IP65 MXM-GPU Military Computer, Intel 9th Xeon E-2276ME, Quadro RTX A2000 GPU


  • IP65 MXM-GPU MIlitary Computer
  • MIL-STD 810 Thermal, shock, vibration, Humidity, EMI
  • Quadro® RTX A2000 (CUDA 2560, GDDR6-8GB) ; Options for GTX1050 Ti
  • 9th Gen Intel® Xeon E-2276ME (6C,4.5Ghz)
  • Up to DDR4-64GB, Options for DDR4-128GB
  • 9V to 36V DC, Options for MIL-STD-461 18V~36V
  • Extended operating temp. -40°C to 60°C
  • Dimension : 360 x 230 x 86 mm (WxDxH)

 Special Request :


  • Frame Grabber : 4xCH HD-SDI
  • Discrete IO : 4xDI 4xDO

Intel Gold

Technical Profile


SR700-X4 rugged system is a powerful system configured with 9th Gen Intel® Xeon® / Core ™ processor with up to 6 cores and 45W/25W TDP and chipset soldering onboard, delivering an amazing level of CPU performance.

Processor Core i7-9850HE plus Intel® CM246 chipset supports supports frequency up to 4.40GHz. SR700-X4 highlights on high flexibility with upgradeable CPU, GPU without constraining by small spaces and limited power consumption chassis.

Besides its extreme rugged design, high functionality, SR700-X4 is designed under MIL-STD-810 and IP65 protection, possessing high adaptation toward dust, humidity, shock, vibration, extreme temperatures and electromagnetic interference characteristics.

SR700-X4 is the perfect solution to military purposes, such as defense, marine navigation and aviation technology. It also can withstand and survive in the harshest surroundings with extended temperature operation from -40 to 60℃.



  • X1 : DC-IN with DTL38999 connector
  • X2 : 2 x USB2.0 with M12 connector 
  • X3 : 1 x 1GbE LAN with M12 connector 
  • X4 : 1 x 1GbE LAN with M12 connectors
  • X5 : 1 x RS232/485 with M12 connector
  • X6 : 1 x mDP with DTL38999 connector​​



Thermal Solution for Fanless System Design



The unique design of 7StarLake’s stack rack series integrate both horizontal and vertical placement. Dual-sided aluminum heat sink further secures extreme heat dissipation. 7StarLake incorporates exceptional heat radiating material with exceptional CNC cutting design. Fanless method relies heavily on the precise calculation of the efficiency of each heat dissipating component. Superior fanless design guarantees silent operation that enhances the flexibility of mobility and prevents the intrusion of dust and debris. SR700-X4 supports -40°C up to 60°C extended temperature operation, achieving ultimate reliability and stability.


Wire Rope Vibration Isolator Design for Higher Vibration Resistance

7StarLake has especially design a Wire Rope Vibration Isolator for SR700-X4. The Wire Rope Vibration Isolator may sustain higher vibration resistance of the product itself. 

A Wire Rope Vibration Isolator is widely apply on supporting Military equipment because it may absorb and protect the object from vibration damage in any axes simultaneously, with the protection it may extended the product life operating under long hour vibration environment and vibration shock. The isolator is long life maintenance free tool and it may unload whenever required. Besides, Wipe Rope Vibration Isolators may survive under extreme temperature, corrosion, radioactivity, extreme dry or high humidity and UV Radiation environment.


MIL-STD 810 Compliant & Full IP65 Anti-water / Dust Protection

SR stands for Stack & Rack, which means that our SR series systems are capable of stacking and rack mount cabinet placement. With key components such as CPU, memory, and storage devices all soldered onboard, the possible risk of damages caused by sudden impact of vibration and bumping can be diminished to the minimum. MIL-STD tests are established by the US government to simulate how materials would hold up to harsh environments. SR700-X4 is rigorously field-tested to meet or exceed MIL-STD810 & IP65 criteria for extremely high & low temperature, humidity, shock, and vibration. SR700-X4 has complete resistance to dust and water, making it even more ruggedized and reliable. SR700-X4 can stand against the intrusion of dust, accidental contact, and water. Not just commercial grade waterproof and dustproof, it can reach Dust Tight level, which guarantees complete protection against ingression. Even the strong power of water jet won’t post a threat to it, now this is true ruggedness embodied.





