TEC300

Rugged Edge MXM Computer by Ampere® Q32, Nvidia Quadro A500

 

  • Ampere® Altra® Q32-17 SoC, 32 cores, 1.7 GHz, Option Ampere Altra Q64 and Ampere Altra Max M128
  • RAM DDR4-3200 MT/s Up to 4TB
  • RTX MXM A500 GPU (2048 CUDA)
  • 2x10G(SFP), 2x1G, 3xUSB3.0, 1xVGA, 5xCOM
  • DC-IN 18V~36V

Special Request:

 

  • 2 x CAN Bus
  • AC Power In (Option)
Categories: , ,

Technical Profile

Dimension

TEC300_Dimension

Specifications

System

 

CPUAmpere® Altra® Q32 17 SoC 32 cores, 1.7 GHz, 45 W TDP, Option Ampere® Altra® Q64 and Ampere® Altra® Max M128
Memory type16x DIMM sockets with individual memory channels
Up to 4TB  (16 x 256 GB) DDR4 RDIMM memory, up to 3200 MT/s
 

GPU

Graphics CardRTX MXM A 500 (2048 CUDA Cores)
 

Storage

SSDTBD
 

Ethernet

Ethernet2x 1 Gigabit Ethernet with RJ45
2 x 10G SFP+
 

Side I/O

GLAN2
10 GbE SFP+2
COM5
USB3.03
VGA1
DC-IN1
Power Requirement1 x Power Button with LED backlight
 

OS support list

OSLinux RedHat ,Ubuntu
Power Requirement28V DC IN (18V 36V)
DimensionTBD
Weight10 KG
Operating Temp.0 C to 60°C
Storage Temp.-40°C to 85°C
Relative Humidity5% to 95%, non condensing
 

Environmental

MIL-STD-810 TestMethod 500.5, Procedures I and II (Altitude, Operation):
12,192M, (40,000 ft) for the initial cabin altitude (18.8Kpa or 2.73 Psia)
Method 500.5, Procedures III and IV (Altitude, Non-Operation):
15,240, (50,000 ft) for the initial cabin altitude (14.9Kpa or 2.16 Psia)
Method 501.5, Procedure I (Storage/High Temperature)
Method 501.5, Procedure II (Operation/High Temperature)
Method 502.5, Procedure I (Storage/Low Temperature)
Method 502.5, Procedure II (Operation/Low Temperature)
Method 503.5, Procedure I (Temperature shock)
Method 507.5, Procedure II (Temperature & Humidity)
Method 509.7 Salt Spray (50±5)g/L
Method 514.6, Vibration Category 24/Non-Operating (Category 20 & 24,Vibration)
Method 514.6, Vibration Category 20/Operating (Category 20 & 24,Vibration)
Method 516.6, Shock-Procedure V Non-Operating (Mechanical Shock)
Method 516.6, Shock-Procedure I Operating (Mechanical Shock)
ReliabilityConduction Cooling.
Designed & Manufactured using ISO 9001 Certified Quality Program.
EMCEN 61000-4-2: Air discharge: 8 kV, Contact discharge: 6kV
EN 61000-4-3: 10V/m
EN 61000-4-4: Signal and DC-Net: 1 kV
EN 61000-4-5: Leads vs. ground potential 1kV, Signal und DC-Net: 0.5 kV

Order Information

TEC300

CPUAmpere® Q32-17
GPUMXM RTX A500
RAMUp to DDR4-4TB
USB 3.04
VGA1
DP4
CAN BUS2
COM1
GLAN2
10G SFP+ LAN2

Power

DC 18V-36V

AV 100~240V