SR200-X4

9th Gen Intel® Xeon Military Rugged MXM GPU Computer

 

  • MIL-STD-810 Anti- Vibration, Shock
  • Support NVIDIA Quadro RTX A2000, RTX A4500 MXM GPU
  • 9th Gen Intel® Xeon E-2276ML 25W TDP
  • 4 x DDR4 2666 MHz SODIMM up to 128 GB
  • 2 x Full size (PCIe x1 & USB 2.0)
  • M.2 2230 E key ( NVMe PCIEx4)
  • Windows 11
  • 9V to 36V DC-Input
  • Extended Temperature -40°C to 60°C

Technical Profile

Introduction

SR200-X4, EBX rugged system is a powerful system that is driven by Intel® 9th generation Coffeelake CPU and chipset soldering onboard. Processor Core i7-9850HE plus Intel® CM246 chipset supports frequency up to 4.40GHz. Apart from computing power, the system is able to survive in harsh environment from -40 to 60°C, and ruggedness for vibration and shock is proven to pass MIL-810G standard. With the combination of high CPU computing power and rich display inputs, SR200-X4 is a perfect portable solution for rugged consoles & workstations, transportation, defense control room to share instant and accurate information on huge screen for in-time solutions.

 

Thermal solution for fanless system design

7StarLake designs a unique enclosure that is able to stack together both horizontally and vertically. The aluminum heat sink enclosure allows dual-sided heat dissipation. 7StarLake exclusively adopts special heat radiating material and combining with special CNC cutting, further forged into a lavish sophisticated metal. Apart from the special heat sink enclosure, AV200-CH innovatively adopts two kinds of copper heat spreader. The shape and the size of the spreader are tailor-made based on the heat sources placement of CPU module and graphic module. In view of the gap difference between motherboard and heat sink, 7starlake builds two heat spreaders in different thicknesses. Combining all these exclusive thermal designs can alternatively replace traditional fan, and also ensures high reliability and stability while working under wide range temperature from -40°C to 50°C.

 

AV200_爆炸圖

 

7StarLake, the leading pioneer in ruggedised and embedded systems, introduces the latest EBX SBC OXY5741A. The EBX SBC measures 243*146 mm, providing extraordinary computing performance under extreme environment. It is powered by 9th / 8th Gen Intel® Xeon® / Core ™. Featuring Intel’s Xeon E-2276ML and ruggedised open-standard EBX architecture, 7STARLAKE EBX series is built tentatively and triumphs on environmental testing. It still operates effectively under harsh environments ranging from -40°C to 85°C so that it is a perfect solution for defence, transportation, and automation applications. More key functions such as stackable PCIe/104 expansion ability, flexible I/O, and NVMe Gen 3.0 PCIex4 for fast and large capacity storage, all contribute to this versatile architecture that can meet clients’ needs.

 

OXY5741A_堆疊拉線圖

 

Support OpenVINO™

The  AV200-CH is an AI hardware ready system ideal for deep learning inference computing, AV200-CH support Intel OpenVINO™ (Open Visual Inference & Neural Network Optimization),Intel® architecture-based processor (CPU) and Integrated GPU and deep learning accelerator (FPGA, Movidius™ VPU) deep learning acceleration chip to enhance vision system functions and performance. It’s also runs great with the Intel Neural Compute Stick , and helps developers to create cost-effective and robust computer vision applications. It enables deep learning inference at the edge and supports heterogeneous execution across computer vision accelerators.

OpenVINO

System main board: EBX SBC-OXY5741A

 

1. Intel® Core i7 CPU soldering onboard

AV200-CH is based on EBX SBC—OXY5741A, powered by Intel Coffee Lake-H E-2276ML quad core processor plus CM246 chipset soldered onboard. With CPU soldering onboard, there is less conduction of heat and high density interconnection between the motherboard and the components, which reduces the MB from the crisis of overheating. Apart from overheating, soldering onboard also provides the best level of shock and vibration protection, removing the unnecessary concern about poor connection that CPU socket type may bring.

