SR200-X4, EBX rugged system is a powerful system that is driven by Intel® 9th generation Coffeelake CPU and chipset soldering onboard. Processor Core i7-9850HE plus Intel® CM246 chipset supports frequency up to 4.40GHz. Apart from computing power, the system is able to survive in harsh environment from -40 to 60°C, and ruggedness for vibration and shock is proven to pass MIL-810G standard. With the combination of high CPU computing power and rich display inputs, SR200-X4 is a perfect portable solution for rugged consoles & workstations, transportation, defense control room to share instant and accurate information on huge screen for in-time solutions.
Thermal solution for fanless system design
7StarLake designs a unique enclosure that is able to stack together both horizontally and vertically. The aluminum heat sink enclosure allows dual-sided heat dissipation. 7StarLake exclusively adopts special heat radiating material and combining with special CNC cutting, further forged into a lavish sophisticated metal. Apart from the special heat sink enclosure, AV200-CH innovatively adopts two kinds of copper heat spreader. The shape and the size of the spreader are tailor-made based on the heat sources placement of CPU module and graphic module. In view of the gap difference between motherboard and heat sink, 7starlake builds two heat spreaders in different thicknesses. Combining all these exclusive thermal designs can alternatively replace traditional fan, and also ensures high reliability and stability while working under wide range temperature from -40°C to 50°C.
7StarLake, the leading pioneer in ruggedised and embedded systems, introduces the latest EBX SBC OXY5741A. The EBX SBC measures 243*146 mm, providing extraordinary computing performance under extreme environment. It is powered by 9th / 8th Gen Intel® Xeon® / Core ™. Featuring Intel’s Xeon E-2276ML and ruggedised open-standard EBX architecture, 7STARLAKE EBX series is built tentatively and triumphs on environmental testing. It still operates effectively under harsh environments ranging from -40°C to 85°C so that it is a perfect solution for defence, transportation, and automation applications. More key functions such as stackable PCIe/104 expansion ability, flexible I/O, and NVMe Gen 3.0 PCIex4 for fast and large capacity storage, all contribute to this versatile architecture that can meet clients’ needs.
The AV200-CH is an AI hardware ready system ideal for deep learning inference computing, AV200-CH support Intel OpenVINO™ (Open Visual Inference & Neural Network Optimization),Intel® architecture-based processor (CPU) and Integrated GPU and deep learning accelerator (FPGA, Movidius™ VPU) deep learning acceleration chip to enhance vision system functions and performance. It’s also runs great with the Intel Neural Compute Stick , and helps developers to create cost-effective and robust computer vision applications. It enables deep learning inference at the edge and supports heterogeneous execution across computer vision accelerators.