SR10B

8x D1 Video Frame Grabber Military Computer , MIL-STD Fanless Rugged Vibration Proof System with Intel® Core™ i7-4700EQ, Haswell Processor, SSD easy swap cage, 9V~36V DC-IN, Extended Temp. -40°C to 70°C

 

  • 8x D1 Video Frame Grabber (Optional)
  • Intel® Core™ i7-4700EQ, 2,4/3.4 GHz, 4C, 8T, 6MB Cache, TDP 47W
  • DDR3 XR-DIMM Up to 8GB
  • mSATA Up to 512GB
  • Multi-Displays: 2x DP, 1x DVI-I
  • 1x mPCIe Expansion slot
  • 4x Intel® Gigabit Ethernet
  • 4x USB 3.0, 4x COM ports (2x RS232/422/485, 2x RS232)
  • 9V~36V DC-IN with power delay on/off
  • Extended Temperature -40°C to 70°C
  • Optional unique accessory bumper design for vibration resistance

Intel Gold

Technical Profile

Introduction

The SR10B based on Intel® Haswell QM87 chipset, is powered by Intel® 4th generation Core™ i7/i5/i3 processor onboard. The SR10B can operate effectively in harsh environment under temp range from -40°C to 70°C and is a perfect solution for military, transportation, factory automation and digital signage applications. SR10B is based on EBX form factor, Swissbit XR-DIMM up to 8GB. It supports triple-display, 2 DP and 1 DVI-I, 4 GIGA LAN port, 4 USB 3.0 and 4 COM port. SR10B supplies wide power voltage from 9 to 36V DC-in.

 

Frame Grabber Card (Analog to Digital / PAL )

Frame grabbers may be used in military applications. For instance, when a potential breach of abnormal signal is detected, a frame grabber captures an image or a sequence of images in digital form, and then transmits the data to pilots or command control center.  SR10B support frame grabber cards expansion to be better process data promptly to meet front line needs, to collect useful images and help pilots to react promptly on the ever-changing battlefield.

 

Digital HD-SDI video input

1CH, Mini PCIe HW encode video capture card

 

AMP nanoVTV-EXT_0_2.png

 

Analogic PAL video input

4CH, Mini PCIe Video Capture Card

 

C351W_1_2_1.png

 

Analogic PAL video output

1CH, Scan Converter Board

 

CM313B_3_0_0.png

 

Unique Features

 

http://7starlake.dev.zhelang.com.tw/sites/default/files/inline-images/NEW_STYLE_products_SR10A_03_3.jpg

 

MIL-STD-810G standard designed for shock and vibration

SR10B is designed to meet MIL-STD-810G standard for shock and vibration. MIL-STD-810G standard is considered the upmost principle, which guarantees the system achieves superior quality and stability when operate under extreme harsh environment. We have conducted the test with series of testing procedures for resistance to shock, vibration, dust, humidity, and extreme temperatures. What’s more to make the system more rugged is SR10B designed with EBX form factor and stackable ability. With those two features can provide maximum exceeding solidity when stacking together to prevent loose from vibration. With key components- CPU and SSD soldering on board to enhance the capability of shock and vibration. With unique Wipe Rope Vibration Isolator design, the level of vibration resistance increased.

 

Wire Rope Vibration Isolator Design for Higher Vibration Resistance

7starlake has especially design a Wire Rope Vibration Isolator for SR10B. The Wire Rope Vibration Isolator may sustain higher vibration resistance of the product itself. 

A Wire Rope Vibration Isolator is widely apply on supporting Military equipment because it may absorb and protect the object from vibration damage in any axes simultaneously, with the protection it may extended the product life operating under long hour vibration environment and vibration shock. The isolator is long life maintenance free tool and it may unload whenever required. Besides, Wipe Rope Vibration Isolators may survive under extreme temperature, corrosion, radioactivity, extreme dry or high humidity and UV Radiation environment.