MIL-STD-461 is a military standard that establishes the control of electromagnetic interference (EMI) emissions and susceptibility characteristics of electronic, electrical & electromechanical equipment and subsystems for military equipment. EMI encompasses any undesired signals, “noise”, generated by electronic equipment. Keeping EMI under control is crucial for military applications, because if it’s out of control, the military will be detected by the enemy and it might cause a great loss. To design a product that meets strict requirements, engineers should possess extensive knowledge of both electrical and mechanical design to avoid unintentional generation, propagation and reception of electromagnetic energy, which may cause unwanted effects, for example, physical damage in operational equipment.



Rugged Connectors ( M12 & other MIL-STD variations )


Robust and reliable M12 connectors are implemented for SR700-X3. Compact design meets rugged capability, M12 connectors can seal the connector area securely, operation can continue uninterrupted even under the most severe conditions. What makes SR700-X3 stand out from standard commercial grade product is the fact that all the connectors can be customized to U.S. Military standard connectors (D38999 series) from the famous connector manufacturer Amphenol.


  • D38999 Series

MIL-DTL-38999 is a high-performance cylindrical connector family designed to withstand the extreme shock, exposure and vibration that are commonplace in Defense and aerospace applications. Class D38999 connectors are capable of operation within a temperature range -65 to 200℃. They are lightweight and can stand up to environmental challenges. Made with removable crimp or fixed hermetic solder contacts, these connectors provide high-vibration characteristics and are suitable for severe wind and moisture problem areas.


  • VG96912 

Derived from MIL-D38999 Series, VG96912 incorporates lightweight, scoop proof and high contact density features. The plug and receptacle bodies are manufactured from aluminum alloy and protected by cadmium or nickel plating.


System main board: OXY5741B


OXY5741B EBX SBC measures 243*146 mm, providing extraordinary computing performance under extreme environment. It is powered by 9th / 8th Gen Intel® Xeon® / Core ™. Featuring Intel’s Xeon E-2276ME and ruggedised open-standard EBX architecture, 7StarLake EBX series is built tentatively and triumphs on environmental testing. It still operates effectively under harsh environments ranging from -40°C to 85°C so that it is a perfect solution for defence, transportation, and automation applications. More key functions such as stackable PCIe/104 expansion ability, flexible I/O, and NVMe Gen 3.0 PCIex4 for fast and large capacity storage.




High Power ProcessorIntel® Core™ i7-9850HE, 45W, Coffee Lake 9th Gen, 6C, Freq. 2.7/4.4 GHz, 9M Cache,

Intel® Core™ i7-9850HL, 25W, Coffee Lake 9th Gen, 6C, Freq. 1.9/4.1 GHz, 9M Cache,

Intel® Xeon® E-2276ME, 45W, Coffee Lake 9th Gen, 6C, Freq. 2.8/4.5 GHz, 12M Cache,

Intel® Xeon® E-2276ML, 25W, Coffee Lake 9th Gen, 6C, Freq. 2.0/4.2 GHz, 12M Cache

memory type4 x DDR4 2666 MHz SO-DIMM up to 128GB
GraphicGeforce® 1050Ti CUDA 768 GDDR5-4GB

Quadro® RTX A2000 CUDA 2560 GDDR6-8GB

EthernetI219LM +3 x I210iT
Audio codecALC887
Power TypeDC-DC 9V~36V, Options for MIL-STD 461 18V~36V DC
Storage2 x SSD

Expansion slot

M.21 x M.2 (M-key, type:2280, SATA/PCIe 3.0×4 NVMe)
Mini-PCI2 x Full size (PCIe x1,USB 2.0 and micro SIM Card)

