Intel® QM87 MIL-STD Fanless Rugged System with Intel® Core™ i7-4700EQ Haswell Processor, M12 connectors, 9V~36V DC-IN, Wide Temp. -40°C to 70°C


  • Core-i7-4700EQ
  • DDR3 XR-DIMM up to 8GB
  • mSATA Up to 512GB SSD
  • 3x Displays by 2x DP, 1x DVI-I
  • 2x RJ45 Ethernet Ports
  • 2x LAN ports by M12 connector
  • 4x USB 3.0, 1x COM port
  • 9V~36V DC-IN with M12
  • Operating : -40°C to 70°C

Intel Gold

Technical Profile


SR10M based on EBX form factor, which is powered by Intel® Haswell QM87 chipset, 4th generation Core™ i7/i5/i3 processor onboard, with Swissbit XR-DIMM up to 8GB. SR10M is design for reliability under demanding MIL-SID810G, it can operate effectively in harsh environment under temp range from -40°C to 70°C and is a perfect solution for military, transportation, factory automation and digital signage applications. SR10M with its feature have heavy-duty fully IP54 Rugged aluminum chassis with M12 connectors. Supports rich I/O : 4xUSB 3.0, 1xCOM, 4x LAN – 2 by M12 Rugged connector and 3 lockable video outputs.


MIL-STD-810G standard and Conduction Cooling Design


SR10M – an ultra slim size, which is a compact capable military grade fanless system. With dimension 262x 149x 76mm, SR10M is superior in its compact yet durable exterior design and highly functional interior structure, which allow system to apply in any limited space application usage. SR10M with its feature have heavy-duty fully IP54 Rugged aluminum chassis with M12 connectors. Supports rich I/O : 4xUSB 3.0, 1xCOM, 4x LAN – 2 by M12 Rugged connector and 3 lockable video outputs.

SR10M is designed to meet MIL-STD-810G standard for shock, vibration, humidity/ EMI/EMC conditions. MIL-STD-810G standard is considered the upmost principle, which guarantees the system achieves superior quality and stability when operate under extreme harsh environment. Moreover, SR10M designed with EBX form factor and stackable ability, 7starlake have conducted the test with series of testing procedures for resistance to shock, vibration, dust, humidity, and extreme temperatures. Besides, featuring cold plate thermal design and conduction cooling, within all the benefits of fanless design, SR10M can ensure high reliability and stability while working under wide range temperature from -40°C to 70°C.


System main board: EBX SBC-OXY5737A

1. Intel® Core i7 CPU soldering onboard

OXY5737A is based on EBX rugged single board computer, powered by Intel Ivy Bridge i7-4700EQ quad core processor plus QM87 chipset soldered onboard. With processor soldering on board can enhance the resistance of shock and vibration to allow product operates under every possible condition. With processor solder on board would lower resistance and inductance at the connection enhance effective transmission that could guarantee better and more high frequency performance for the system.


2. Wide range DC input from 9V~ 36V

For certain application such like transportation and military always challenge the risk of unstable power that might cause damage to the system. Wide range DC input becomes an indispensable element for those applications. SR10A supports Wide range 9V~ 36V DC-in to protect system from damage caused by sudden surge or peak voltage. This feature guarantees the system increasing migration path flexible and eliminates redesign of existing power architecture.


Operating Temp.


-40°C to 70°C


CPUIntel® Core™ i7 Haswell , BGA type
Intel® Core i7-4700EQ, 2,4/3.4 GHz, 4C, 8T, 6MB Cache, TDP 47W
ChipsetIntel® QM87 Chipset (Intel® DH82QM87 PCH)
Memory Type1x DDR3 1600 XR-DIMM up to 8 GB with ECC
Expansion Slot1x mPCIe (colay with mSATA) for GEN2
Storage DevicemSATA up to 512 GB
Ethernet Chipset2x RJ45 : Intel® I210IT & i217LM GbE , 2x M12 : Intel® I210IT

Front I/O

Power Button1x with cover
Power LED1x
USB2x USB 3.0

Rear I/O

Power Input1x 4 pin X-code M12 connector
Display Port2x
Ethernet2x RJ45
2x 8 pin A-code M12 connector
Audio1x Mic-in, 1x Line-out
COM1x RS-232/422/485 ports, Jumper-selectable
Serial Signals
RS422: TX-, RX+, TX+, RX-, GND
RS485- 4W: TxD+, TxD-, RxD+, RxD-, GND
RS485- 2W: DATA-, DATA+, GND
USB2x USB 3.0


Display Interface1x DVI-I connectors(female); resolution up to 1920 x 1200@60 Hz;
2x  Display port connectors (female); resolution up to 3840 x 2160@60 Hz
Graphics ControllerOnboard Intel® HD 4600 graphics

