SR200-SG

MIL-STD Rugged  GPU Computer supporting 75W nVidia® GPU & Intel® Core™ i7-4700EQ Haswell Processor, NVIDIA®1050Ti CUDA 768 GDDR5-4GB/Quadro® P3000 CUDA1280 GDDR5-6GB/Quadro® RTX3000 CUDA 1920 GDDR6-6GB GPU, 6 Independent Display Port, 9V~36V DC-IN, Extended Temp. -40°C to 60°C

 

  • Intel® Haswell  i7-4700EQ + Intel QM87 PCH(2.4GHz, 4C, 47W)
  • NVIDIA®1050Ti CUDA 768 GDDR5-4GB/Quadro® P3000 CUDA1280 GDDR5-6GB/Quadro® RTX3000 CUDA 1920 GDDR6-6GB GPU
  • DDR3 XR-DIMM up to 8GB memory
  • Onboard SATAIII NAND Drive up to 64GB
  • 6x independent DisplayPort
  • 2x mPCIe expansion slot (one co-lay with mSATA)
  • 9V~36V DC-IN with power delay on/off
  • Wide operating temperature. -40°C to 60°C

Intel Gold

Technical Profile

Introduction

SR200-SG, EBX rugged system is a powerful system that is driven by Intel® 4th generation Haswell CPU and chipset soldering onboard, integrated with Nvidia®1050Ti CUDA 768 GDDR5-4GB/GTX 1650 CUDA896 GDDR5-4GB/GTX 1660S CUDA1408 GDDR6-6GB GPU that supports 4 independent DisplayPort. Processor i7-4700EQ plus Intel® QM87 chipset supports clock speed 2.4GHz, up to 3.4GHz. Quad cores, turbo up to 8 cores to cope with enormous data computing. Apart from computing power, the system is able to survive in harsh environment from -20°C to 60°C, and ruggedness for vibration and shock is proven to pass MIL-810G standard. With the combination of high CPU computing power and rich display inputs, SR200-SG is a perfect portable solution for rugged consoles & workstations, transportation, defense control room to share instant and accurate information on huge screen for in-time solutions.

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Thermal solution for fanless system design

 

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7starlake designs a unique enclosure that is able to stack together both horizontally and vertically. The aluminum heat sink enclosure allows dual-sided heat dissipation. 7starlake exclusively adopts special heat radiating material and combining with special CNC cutting, further forged into a lavish sophisticated metal. Apart from the special heat sink enclosure, SR200-SG innovatively adopts two kinds of copper heat spreader. The shape and the size of the spreader are tailor-made based on the heat sources placement of CPU module and graphic module. In view of the gap difference between motherboard and heat sink, 7starlake builds two heat spreaders in different thicknesses. Combining all these exclusive thermal designs can alternatively replace traditional fan, and also ensures high reliability and stability while working under wide range temperature from -20 up to

 

Stunning resistance of shock and vibration

PERFESR200-SG stands for Stack & Rack which represents that SR200-SG can be stackable and be racked in cabinet. Moreover, SR200-SG has key components soldered onboard to eliminate risk of harm caused by vibration. It not only supports Intel CPU onboard but also memory and storage onboard which drastically enhance the resistance of vibration and shock. It is worth noting that NVIDIA graphic module is connected by PCIe/104 connector, instead of using PCIe x16. When stacking together, the PCIe/104 connector delivers exceeding solidity due to the four corner mounting holes and the three bank(156-pin). It removes the concern about loosen connection caused by shock & vibration. Combining critical components soldering onboard and solid PCIe/104 connection, it is also compliant to MIL-STD 810G standard, can withstand 5g vibration, 100g single shocks and 50g multiple shocks.

 

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System main board: EBX SBC-OXY5737A

 

1. Intel® Core i7 CPU soldering onboard

SR200-SG is based on EBX SBC—OXY5737A, powered by Intel Ivy Bridge i7-4700EQ quad core processor plus QM87 chipset soldered onboard. With CPU soldering onboard, there is less conduction of heat and high density interconnection between the motherboard and the components, which reduces the MB from the crisis of overheating. Apart from overheating, soldering onboard also provides the best level of shock and vibration protection, removing the unnecessary concern about poor connection that CPU socket type may bring.

