Technical Profile
Dimension
TEC300-Q64
Rugged Edge MXM Computer by Ampere® Q64-22, Nvidia Quadro A500
- Ampere® Altra® Q64-22 SoC, 64 Cores, 2.2 GHz
- RAM DDR4-3200 MT/s Up to 4TB
- RTX MXM A500 GPU (2048 CUDA)
- 2x10G(SFP), 2x1G, 3xUSB3.0, 1xVGA, 5xCOM
- DC-IN 18V~36V
Special Request:
- 2 x CAN Bus
- AC Power In (Option)
Specifications
System
| |
|---|---|
| CPU | Ampere® Altra® Q64-22 SoC, 64cores, 2.2 GHz |
| Memory type | 16x DIMM sockets with individual memory channels Up to 4TB (16 x 256 GB) DDR4 RDIMM memory, up to 3200 MT/s |
| GPU | |
| Graphics Card | RTX MXM A 500 (2048 CUDA Cores) |
| Storage | |
| SSD | TBD |
| Ethernet | |
| Ethernet | 2x 1 Gigabit Ethernet with RJ45 2 x 10G SFP+ |
| Side I/O | |
| GLAN | 2 |
| 10 GbE SFP+ | 2 |
| COM | 5 |
| USB3.0 | 3 |
| VGA | 1 |
| DC-IN | 1 |
| Power Requirement | 1 x Power Button with LED backlight |
| OS support list | |
| OS | Linux RedHat ,Ubuntu |
| Power Requirement | 28V DC IN (18V 36V) |
| Dimension | TBD |
| Weight | 10 KG |
| Operating Temp. | 0 C to 60°C |
| Storage Temp. | -40°C to 85°C |
| Relative Humidity | 5% to 95%, non condensing |
| Environmental | |
| MIL-STD-810 Test | Method 500.5, Procedures I and II (Altitude, Operation): 12,192M, (40,000 ft) for the initial cabin altitude (18.8Kpa or 2.73 Psia) Method 500.5, Procedures III and IV (Altitude, Non-Operation): 15,240, (50,000 ft) for the initial cabin altitude (14.9Kpa or 2.16 Psia) Method 501.5, Procedure I (Storage/High Temperature) Method 501.5, Procedure II (Operation/High Temperature) Method 502.5, Procedure I (Storage/Low Temperature) Method 502.5, Procedure II (Operation/Low Temperature) Method 503.5, Procedure I (Temperature shock) Method 507.5, Procedure II (Temperature & Humidity) Method 509.7 Salt Spray (50±5)g/L Method 514.6, Vibration Category 24/Non-Operating (Category 20 & 24,Vibration) Method 514.6, Vibration Category 20/Operating (Category 20 & 24,Vibration) Method 516.6, Shock-Procedure V Non-Operating (Mechanical Shock) Method 516.6, Shock-Procedure I Operating (Mechanical Shock) |
| Reliability | Conduction Cooling. Designed & Manufactured using ISO 9001 Certified Quality Program. |
| EMC | EN 61000-4-2: Air discharge: 8 kV, Contact discharge: 6kV EN 61000-4-3: 10V/m EN 61000-4-4: Signal and DC-Net: 1 kV EN 61000-4-5: Leads vs. ground potential 1kV, Signal und DC-Net: 0.5 kV |
Order Information
TEC300 | ||
| CPU | Ampere® Q64-22 | |
| GPU | MXM RTX A500 | |
| RAM | Up to DDR4-4TB | |
| USB 3.0 | 4 | |
| VGA | 1 | |
| DP | 4 | |
| CAN BUS | 2 | |
| COM | 1 | |
| GLAN | 2 | |
| 10G SFP+ LAN | 2 | |
Power | DC 18V-36V | AV 100~240V |