OS support list

WindowsWindows 7 x32/x64、Windows 8 x32/x64、Windows 8.1 x32/x64、Windows 10 x32/x64
LinuxFedora 20、Ubuntu 13.04、Ubuntu 13.10、Ubuntu 14.04

Mechanical and Environment

Power Requirement9V~36V DC-IN, AT/ATX mode with power delay on
Dimension262 x 149 x 76mm
Weight2.98 Kg (6.57 lbs)
Operating Temp.-40°C to 70°C (ambient with air flow)
Storage Temp.-40°C to 85°C
Relative Humidity5% to 95%, non-condensing

Test Standard

MIL-STD-810G TestMethod 507.5, Procedure II (Temperature & Humidity)
Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock)
Method 516.6 Shock-Procedure I Operating (Mechanical Shock)
Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24, Vibration)
Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration)
Method 501.5, Procedure I (Storage/High Temperature)
Method 501.5, Procedure II (Operation/High Temperature)
Method 502.5, Procedure I (Storage/Low Temperature)
Method 502.5, Procedure II (Operation/Low Temperature)
Method 503.5, Procedure I (Temperature shock)
EMCCE and FCC certificated
Green ProductRoHS, WEEE compliance


The SR10M offers highly effectively heat conductive and heat convective thermal solutions to meet the demands of customers’ extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.




Device ModelSR10M
TesterRobin Chang
Test ResultPass
Test TemperatureHigh 0°C~70°C / Low -40°C~0°C
Test Time15 Hours / 3 Hours
Test StandardReference IEC60068-2
Test SoftwareBurnin test v6.0
CriteriaAfter testing, system can’t halt.


Test Configuration



CPU TypeIntel® Core i7-4700EQ 2.4GHz
Memory1 x DDR3 1600 XR-DIMM up to 8GB ECC
GraphicIntel® HD 4600
LAN1Intel® I217 GbE LAN
LAN2Intel® I210 GbE LAN
SoftwareBurnin test v6.0、AS SSD、 Intel Extreme Tuning Utility、
iperf GPU-Z、FurMark v1.9.2
ChamberKSON THS-b4t-150 Chipeng SMO-3


Thermal Measurement

7starlake provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus 7starlake conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, 7starlake is able to analyses the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 12.5 hours which at each temperature point we burn in SR10M for two hour, from 40°C to 70°C.


SR10M – IO Performance

CPU T-J22098100100100100100100100
CPU Die-9.78.581.584.292.193.595.597.397.7100.6
CPU Frenquency (GHz)2.792.792.692.592.492.192.001.701.200.90


Thermal Solution

Effective cooling solution for maximum heat dissipation:

7starlake implements unique cooling solution with copper heat spreader, pure copper heat pipe, aluminum heat sink and cold plate for maximum heat dissipation. With the aluminum heat sink enclosure allows dual-sided heat dissipation. We especially adopt the physical property of copper and aluminum, the copper heat spreader touches the heat source – processor and chipset and absorbs the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid, the aluminum heat sink dissipates the heat into surrounding air promptly. With the benefits of fanless design, SR10A can ensure high reliability and stability while working under wide range temperature from -40°C to 70°C.


Patent Designed Aluminum Heat Sink

The heat sink is made by heat radiating material, which is aim to lowering the temperature by dissipating heat into the surrounding air. 96 % of aluminum, 21 mm height and weighs 1039 g


CPU Host Board-OXY5737A

7starlake QM87 EBX SBC is installed in the middle of the system as a cutoff point, dividing segmentation type thermal design into upper and lower module. Upper thermal module is applied to cool down the heat generated from graphic card; while the lower thermal module is applied to cool down the heat from CPU module.


M12 Rugged Military Grade Connectors

SR10M provides 2 x LAN by rugged M12 type connectors. A power button by hand Screw type cover is also incorporated for rugged level enhancement.


Cold Plate Cooler

The direct contact allows the heat to be efficiently conducted to the thermoelectric (Peltier) modules. This not only keeps the system operating efficiently and also improves the stability of thermal resistance.


Pure Copper Heat Pipe

The heat pipes are embedded in the heat sink to ensure 100% tight integration for superior heat dissipation. Especially adopts U shape copper heat pipe to fulfill utmost thermal conductivity, copper heat pipe transfers heat from the heat sources (e.g. CPU, chipset) to the heat sink over relatively long distance. Two-phase heat transfer involves the liquid-vapor phase change of a working fluid.

• 8.0 mm diameter heat pipe, 225 mm length of each heat pipe, 99.9% purity of copper
• High heat conductivity coefficient up to 5000​​​​



SR10_Vibration_Test_0.pdf (1.19 MB)1.19 MB
SR10_Shock_Test_0.pdf (1.19 MB)1.19 MB