 

System Main Board

 

http://7starlake.dev.zhelang.com.tw/sites/default/files/inline-images/New-product-page_new_03_02.jpg

1. Intel® Core i7 CPU soldering onboard

OXY5737A is based on EBX rugged single board computer, powered by Intel Ivy Bridge i7-4700EQ quad core processor plus QM87 chipset soldered onboard. With processor soldering on board can enhance the resistance of shock and vibration to allow product operates under every possible condition. With processor solder on board would lower resistance and inductance at the connection enhance effective transmission that could guarantee better and more high frequency performance for the system.

 

2. 2.5″ SATA Easy Storage Accessible Tray

Easy Storage Accessible tray allow customer to access the Storage without disassemble the system. It may let the user remove, replace and carry out the HDD easily. With this feature, SR10 may widely apply in surveillance, data storage and infotaiment purpose due to occasionally or daily storage reload is required.

 

3. Wide range DC input from 9V~ 36V

For certain application such like transportation and military always challenge the risk of unstable power that might cause damage to the system. Wide range DC input becomes an indispensable element for those applications. SR10B supports Wide range 9V~ 36V DC-in to protect system from damage caused by sudden surge or peak voltage. This feature guarantees the system increasing migration path flexible and eliminates redesign of existing power architecture.

Specifications

Operating Temp.

 

-40°C to 70°C
 

System

CPUIntel® Core™ i7 Haswell , BGA type
Intel® Core i7-4700EQ, 2,4/3.4 GHz, 4C, 8T, 6MB Cache, TDP 47W
ChipsetIntel® QM87 Chipset (Intel® DH82QM87 PCH)
Memory Type1x DDR3 1600 XR-DIMM up to 8 GB with ECC
Expansion Slot2x mPCIe (1x colay with mSATA) for GEN2
Storage Device1x mSATA up to 512GB
1x Easy Swap 2.5″ Cage
Ethernet ChipsetIntel® I210IT & i217LM GbE
 

Front I/O

Power Button1x with backlight
Power LED1x
HDD LED1x
LAN LED2x
USB2x USB 3.0
COM2x RS232
Serial Signals
RS232: DCD-, RXD, TXD, DTR-, GND, DSR-, RTS-, CTS-
POWER1x Terminal Block
 

Rear I/O

Display Port2x
DVI1x DVI-I connector (female)
Ethernet4x RJ45 ports
COM2x RS-232/422/485 ports, Jumper-selectable
Serial Signals
RS232: DCD-, RXD, TXD, DTR-, GND, DSR-, RTS-, CTS-
RS422: TX-, RX+, TX+, RX-, GND
RS485- 4W: TxD+, TxD-, RxD+, RxD-, GND
RS485- 2W: DATA-, DATA+, GND
USB2x USB 3.0
 

Display

Display Interface1x DVI-I connectors(female); resolution up to 1920 x 1200@60 Hz;
2x DisplayPort connectors (female); resolution up to 3840 x 2160@60 Hz
Graphics ControllerOnboard Intel® HD 4600 graphics
 

OS support list

WindowsWindows 8 x32/x64, Windows 10 x32/x64
LinuxFedora 20、Ubuntu 13.04、Ubuntu 13.10、Ubuntu 14.04
 

Mechanical and Environment

Power Requirement9V~36V DC-IN, AT/ATX mode with power delay on/off
Dimension250 x 149 x 69 mm
Weight4.11 Kg (9.05lbs)
Operating Temp.-40°C to 70°C(ambient with air flow)
Storage Temp.-40°C to 85°C
Relative Humidity5% to 95%, non-condensing
 

Test Standard

MIL-STD-810G TestMethod 507.5, Procedure II (Temperature & Humidity)
Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock)
Method 516.6 Shock-Procedure I Operating (Mechanical Shock)
Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24, Vibration)
Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration)
Method 501.5, Procedure I (Storage/High Temperature)
Method 501.5, Procedure II (Operation/High Temperature)
Method 502.5, Procedure I (Storage/Low Temperature)
Method 502.5, Procedure II (Operation/Low Temperature)
Method 503.5, Procedure I (Temperature shock)
EMCCE and FCC certificated
Green ProductRoHS, WEEE compliance

CPU

The rugged MIL-STD compliant system, SR10B is equipped with highly effectively heat conductive and heat convective thermal solutions to meet extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system via 8.0 mm copper heat pipes. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.

