -40 to 70°C and wide range 9V~36V DC input can protect system from damages caused by sudden surge of voltage, thus further secure the reliability of its critical components and the system itself.

 

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Frame Grabber Card (Analog to Digital / PAL )

 

Frame grabbers may be used in military applications. For instance, when a potential breach of abnormal signal is detected, a frame grabber captures an image or a sequence of images in digital form, and then transmits the data to pilots or command control center.  THOR100-X3 support frame grabber cards expansion to be better process data promptly to meet front line needs, to collect useful images and help pilots to react promptly on the ever-changing battlefield.

 

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Digital HD-SDI video input

1CH, Mini PCIe HW encode video capture card

 

 

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Analogic PAL video input

4CH, Mini PCIe Video Capture Card

 

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Analogic PAL video output

1CH, Scan Converter Board

 

Intel Kaby Lake Core i7-7600U on board
THOR100-X3 is powered by on Intel Kaby Lake Core i7-7600U soldered on board. With CPU soldered on board, there is less conduction of heat and high-density interconnection between the motherboard and the components, which reduces the motherboard from the crisis of overheating. THOR100-X3 is designed to withstand the most challenging combat requirements with many being MIL-STD 810G certified for extreme environmental conditions.

 

Wide voltage power input 9V~36V
To withstand under any kinds of application challenges, system with wide range designed is brings maximum reliability and stability. Wide voltage power input design (9~36V) can protect the system from damages caused by sudden surge of voltage, thus further secure the reliability of its critical components and the system itself.

 

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Specifications

System

 

CPUIntel® Core™ Kaby Lake-U Processor

Intel® Core™ i7-7600fU Processor (2C x 2.2/3.1 GHz), 4M Cache (15W)

Memory Type2x DDR4 up to 32 GB
Expansion Slot1x mPCIe with mSATA supported
Storage Device1x 2.5″ HDD/SSD tray
Ethernet Chipset1x Intel® I210-IT

1x Intel® I218-LM

 

Front I/O

 

Power ButtonWater Resistive Power Button with LED Backlight
X1 (COM)12-Pin A-code Female M12 Connector (Amphenol M12A-12PMMS-SF8001)
X2 (VGA)12-Pin A-code Female M12 Connector (Amphenol M12A-12PMMS-SF8001)
X3 (LAN)8-Pin A-code Female M12 Connector (Amphenol M12S-04BFFB-SL7001)
X4 (LAN)8-Pin A-code Female M12 Connector (Amphenol M12S-04BFFB-SL7001)
X5 (USB 2.0 x2)8-Pin A-code Female M12 Connector (Amphenol M12S-04BFFB-SL7001)
 

Rear I/O

 

Gound Screw1
DC-in4-Pin S-code Male M12 Connector (Amphenol M12S-04PMMS-SF8001)
 

Display

 

Display InterfaceVGA interface: 12-pin A-code M12 connectors(female); resolution up to 1920 x 1080@60 Hz
Graphics ControllerIntel® HD Graphics 6000
 

OS support list

 

WindowsWindows 8 x32/x64、Windows 8.1 x32/x64、Windows 10 x32/x64
LinuxFedora 20、Ubuntu 13.04、Ubuntu 13.10、Ubuntu 14.04
 

Mechanical and Environment

 

Power Requirement9V to 36V DC-in, AT/ATX mode
Dimension220 x 380 x 44 mm
Ingress ProtectionIP65
Weight5.5 kg
Operating Temp.-40°C to 70°C (ambient with air flow)
Storage Temp.-40°C to 85°C
Relative Humidity5% to 95%, non-condensing
 

Test Standard

 

MIL-STD-810G TestMethod 507.5, Procedure II (Temperature & Humidity)
Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock)
Method 516.6 Shock-Procedure I Operating (Mechanical Shock)
Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24, Vibration)
Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration)
Method 501.5, Procedure I (Storage/High Temperature)
Method 501.5, Procedure II (Operation/High Temperature)
Method 502.5, Procedure I (Storage/Low Temperature)
Method 502.5, Procedure II (Operation/Low Temperature)
Method 503.5, Procedure I (Temperature shock)
EMCCE, FCC compliant
Green ProductRoHS, WEEE compliance

CPU

The THOR100 offers highly effectively heat conductive and heat convective thermal solutions to meet the demands of customers’ extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.