 

2. Four Independent DisplayPort

SR200-SG has added on NVIDIA graphic card through PCIe/104 interface, supporting 4 independent DisplayPort which is driven by GPU NVIDIA®1050Ti CUDA 765 GDDR5-4GB/GTX 1650 CUDA896 GDDR5-4GB/GTX 1660S CUDA1408 GDDR6-6GB GPU. Representing its high computing performance and consumes power at 35W maximum. Connecting by PCIe/104 interface which enhance the resistance of shock and vibration as the connector allows nearly seamless connecting.

 

3. Wide Range DC input

For military and heavy duty vehicle applications, instable voltage always brings headaches about damaging the electric components. SR200-SG supports 9V to 36V DC-in, the flexible acceptance of inconsistent power input makes it capable of surviving tough engine cranks and transient over-voltage situations.

Specifications

Operating Temp.

 

-20°C to 60°C
 

System

CPUIntel® Core™ i7 Haswell , BGA type
Intel® Core i7-4700EQ, 2.4/3.4 GHz, 4C, 6M Cache, TDP 47W
GPUNVIDIA® 1050Ti CUDA 768 GDDR5-4GB

Quadro® P3000 CUDA 1280 GDDR5-6GB

Quadro® RTX3000 CUDA 1920 GDDR6-6GB

ChipsetIntel® QM87 Chipset (Intel® DH82QM87 PCH)
Memory Type1x DDR3 XR-DIMM 1600MHz, up to 8 GB with ECC
Expansion Slot2x mPCIe (1x colay with mSATA) for GEN2
Storage DeviceOnboard uSSD SATAIII up to 64 GB
Ethernet ChipsetIntel® I210IT & I217LM GbE
 

Front I/O

Power Button1x with backlight
Power LED1x
HDD LED1x
LAN LED2x
USB2x USB 3.0
Display Port4x support by MXM Graphic card
POWER1x Terminal Block
 

Rear I/O

Ethernet2x RJ45 ports
Audio1x MIC, 1x Line out
COM1x RS-232/422/485 with 5V/12V selectable
Serial Signals
RS232: DCD-, RXD, TXD, DTR-, GND, DSR-, RTS-, CTS-
RS422: TX-, RX+, TX+, RX-, GND
RS485- 4W: TxD+, TxD-, RxD+, RxD-, GND
RS485- 2W: DATA-, DATA+, GND
USB2x USB 3.0
Display Port2x support by Intel QM87 chipset
 

Display

Display Resolution6x DP Up to 3840 x 2160
GPUMXM Type A Graphic Card
NVIDIA@ GTX950M (Optional: AMD E8860)
(embedded on PCIe/104 form factor)
 

OS support list

WindowsWindows 8 x32/x64、Windows 8.1 x32/x64、Windows 10 x32/x64
LinuxFedora 20、Ubuntu 13.04、Ubuntu 13.10、Ubuntu 14.04
 

Mechanical and Environment

Power Requirement9V~36V DC-IN, AT/ATX mode with power delay on/off
Dimension308 x 149 x 76 mm
Weight4.30 Kg (9.47 lbs)
Operating Temp.-20°C to 60°C(ambient with air flow)
Storage Temp.-40°C to 85°C
Relative Humidity5% to 95%, non-condensing
 

Test Standard

MIL-STD-810G TestMethod 507.5, Procedure II (Temperature & Humidity)
Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock)
Method 516.6 Shock-Procedure I Operating (Mechanical Shock)
Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24, Vibration)
Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration)
Method 501.5, Procedure I (Storage/High Temperature)
Method 501.5, Procedure II (Operation/High Temperature)
Method 502.5, Procedure I (Storage/Low Temperature)
Method 502.5, Procedure II (Operation/Low Temperature)
Method 503.5, Procedure I (Temperature shock)
EMCCE and FCC certificated
Green ProductRoHS, WEEE compliance

CPU

The SR200-SG offers highly effectively heat conductive and heat convective thermal solutions to meet the demands of customers’ extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.

