IP65 VMware rugged workstation with Intel® Xeon® D-1587 Processor (16 Cores), 128GB DDR4 ECC RDIMM, MIL-DTL-38999 , MIL-STD 461, MIL-STD 810 Certified

  • MIL-STD-810 Thermal, Shock, Vibration, Humidity
  • MIL-STD 461 EMI/EMC Certified
  • 16 Cores Intel® Xeon® D-1587 VMware Support
  • Rugged MIL-DTL-38999 Souriau Connector
  • Dual Removable Solid-State Disk
  • Hardware Secure Erase (AES)
  • Windows 10/Server, Linux, VMware Compatible
  • 300W, 18V~36V DC-IN MIL-STD 461 Power Supply
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Technical Profile


The SR800-X2 equipped Ultra-High Performance Intel® Xeon® D-1587 is fully qualified IP65 with D38999 connectors which can offer the highest performance capabilities and ready to handle multiple applications in harsh environments. SR800-X2 is designed to meet strict size, weight, and power (SWaP) requirements and to withstand harsh environments, including temperature extremes, shock/vibe, sand/dust, and salt/fog.
SR800-X2 is MIL-461/1275 EMI/EMC compliant  rugged workstation. It passes numerous environmental tests including Temperature, Altitude, Shock, Vibration, Voltage Spikes, Electrostatic Discharge and more. The sealed compact chassis shields circuit cards from external environmental conditions such as sand, dust, and humidity.

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Ultra-High Intel® Xeon® D Processor ( 16 Cores, 32 Threads, 24MB Cache )



Broadwell DE:

Intel® Xeon® processor D-1500 product family offers hardware and software scalability from two up to sixteen cores, making it the perfect choice for a broad range of high-performing, low-power solutions that will bring intelligence and Intel® Xeon® reliability, availability, and serviceability (RAS) to the edge.

Enhanced performance per watt:

Intel® Xeon® processor D-1500 product family delivers exceptional value and unmatched performance density per watt. Its TDP of 19W to 65W, industry-leading 14 nm process technology and a compute-only design make it ideal for meeting the diverse needs of customers seeking mid-range low-power, high-density solutions.

Enabling more IoT Use Cases:

The Intel® Xeon® processor D-1500 product Family drives a host of new IoT opportunities for a wide range of environments, while addressing real-time optimization, and workload consolidation. Its temperature rating spans from -40°C to 85°C operating ambient conditions, which establishes new possibilities for Intel® architecture in markets that require robust products, like aerospace and industrial.


Unique Features



SK711, MIL-STD 461 EMI certified power module adopted by SR800-X2 & HORUS430, supports input range from 18V to 36V. Compliant with MIL-STD 461, SK711 performs as an ideal converter module for severe environment. The Cosel Hi-Rel DC/DC CONVERTER also provides ,Output Over Current Protection (OCP), Output Overvoltage Protection (OVP) and Over Temperature Protection (OTP) to made stability and safety. Module Compliance with MIL-STD-461C/D/E Standards. Furthermore, with parallel design, two SK711 combining can generate double power of 300W, supporting prominent system performance.

SK711 is a wide input board type converter supporting input range from 18V to 36V. Possessing military standard filter for EMI avoidance, SK711 guarantees the stability of voltage and electric current for system operation, especially suitable for application in military or other harsh environment. Furthermore, with parallel design, two SK711 can be combined for double power of 300W, supporting prominent system performance. Compliant with MIL-STD 461, extended operating temperature from -40 to 85°C, SK711 performs as an ideal converter module for severe environmental usage. The Cosel Hi-Rel DC/DC CONVERTER it also provides Output Over Current Protection (OCP), Output Overvoltage Protection (OVP) and Over Temperature Protection (OTP) to made stability and safety.


Swappable CMOS Battery

Generally, to exchange the battery from a rugged solution is complicated and has the possibility to affect the original function of water and dust resistance. SR800-X2 has an easy swappable battery tray allowing users to directly replace. A coin-cell battery can be seen when pulling the tray fully out of the computer; users just need to change with CR2032 battery and push the tray back and lock screw, then the replacement is completed.





