SR700-X3

IP65 MXM-GPU Military Computer , Intel 7th i7-7820EQ, Quadro RTX A2000 GPU

 

  • IP65 MXM-GPU MIlitary Computer
  • MIL-STD 810 Thermal, Shock, Vibration, Humidity, EMI
  • NVIDIA® 1050Ti , Options : Quadro® RTXA2000 (2560CUDA, 8GB GDDR)
  • 7th Gen Intel® i7-7820EQ (4C,3.7Ghz)
  • Up to DDR4-32GB
  • 9V to 36V DC, Options for 18V~36V MIL-461 EMI Filter
  • Extended operating temp. -40°C to 60°C
  • Dimension : 350 x 230 x 86 mm (WxDxH)

 Special Request :

  • Frame Grabber : 4xCH HD-SDI
  • Discrete IO : 4xDI 4xDO

Intel Gold

Technical Profile

Introduction

SR700-X3 rugged system is a powerful system configured with i7 Intel® 7th Gen Core™ i7-7820EQ and chipset soldering onboard, delivering an amazing level of CPU performance.

Processor i7-7820EQ plus Intel® QM170/QM175 chipset supports clock speed 3.0GHz, up to 3.7GHz. Quad cores, turbo up to 8 cores to cope with enormous data computing. SR700-X3 highlights on high flexibility with upgradeable CPU, GPU without constraining by small spaces and limited power consumption chassis.

Besides its extreme rugged design, high functionality, SR700-X3 is designed under MIL-STD-810G and IP65 protection, possessing high adaptation toward dust, humidity, shock, vibration, extreme temperatures and electromagnetic interference characteristics.

SR700-X3 is the perfect solution to military purposes, such as defense, marine navigation and aviation technology. It also can withstand and survive in the harshest surroundings with extended temperature operation from -40 to 60℃.

SR700-X3
Thermal Solution for Fanless System Design

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The unique design of 7StarLake’s stack rack series integrate both horizontal and vertical placement. Dual-sided aluminum heat sink further secures extreme heat dissipation. 7StarLake incorporates exceptional heat radiating material with exceptional CNC cutting design. Fanless method relies heavily on the precise calculation of the efficiency of each heat dissipating component. Superior fanless design guarantees silent operation that enhances the flexibility of mobility and prevents the intrusion of dust and debris. SR700-X3 supports -40°C up to 60°C extended temperature operation, achieving ultimate reliability and stability.

 

Wire Rope Vibration Isolator Design for Higher Vibration Resistance

7StarLake has especially design a Wire Rope Vibration Isolator for SR700-X3. The Wire Rope Vibration Isolator may sustain higher vibration resistance of the product itself. 

A Wire Rope Vibration Isolator is widely apply on supporting Military equipment because it may absorb and protect the object from vibration damage in any axes simultaneously, with the protection it may extended the product life operating under long hour vibration environment and vibration shock. The isolator is long life maintenance free tool and it may unload whenever required. Besides, Wipe Rope Vibration Isolators may survive under extreme temperature, corrosion, radioactivity, extreme dry or high humidity and UV Radiation environment.

 

MIL-STD 810G Compliant & Full IP65 Anti-water / Dust Protection

SR stands for Stack & Rack, which means that our SR series systems are capable of stacking and rack mount cabinet placement. With key components such as CPU, memory, and storage devices all soldered onboard, the possible risk of damages caused by sudden impact of vibration and bumping can be diminished to the minimum. MIL-STD tests are established by the US government to simulate how materials would hold up to harsh environments. SR700-X3 is rigorously field-tested to meet or exceed MIL-STD810G & IP65 criteria for extremely high & low temperature, humidity, shock, and vibration. SR700-X3 has complete resistance to dust and water, making it even more ruggedized and reliable. SR700-X3 can stand against the intrusion of dust, accidental contact, and water. Not just commercial grade waterproof and dustproof, it can reach Dust Tight level, which guarantees complete protection against ingression. Even the strong power of water jet won’t post a threat to it, now this is true ruggedness embodied.

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MIL-STD-461

MIL-STD-461 is a military standard that establishes the control of electromagnetic interference (EMI) emissions and susceptibility characteristics of electronic, electrical & electromechanical equipment and subsystems for military equipment. EMI encompasses any undesired signals, “noise”, generated by electronic equipment. Keeping EMI under control is crucial for military applications, because if it’s out of control, the military will be detected by the enemy and it might cause a great loss. To design a product that meets strict requirements, engineers should possess extensive knowledge of both electrical and mechanical design to avoid unintentional generation, propagation and reception of electromagnetic energy, which may cause unwanted effects, for example, physical damage in operational equipment.