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Device ModelSR200-SG
TesterRobin Chang
Test ResultPass
Test TemperatureHigh 0~60°C / Low -20~0°C
Test Time11.5Hours / 1.5Hours
Test StandardReference IEC60068-2
Test SoftwareBurnin test v6.0
CriteriaAfter testing, system can’t halt.

 

 

Thermal Solution

Elaborate thermal design

For intellectual video wall and defense control room applications, the system is always working 24/7 nonstop operation which makes the system always keeps at high temperatures. Therefore the importance of extended operating temperature is undoubted. 7starlake experts develop a brand new thermal design which involves segmentation type thermal design, integrating solidly with heat pipe, heat spreader and heat sink which allows SR200-SG to survive from -20 to +60°C. The thermal solution flexibly maximize the metal characteristic, using copper heat spreader to absorb heat directly from heat sources, then using heat pipe to transfer heat to aluminum heat sink. The copper heat pipe is the key factor among the whole thermal design. The heat conductivity coefficient of heat pipe can be up to 5000, nearly 12 times better than copper heat spreader. With a perfect combination of copper plus aluminum thermal kit which efficiently manage the heat dissipation up to 60°C.

 

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Patent Designed Heat Sink

The heat sink is made by heat radiating material which is also combining with special CNC cutting, further forged into high efficient heat dissipation metal.

96 % of aluminum, 21 mm height and weighs 1.3 kg The volume is nearly 19% larger than SR100, which is used to dissipate the heat generated from SK220

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Copper Heat Pipe

The heat pipes are embedded in the heat sink to ensure 100% tight integration for efficient dissipation. Heat pipe transfers heat from the heat sources to the heat sink over relatively long distance. Two-phase heat transfer involves the liquid-vapor phase change of a working fluid.

2 heat pipes of 8.0 mm width diameter, and 225mm length; each contains 56-61% purity of copper. U shape design reach the utmost efficiency. High heat conductivity coefficient up to 5000

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Copper Heat Spreader for Graphic Card

The copper heat spreader directly touches heat sources from GPU-GTX950M.

99.9 % purity of copper, weighs 180 g and consumes 30 cm2 9.0 mm height to fulfill the gap between graphic card and heat sink enclosure Nickel plated to prevent corrosion and rust after long-term use Tailor-made three bulges on heat spreader correspond to the placement of two chokes and GPU on SK220 graphic card.

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SK220 with MXM Graphic Card

NVIDIA® GTX950M StackPC/PCIe104 Graphic Module

PCIe/104(StackPC) carrier module is designed to offer up to 6 independent displays by MXM interface under extended temperature from -40°C ~ 85°C. SK220 is equipped with 6 x miniDP, 1 x VGA (2 x 5 pin header) which can support most MXM graphic cards from NVIDIA.

 

Copper Heat Spreader for Overall System

The copper heat spreader directly touches heat source which is generated from power voltage transferring.

99.9 % purity of copper, weighs 470 g and consumes 113.9 cm2 15.5 mm height to fulfill the gap between motherboard and heat sink. The tailor made design help to transfer the heat directly to uppers aluminum heat sink.

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CPU Host Board-OXY5737A

7starlake QM87 EBX SBC is installed in the middle of the system as a cutoff point, dividing segmentation type thermal design into upper and lower module. Upper thermal module is applied to cool down the heat generated from graphic card; while the lower thermal module is applied to cool down the heat from CPU module.

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Copper Heat Spreader for CPU

The copper heat spreader directly touches heat sources from CPU and chipset.

99.9 % purity of copper, weighs 80 g and consumes 36 cm2 3.4 mm height to fulfill the gap between OXY5737A and heat sink enclosure Nickel plated to prevent corrosion and rust after long-term use Tailor-made two bulges on heat spreader correspond to the placement of CPU and chipset on OXY5737A.

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Video

Download

AttachmentSize
SR200&SR700_Vibration_Test_Report_5.pdf (1.24 MB)1.24 MB
SR200_CE_Verification_ Of_Compliance_0.pdf (721.5 KB)721.5 KB
SR200_FCC_Verification_ Of_Compliance_0.pdf (363.65 KB)363.65 KB
SR200_Shcok_Test Report_7.pdf (1.22 MB)1.22 MB