Dual Removable SSD ( Solid-state Disk )

The dual Removable SSD (Solid-state Disk) provide a compact self-contained system to store and retrieve data from ruggedized and removable 2.5” Flash Disks and have been qualified to meet the most demanding MIL-STD-810 environments. The dual Removable SSD Disk System is the perfect DTU for military, aerospace, avionics and ground vehicle systems. These systems include flight management, cockpit instrument display, terrain awareness and warning, map systems, radar systems, cockpit/ground communications, navigation positioning, and satellite communications.


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Hardware Secure Erase

Under emergency situation, when written data is required to be erased immediately, a Secure Erase Button is extremely indispensable. Instant Erase is a particular feature for SED ( Self Encryption Drive ) drive. It’s faster than Quick Erase to make all written data invalid. The encryption and decryption is controlled by an AES key on the path; once the AES key is replaced by a new one, the data becomes unrecognizable.



D38999 connectors offer the highest performance capabilities and reliability for both general duty and severe environment applications. This cylindrical connector family designed for cable-to-panel I/O applications in military, aerospace and other demanding hazardous situations. D38999 connectors are capable of operation within a temperature range -65 to 200°C. They are lightweight and can stand up to environmental challenges. Made with removable crimp or fixed hermetic solder contacts, these connectors provide high-vibration characteristics and are suitable for severe wind and moisture problem areas.


Operating Temp.


0°C to 50°C


CPUIntel® Xeon® Processor D-1587 (Frequency 1.7GHz, Turbo Boost Frequency up to 2.3GHz), 16-Core,

32 Thread Support, 24MB Smart Cache.

Build-in Turbo Boost Technology 2.0, VPro and Hyper-Threading

Memory4x DDR4 DIMMs Up to 128GB ECC RDIMM 2133MHz
ChipsetSoC, integrated with CPU


Graphics ProcessorASPEED AST2400
Display PortResolution up to 1920×1200@60Hz 32bpp


SSD/HDD2 x 2.5″ SSD


1 x Intel I350-AM2 Gigabit LAN Interfaces ( 10/100/1000Mbps )

Rear I/O

VGA1x ( M20 connector )
IPMI1x ( M20 connector )
USB3.02x ( M20 connector )
USB2.01x ( M20 connector )
X11x DC-IN ( Souriau 8ST7-10G05PN )
X51x Gigabit Ethernet ( Souriau 8ST7-10G35SA )
X61x 100M Ethernet ( Souriau 8ST7-08G35SN )
X91x RS232 ( Souriau 8ST7-10G35SB )

Side I/O

Button1x Secure Erase Button ( SSD2 support AES Secure Erase )

1x Power Switch with Dedicated LED

HDD Tray1x Dual 2.5″ HDD/SSD Easy Swap Tray
CMOS Battery Tray1x Removable CR2032 CMOS Battery Tray
Dedicated LED3x SDD LED ( Leftside x 2, Rightside x 1 )

4x Dual Color LED for 8bit GPIO ( Reserved )


Power Requirement

Power InputMIL-STD 461  power supply ,300W, 18V~36V

Applications, Operating System

ApplicationsCommercial and Military Platforms Requiring Compliance to MIL-STD-810G

Embedded Computing, Process Control, Intelligent Automation and

manufacturing applications where Harsh Temperature, Shock, Vibration, Altitude,

Dust and EMI Conditions. Used in all aspects of the military

Operating SystemWindows 10 64Bit, Windows Server 2008 R2,

Windows Server 2012 R2 Ubuntu14.04,

Fedora 20/23, RedHat Linux EL 7.1/7.2,

Vmware ESXi 6.0, ESXi 6.5



Dimension ( W x D x H )260 x 350 x 102 mm
Weight9.6 Kg (21.16lbs)
ChassisAluminum Alloy, Corrosion Resistant.
FinishAnodic aluminum oxide ( Color Iron gray )
CoolingNatural Passive Convection / Conduction. No Moving Parts
Ingress ProtectionIP65


MIL-STD-810F TestMethod 507.5, Procedure II ( Temperature & Humidity )

Method 516.6 Shock-Procedure V Non-Operating ( Mechanical Shock )