MIL-STD-461

Block diagram of MIL-STD-461 test configuration

 

Rugged Connectors ( M12 & other MIL-STD variations )

 

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Robust and reliable M12 connectors are implemented for SR700-X3. Compact design meets rugged capability, M12 connectors can seal the connector area securely, operation can continue uninterrupted even under the most severe conditions. What makes SR700-X3 stand out from standard commercial grade product is the fact that all the connectors can be customized to U.S. Military standard connectors (D38999 series) from the famous connector manufacturer Amphenol.

 

D38999 Series

MIL-DTL-38999 is a high-performance cylindrical connector family designed to withstand the extreme shock, exposure and vibration that are commonplace in Defense and aerospace applications. Class D38999 connectors are capable of operation within a temperature range -65 to 200℃. They are lightweight and can stand up to environmental challenges. Made with removable crimp or fixed hermetic solder contacts, these connectors provide high-vibration characteristics and are suitable for severe wind and moisture problem areas.

• VG96912 

Derived from MIL-D38999 Series, VG96912 incorporates lightweight, scoop proof and high contact density features. The plug and receptacle bodies are manufactured from aluminum alloy and protected by cadmium or nickel plating.

 

System main board: OXY5740A 

 

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OXY5740A, a powerful rugged EBX SBC is driven by Intel® 7th generation Kabylake CPU and chipset soldering onboard. Processor i7-7820EQ plus Intel® QM175 chipset supports clock speed up to 3.7GHz. Quad cores, the SBC with high computing power is capable for multi-tasking while reducing idle power consumption. In order to cater various application usages, OXY5740A integrates ample I/O interfaces on one board, reserving expansion possibility for easy system integration. For mission-critical applications, OXY5740A take advantage of key components soldered onboard and extended operating temperature from -40 to 85°C to ensure ultimate durability, utmost resistance to shock & vibration. OXY5740A is truly a rugged SBC ideal for defense, military, high-end automation and heavy-duty railway applications.

Specifications

System

 

ModelSR700-X3
CPUIntel® Core™ i7-7820EQ, 45W, Kaby Lake 7th Gen, 4C, Freq. 3.0/3.7 GHz, 8MB cache.
GPUGeforce® 1050Ti CUDA 768 GDDR5-4GB

Quadro® RTXA2000 CUDA 2560 GDDR6-8GB

MemoryUp to 32GB DDR4 SDRAM
ChipsetIntel® QM170/QM175 Chipset providing integrated USB 3.0 and supporting 7th generation Intel® Core™ processor families
Expansion Slot1 x Full-size mPCIe ( w/ SIM card supported )
1 x Full-size mPCIe ( w/ mSATA supported )
 

Display

iGPUIntel® HD Graphics 530/630
 

Storage

mSATA1 x Full-size mPCIe up to 512 GB
SATA SSD2 x 2.5″ SATA SSD
Ethernet
2 x Intel Gigabit Ethernet LAN Interfaces ( 10/100/1000Mbps )
 

Front I/O

DVI1 x Rugged M12 connector
USB1 x Rugged M12 connector ( 2 x USB 2.0 Ports )
Serial Port1 x Rugged M12 connector ( 1 x RS-232, 1 x RS-485 )
Ethernet2 x Rugged M12 connectors
DC-IN1 x Rugged M12 connector
 

Applications, Operating System

ApplicationsMilitary Platforms Requiring Compliance to MIL-STD-810 where Harsh Temperature, Shock, Vibration, Altitude, Dust and EMI Conditions.
Operating SystemWindows 10 32/64Bit
Ubuntu13.04, Ubuntu13.10, Ubuntu14.04, Fedora 20
 

Physical

Dimension350 x 230 x 86 mm (WxDxH)
Weight8.6 Kg ( 18.9 lbs )
ChassisAluminum Alloy, Corrosion Resistant.
FinishAnodic aluminum oxide ( Color Iron gray )
CoolingNatural Passive Convection/Conduction. No Moving Parts
ConnectorsDC-IN : Phoenix Contact 1424136
Ethernet : Phoenix Contact 1424177
VGA : Phoenix Contact 1441833
USB : Phoenix Contact 1424177
COM : Phoenix Contact 1441833
Ingress ProtectionIP65
 

