TEC300P-M128

  • Ampere® Altra® Max M128-30 SoC, 128 cores, 3.0 GHz, Ampere Altra
  • RAM DDR4-3200 MT/s Up to 4TB
  • RTX MXM A4500 GPU (5888 CUDA)
  • 2x10G (SFP+), 2x1G , 4xUSB3.0, 1xVGA, 1xCOM, 4 x DP
  • DC-IN 18V~36V

Special Request:

 

  • 2 x CAN BUS
  • AC Power In (Option)
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Technical Profile

 Appearance

 

TEC300P

 

Dimension

 

TEC300P

Specifications

System

 

CPUAmpere® Altra® MAX M128-30 SoC, 128 cores, 3.0 GHz, 95W TDP, Ampere Altra
Memory Type16 x DIMM sockets with individual memory channels

Up to 4TB (16x 256 GB) DDR4 RDIMM memory, up to 3200 MT/s

 

GPU

Graphics CardRTX MXM A4500 (5888 CUDA Cores)
 

Storage

SSDTBD
Ethernet
Ethernet2 x 1 Gigabit Ethernet with RJ45

2 x 10G SFP+

 

Side I/O

RJ45 GLAN2
10 GbE SFP+2
COM1
CAN2
USB3.04
DP4
VGA1
DC-IN1
Power Button1 x Power Button with LED backlight
 

OS support list

OSLinux RedHat ,Ubuntu
Power Requirement28V DC-IN (18V-36V)
DimensionTBD
Weight10 KG
Operating Temp.0°C to 60°C
Storage Temp.-40°C to 85°C
Relative Humidity5% to 95%, non-condensing
 

Environmental

MIL-STD-810 TestMethod 500.5, Procedures I and II (Altitude, Operation):

12,192M, (40,000 ft) for the initial cabin altitude (18.8Kpa or 2.73 Psia)

Method 500.5, Procedures III and IV (Altitude, Non-Operation):

15,240, (50,000 ft) for the initial cabin altitude (14.9Kpa or 2.16 Psia)

Method 501.5, Procedure I (Storage/High Temperature)

Method 501.5, Procedure II (Operation/High Temperature)

Method 502.5, Procedure I (Storage/Low Temperature)

Method 502.5, Procedure II (Operation/Low Temperature)

Method 503.5, Procedure I (Temperature shock)

Method 507.5, Procedure II (Temperature & Humidity)

Method 509.7 Salt Spray (50±5)g/L

Method 514.6, Vibration Category 24/Non-Operating (Category 20 & 24,Vibration)

Method 514.6, Vibration Category 20/Operating (Category 20 & 24,Vibration)

Method 516.6, Shock-Procedure V Non-Operating (Mechanical Shock)

Method 516.6, Shock-Procedure I Operating (Mechanical Shock)

ReliabilityConduction Cooling.

Designed & Manufactured using ISO 9001 Certified Quality Program.

EMCEN 61000-4-2: Air discharge: 8 kV, Contact discharge: 6kV

EN 61000-4-3: 10V/m

EN 61000-4-4: Signal and DC-Net: 1 kV

EN 61000-4-5: Leads vs. ground potential 1kV, Signal und DC-Net: 0.5 kV

Order Information

TEC300P-M128

CPUAmpere® MAX M128-30Ampere® M128-28
GPU-1MXM RTXA4500MXM RTXA4500
RAMUp to DDR4-1.5TB
USB3.04
VGA1
DP4
CAN BUS2
COM1
GLAN2
10G SFP+LAN2
PowerDC 18V~36V