Front I/O

X1DC-IN with DTL38999 connector
X22 x USB2.0 with M12 connector
X31 x 1GbE LAN with M12 connector
X41 x 1GbE LAN with M12 connectors
X51 x RS232/485 with M12 connector
X61 x mDP with DTL38999 connector

Applications, Operating System

ApplicationsMilitary Platforms Requiring Compliance to MIL-STD-810 where Harsh Temperature, Shock, Vibration, Altitude, Dust and EMI Conditions.
Operating SystemWindows 10 32/64Bit

Ubuntu13.04, Ubuntu13.10, Ubuntu14.04, Fedora 20



Dimension360 x 230 x 86 mm (WxDxH)
Weight8.6 Kg ( 18.9 lbs )
ChassisAluminum Alloy, Corrosion Resistant
HeatsinkAluminum Alloy, Corrosion Resistant
FinishAnodic aluminum oxide ( Color Iron gray )
CoolingNatural Passive Convection/Conduction. No Moving Parts.
ConnectorsIP65 Waterproof  Connectors
Ingress ProtectionIP65


Operating Temp-40°C to 60°C
Storage Temp.-40°C to 85°C
Relative Humidity5% to 95%, non-condensing
Method 507.5, Procedure II ( Temperature & Humidity )
Method 516.6 Shock-Procedure V Non-Operating ( Mechanical Shock )
Method 516.6 Shock-Procedure I Operating ( Mechanical Shock )
Method 514.6 Vibration Category 24/Non-Operating ( Category 20 & 24, Vibration )
Method 514.6 Vibration Category 20/Operating ( Category 20 & 24, Vibration )
Method 501.5, Procedure I ( Storage/High Temperature )
Method 501.5, Procedure II ( Operation/High Temperature )
Method 502.5, Procedure I ( Storage/Low Temperature )
Method 502.5, Procedure II ( Operation/Low Temperature )
Method 503.5, Procedure I ( Temperature shock )
ReliabilityNo Moving Parts; Passive Cooling.
Designed & Manufactured using ISO 9001 / 2000 Certified Quality Program.
Green ProductRoHS, WEEE compliance

Order Information

Order Information


Model Name


SR700-X4DTXeon E-2276ML, DDR4-4GB, 128GB SSD, Geforce GTX1050Ti, 9V~36V (DTL38999)
SR700-X4DTEXeon E-2276ML, DDR4-4GB, 128GB SSD, Geforce GTX1050Ti, 18V~36V, MIL-461/1275 (DTL38999)
SR700-X4DEXeon E-2276ML, DDR4-4GB, 128GB SSD, Quadro RTXA2000, 18V~36V MIL-461/1275 (DTL38999)
SR700-X4IEi7-9850HL, DDR4-4GB, 128GB SSD, Quadro RTXA2000, 18V~36V MIL-461/1275 (DTL38999)
SR700-X4ITEi7-9850HL, DDR4-4GB, 128GB SSD, NVIDIA GTX1050Ti, 18V~36V MIL-461/1275(DTL38999)
SR700-X4ITi7-9850HL, DDR4-4GB, 128GB SSD, NVIDIA GTX1050Ti, 9V~36V (DTL38999)

Thermal Solution

Effective cooling solution for maximum heat dissipation:

7STARLAKE implements unique cooling solution with heat spreader and aluminum heat sink for maximum heat dissipation. With the aluminum heat sink enclosure allows dual-sided heat dissipation. We especially adopt the physical property of aluminum, the heat spreader touches the heat source – processor and chipset and absorbs the heat rapidly, the aluminum heat sink dissipates the heat into surrounding air promptly. With the benefits of fanless design, SR700-X4 can ensure high reliability and stability while working under wide range temperature from -40 up to 60°C.



SR200&SR700_Vibration_Test_Report_8.pdf (1.24 MB)1.24 MB
SR200_Shcok_Test Report_5.pdf (1.22 MB)1.22 MB
SFF GPU computer-series edm_1.pdf (11.42 MB)11.42 MB