Method 516.6 Shock-Procedure I Operating ( Mechanical Shock )

Method 514.6 Vibration Category 24/Non-Operating ( Category 20 & 24, Vibration )

Method 514.6 Vibration Category 20/Operating ( Category 20 & 24, Vibration )

Method 501.5, Procedure I ( Storage/High Temperature )

Method 501.5, Procedure II ( Operation/High Temperature )

Method 502.5, Procedure I ( Storage/Low Temperature )

Method 502.5, Procedure II ( Operation/Low Temperature )

Method 503.5, Procedure I ( Temperature shock )

ReliabilityNo Moving Parts; Passive Cooling.

Designed & Manufactured using ISO 9001 / 2000 Certified Quality Program.



0°C to 50°C


-40°C to 85°C

CE102 basic curve, 10kHz – 30 MHz

RE102-4, (1.5 MHz) -30 MHz – 5 GHz

RS103, 1.5 MHz – 5 GHz, 50 V/m equal for all frequencies EN 61000-4-2: Air discharge: 8 kV,

Contact discharge: 6kV EN 61000-4-4: Signal and DC-Net: 1 kV

EN 61000-4-5: Leads vs. ground potential 1kV, Signal und DC-Net: 0.5 kV

EN 61000-4-2: Air discharge: 8 kV, Contact discharge: 6kV

EN 61000-4-4: Signal and DC-Net: 1 kV

EN 61000-4-5: Leads vs. ground potential 1kV, Signal und DC-Net: 0.5 kV

EN 61000-4-2: Air discharge: 8 kV, Contact discharge: 6kV

EN 61000-4-4: Signal and DC-Net: 1 kV

EN 61000-4-5: Leads vs. ground potential 1kV, Signal und DC-Net: 0.5 kV

EN 55022, class A

EN 61000-4-3: 10V/m

CE and FCC


The rugged MIL-STD compliant system, SR800-X2 is equipped with highly effectively heat conductive and heat convective thermal solutions to meet extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system via 8.0 mm copper heat pipes. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.

Device ModelSR800-X2
TesterRobin Chang
Test ResultPass
Test TemperatureHigh 0°C~55°C / Low -5°C~0°C
Test Time5 Hours / 1 Hour
Test StandardReference IEC60068-2
Test SoftwareBurnin test v8.1
CriteriaAfter testing, system can’t halt.


Test Configuration



CPUIntel® Xeon® Processor D-1587
Memory64GB ECC RDIMM DDR4 2133MHz in 2 sockets
LAN1Intel® i350 100M Ethernet
LAN2Intel® i350 1G Ethernet
Test SoftwareBurnin test v8.1, CPU Z-1.86, iperf, Passmark USB3.0
AS SSD Benchmark 2.0.6694, Hard Disk Sentinel 5.01
ChamberKSON THS-b4t-150
Chipeng SMO-3


Thermal Measurement

7starlake provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus 7starlake conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, 7starlake is able to analyse the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 5 hours which at each temperature point we burn in SR800-X2 for one hour, from 50°C to 85°C.



SR800-X2 CPU Performance

CPU T-J3560.285.485.786
CPU Die22.
CPU Heatsink19.546.373.179.585.8
CPU Frenquency (GHz)

Thermal Solution

 Patented Thermal Architecture

7starlake guarantees reliable and supreme solutions for industrial and military applications. All of our selected components are of authentic industrial grade, and have verified their stability and durability through a series of Wide-range Temperature tests.



Aluminum Upper Cover

7starlake’s unique high thermal conductivity enclosure is designed with high and low fin plus wave line, creating adequate airflow and increasing the surface area in contact with the cooling medium up to 30-40%.


Exclusive Aluminum Heat Spreader for 128GB RDIMM

RAM generates intense heat while the sever is operating in high speed. The aluminum heat spreader touches the RAM and the upper cover directly, efficiently dissipate heat from the heat source to the external enclosure.


SR800_MIL-STD-810F (Vibration_Shcok_Temperature)_1.pdf (1.1 MB)1.1 MB
SR800-X2_MIL-STD-461E (CE102; RE102; RS103).pdf.pdf (3.85 MB)3.85 MB