 

SR10B

 

Device Model

SR10B

TesterIan Huang
Test ResultPass
Test TemperatureHigh 0°C~70°C / Low -40°C~0°C
Test Time8 Hours / 3 Hours
Test StandardReference IEC60068-2
Test SoftwareBurnin test v7.1、
Crystal DiskMARK3.03,
Intel Extreme Tuning Utility1
CriteriaAfter testing, system can’t halt.

 

Test Configuration

 

Device

Configuration

CPUIntel® Core i7-4700EQ (4C x 2.4Ghz),
6M Cache (47W)
PCHIntel®QM87
Memory8GB DDR3 1600 MHz XR DIMM
onboard SSDApacer 64G SATA SSD
mSATA PORTInnodisk 256GB mSATA
SoftwareBurnin test v7.1、
Crystal DiskMARK3.03,
Intel Extreme Tuning Utility1
ChamberKSON THS-b4t-150 Chipeng SMO-3

 

Thermal Measurement

 

7starlake provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus 7starlake conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, 7starlake is able to analyse the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 5 hours which at each temperature point we burn in SR10A for one hour, from 50°C to 85°C.

 

SR10-01B – IO Performance

 

Point

-40°C

-20°C

25°C

40°C

45°C

50°C

55°C

60°C

65°C

70°C

CPU T-J02198100100100100100100100
CPU Die-17.37.481.584.292.193.595.597.397.7100.6
Heatsink-36.9-16.161.364.369.472.476.279.883.587.2
Δ1=(TJ-Die)17.313.616.515.87.96.54.52.72.3-0.6
Δ2=(Die-Sink)19.623.520.219.922.721.119.317.514.213.4
CPU Frenquency (GHz)2.792.792.692.592.492.19z2.001.701.200.90

Thermal Solution

Effective cooling solution for maximum heat dissipation

 

7starlake implements unique cooling solution with copper heat spreader, pure copper heat pipe and aluminum heat sink for maximum heat dissipation. With the aluminum heat sink enclosure allows dual-sided heat dissipation. We especially adopt the physical property of copper and aluminum, the copper heat spreader touches the heat source – processor and chipset and absorbs the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid, the aluminum heat sink dissipates the heat into surrounding air promptly. With the benefits of fanless design, SR10B can ensure high reliability and stability while working under wide range temperature from -40 up to 70°C

http://7starlake.dev.zhelang.com.tw/sites/default/files/inline-images/NEW_STYLE_products_SR10A_Thermal01.jpg

 

Patent Designed Aluminum Heat Sink

The heat sink is made by heat radiating material, which is aim to lowering the temperature by dissipating heat into the surrounding air. 96 % of aluminum, 21 mm height and weighs 1039 g

 

Pure Copper Heat Pipe

The heat pipes are embedded in the heat sink to ensure 100% tight integration for superior heat dissipation. Especially adopts U shape copper heat pipe to fulfill utmost thermal conductivity, copper heat pipe transfers heat from the heat sources (e.g. CPU, chipset) to the heat sink over relatively long distance. Two-phase heat transfer involves the liquid-vapor phase change of a working fluid.

 

Copper Heat spreader

Copper heat spreader directly touches the power source area, which can absorb heat rapidly and transfer to heat pipe and allow the high efficiency heat pipe further bring out heat to upper heat sink enclosure

• 99.9% purity of copper, weigh 470 g

 

OXY5737A

EBX SBC is installed in the middle of the system, dividing segmentation type thermal design into upper and lower module. Lower thermal module decomposition is the same as upper module, which is explained above.

 

Wire Rope Vibration Isolator design may sustain higher vibration resistance of the product itself.

• 10Grms Vibration and 75Grms Vibration Shock proof with Wipe Rope Vibration Isolator.

Download

AttachmentSize
SR10_Vibration_Test_1.pdf (1.19 MB)1.19 MB
SR10_Shock_Test_1.pdf (1.19 MB)1.19 MB