 

2. Two Independent DisplayPort

AV200-CH has added on NVIDIA graphic card through PCIe/104 interface, supporting 2 independent DisplayPort which is driven by GPU RTX A4500.  itself has 5,888 CUDA Cores, representing its high computing performance and consumes power at 115W maximum. Connecting by PCIe/104 interface which enhance the resistance of shock and vibration as the connector allows nearly seamless connecting.

 

3. Wide Range DC input (Option)

For military and heavy duty vehicle applications, instable voltage always brings headaches about damaging the electric components. AV200-CH supports 9 to 36V DC-in, the flexible acceptance of inconsistent power input makes it capable of surviving tough engine cranks and transient over-voltage situations.

 

Supporting NVIDIA RTX A4500/2060S

Powered by NVIDIA, CUDA® is a parallel computing platform and programming model developed by NVIDIA for general computing on graphical processing units (GPUs). With CUDA, developers are able to dramatically speed up computing applications by harnessing the power of GPUs. In GPU-accelerated applications, the sequential part of the workload runs on the CPU – which is optimized for single-threaded performance – while the compute intensive portion of the application runs on thousands of GPU cores in parallel.

 

MXM GPU_20200624

 

Related Products

 

NVIDIA RTX A4500 MXM 3.1 Graphics Module

  • Powered by NVIDIA RTX™ A4500
  • NVIDIA CUDA technology with 5,888 Cores
  • MXM 3.1 Type B
  • Support for 4 outputs
  • 256-bit width, 8GB/16GB , GDDR6 High-Speed Memory
  • Power Consumption: 115W
RTX A4500

NVIDIA GeForce RTX2060 Super MXM 3.1 Graphics Module

  • Powered by NVIDIA GeForce® RTX 2060 Super
  • NVIDIA CUDA technology with 2,176 Cores
  • MXM 3.1 Type B
  • Support for 4 outputs
  • 256-bit width, 8GB , GDDR6 High-Speed Memory
  • Power Consumption: 175W
NVIDIA RTX2060S MXM 3.1 Graphics Module_01.jpg

Specifications

System

 

CPUIntel® Xeon E-2276ML Processor (6 Core / 12 Threads, 12M Cache, up to 4.20 GHz), 25W
Memory Type4 x SO-DIMM DDR4 2400/2666 MHz up to 128GB
ChipsetIntel® CM246 Chipset
GPUOption 1 : MXM NVIDIA® RTX™ A4500 5,888 CUDA® cores , 16GB GDDR6 memory

Option 2 : MXM NVIDIA® RTX™ A2000  2,560 CUDA® cores , 8GB GDDR6 memory

 

Display

Display PortResolution up to 4096 x 2304 60@Hz
 

Storage

M.2Up to 2TB
 

Ethernet

EthernetIntel® I210iT & I219LM GbE LAN (10/100/1000 Mbps supported ) 2 x 100Base-FX port supported
 

Front I/O

DC-INM12 Connector
USB2 x USB 3.0
Power Button1 x Power Button w/Indicator LED
 

Rear I/O

Display Port2 x DP, resolution up to 4096 x 2304
Ethernet2 x RJ45,
USB4 x USB 3.0
COM1 x 232/422/485 variable
 

Power Requirement

Power Input9V~36V DC-IN
 

Applications, Operating System

ApplicationsCommercial and Military Platforms Requiring Compliance to MIL-STD-810 where Harsh Temperature, Shock, Vibration, Altitude, Dust and EMI Conditions
OSWindows 11, Ubuntu 20.04, Fedora20
 

Physical

Dimension315 x 150 x 120 mm (W x D x H)
Weight6Kg (13.23lbs)
ChassisSECC
Heat sinkAluminum Alloy, Corrosion Resistant
FinishAnodic aluminum oxide
 

Environment

ComplianceMIL-STD-810
Temperature-40 to 60°C
Storage Temperature-40 to 70°C
Relative Humidity10% to 90%, non-condensing

Order Information

Order Information

 

SR200-X4-A20

Xeon E-2276ML, DDR4-8GB, 128GB SSD, NVIDIA MXM RTXA2000 ,9V~36V DC

 

SR200-X4-A45

Xeon E-2276ML, DDR4-8GB, 128GB SSD, NVIDIA MXM RTX A4500 , 9V~36V DC