 

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Test Configuration

Device

Configuration

CPU TypeIntel® Core™ i7-7600U Processor 3.90 GHz
Memory DIMMSwissbit 4GB EP3L SLV04G64A1BB1SA-DCRT
LAN1Intel® I210 Gigabit Network
LAN2Intel® I210 Gigabit Network
Test SoftwareBurnin test v7.1、AS SSD、
Intel Extreme Tuning Utility、iperf
ChamberKSON THS-b4t-150

 

Thermal Measurement

7STARLAKE provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus 7STARLAKE conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, 7STARLAKE is able to analyses the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 12.5 hours which at each temperature point we burn in THOR100 for two hours, from +40 to +70°C.

 

THOR100 MB HeatSink – IO Performance

Point-40°C25°C40°C45°C50°C55°C60°C65°C70°C
CPU T-J070828993100103104104
CPU Die-28.155.158.363.469.174.479.983.386.3
Heatsink-33.648.152.357.362.368.273.478.382.5
Δ1=(TJ-Die)28.114.923.725.623.925.623.120.717.7
Δ2=(Die-HeatSink)5.57.06.06.16.86.26.55.03.8
CPU Frenquency (GHz)3.003.003.003.003.022.822.82.552.19

Thermal Solution

Effective cooling solution for maximum heat dissipation:

 

7STARLAKE implements unique cooling solution with copper heat spreader, pure copper heat pipe and aluminum heat sink for maximum heat dissipation. With the aluminum heat sink enclosure allows dual-sided heat dissipation. We especially adopt the physical property of copper and aluminum, the copper heat spreader touches the heat source – processor to absorbs the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid, the aluminum heat sink dissipates the heat into surrounding air promptly. With the benefits of fanless design, THOR100 can ensure high reliability and stability while working under wide range temperature from -40°C to 70°C

 

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Patent Designed Aluminum Heat Sink

The heat sink is made by heat radiating material, which is aim to Lowering the temperature by dissipating heat into the surrounding air. Aluminum material AL6063, 39 mm height and weighs 3300 g

 

Pure Copper Heat PipePure Copper Heat Pipe

The heat pipes are embedded in the heat sink to ensure 100% tight integration for superior heat dissipation. Copper heat pipe transfers heat from the heat sources CPU to the heat sink over relatively long distance. Two-phase heat transfer involves the liquid-vapor phase change of a working fluid. 8.0 mm diameter heat pipe, 99.9% purity of copper High heat conductivity coefficient up to 5000

Copper Heat Spreader

Copper Heat Spreader

Copper heat spreader directly touches the heat source area, which can absorb heat rapidly and transfer to heat pipe and allow the high efficiency heat pipe further bring out heat to upper heat sink enclosure, 99.9% purity of copper.

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Rugged SBC

Rugged Intel Broadwell SBC is installed in the middle of the system, dividing  segmentation type thermal design into upper and lower module.

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Amphenol M12 Type

THOR100 all applied by rugged M12 type connectors. A waterproof power button is also incorporated for comprehensive military grade I/O protection.

• Fieldwireable M12 connectors boast its convenience in reduction in wiring time. No extra tools are required for extra secure connection.
• M12 connectors highlight on robust joint, compact size, and reliability. Screw lock mechanism pushes security and reliability to the extreme.

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Aluminum Heat Sink

The heat sink is made by heat radiating material, Which is aim to lowering the temperature by dissipating heat into the surrounding air. Aluminum material AL6063, 5 mm height