Environmental

Operating Temp.-40°C to 60°C
Storage Temp.-40°C to 85°C
Relative Humidity5% to 95%, non-condensing
MIL-STD-810Method 507.5, Procedure II (Temperature & Humidity)
Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock)
Method 516.6 Shock-Procedure I Operating (Mechanical Shock)
Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24, Vibration)
Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration)
Method 501.5, Procedure I (Storage/High Temperature)
Method 501.5, Procedure II (Operation/High Temperature)
Method 502.5, Procedure I (Storage/Low Temperature)
Method 502.5, Procedure II (Operation/Low Temperature)
Method 503.5, Procedure I (Temperature shock)
ReliabilityNo Moving Parts; Passive Cooling.
Designed & Manufactured using ISO 9001 / 2000 Certified Quality Program.
MIL-STD-461
CE102  :   10 KHz – 10 MHz
RE102-4 : 1.5 MHz -30 MHz – 5 GHz
RS103 :    200 MHz – 3.0 GHz – 5.0 GHz, 50 V/m equal for all frequencies
Green ProductRoHS, WEEE compliance

CPU

Introduction

The rugged MIL-STD compliant system, SR700-X3 is equipped with highly effectively heat conductive and heat convective thermal solutions to meet extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system via 8.0 mm copper heat pipes. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.

 

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Device ModelSR700-X3
TesterRobin Chang
Test ResultPass
Test TemperatureHigh 0°C~60°C / Low –20°C~0°C
Test Time5 Hours / 1 Hour
Test StandardReference IEC60068-2
Test SoftwareBurnin test v6.0、
Intel Extreme Tuning Utility1
CriteriaAfter testing, system can’t halt.

 

SR700-X3 CPU i7-7820EQ- GTX1050ti – Performance

Point

25°C

50°C

CPU Load100%95%
CPU Frequency(Ghz)3.32.84
GPU Load92%99%
GPU Frequency(Ghz)1.681.29
GPU Die Temperature76℃90℃

 

Test Configuration

 

Device

Configuration

CPUIntel® Core i7-7820EQ 3.00GHz
PCHMobile Intel QM170 Express Chipset
MemorySwissbit XR-DIMM 8 GB DDR3-1600
port3 SATAIIInnodisk 256G SATA SSD
port4 SATA IIInnodisk SATAIII 128GB mSATA
PCI Express Mini CardInnodisk PCIeDOM 1ME3
LAN1Intel(R) I210 Gigabit Network Connection
LAN2Intel(R) I217-LM Ethernet Connection
Test SoftwareBurnin test v6.0、AS SSD Benchmark
Intel Extreme Tuning Utility 4.3.0.11
ChamberKSON THS-b4t-150 Chipeng SMO-3

 

Thermal Measurement

 

7STARLAKE provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus 7STARLAKE conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, 7STARLAKE is able to analyse the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 5 hours which at each temperature point we burn in SR700-X3 for one hour, from 50°C to 85°C.

 

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SR700-X3 System – IO Performance

 

Point-20°C0°C25°C55°C60°C
CPU T-J3355839599
CPU Die13.334.761.877.482.8
Heatsink-8.710.348.568.174.3
Δ1=(TJ-Die)19.720.321.217.616.2
Δ2=(Die-Sink)2224.413.39.38.5
CPU Frenquency (GHz)3.43.42.61.80.8

Thermal Solution

Effective cooling solution for maximum heat dissipation:

7STARLAKE implements unique cooling solution with heat spreader and aluminum heat sink for maximum heat dissipation. With the aluminum heat sink enclosure allows dual-sided heat dissipation. We especially adopt the physical property of aluminum, the heat spreader touches the heat source – processor and chipset and absorbs the heat rapidly, the aluminum heat sink dissipates the heat into surrounding air promptly. With the benefits of fanless design, SR700-X3 can ensure high reliability and stability while working under wide range temperature from -40 up to 60°C.

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Video

Download

AttachmentSize
SR200&SR700_Vibration_Test_Report_8.pdf (1.24 MB)1.24 MB
SR200_Shcok_Test Report_5.pdf (1.22 MB)1.22 MB
SFF GPU computer-series edm_1_0.pdf (11.42 MB)11.42 MB