MIL-STD-810 Rugged Video Frame Grabber Computer with Intel® Core™ i7-7820EQ, 4x Gigabit LAN, 4x Serial port , 9V~36V DC-IN, high vibration / shock protection, Extended Temp. -40°C to 60°C


  • 8x D1 Video Frame Grabber (Optional)
  • Intel® Core™ i7-7820EQ (3.0/3.7 GHz, 4 cores, 8 threads)
  • 2x DDR4 Up to 32GB, 1x Storage Up to 2TB MLC SSD
  • Multi-Displays by 2x DP, 1x DVI-I
  • 2x mPCIe Expansion slot
  • 4x Intel® Gigabit Ethernet
  • 4x USB 3.0, 4x COM ports (2x RS232/422/485, 2 x RS232)
  • 9V~36V DC-IN with power delay on/off
  • Extended Temperature -40°C to 60°C
  • Optional unique accessory bumper design for vibration resistance

Intel Gold

Technical Profile


The SR10B-X3 based on Intel® QM175 chipset, is powered by Intel® 7th generation Core™ i7 processor onboard. The SR10B-X3 can operate effectively in harsh environment under temp range from -40°C to 60°C and is a perfect solution for military, transportation, factory automation and digital signage applications. SR10B-X3 is based on EBX form factor, DDR4 up to 32GB. It supports triple-display, 2 DP and 1 DVI-I, 4 GIGA LAN port, 4 USB 3.0 and 4 COM port. SR10B-X3 supplies wide power voltage from 9 to 36V DC-in.


Frame Grabber Card (Analog to Digital / PAL )

Frame grabbers may be used in military applications. For instance, when a potential breach of abnormal signal is detected, a frame grabber captures an image or a sequence of images in digital form, and then transmits the data to pilots or command control center.  SR10B-X3 support frame grabber cards expansion to be better process data promptly to meet front line needs, to collect useful images and help pilots to react promptly on the ever-changing battlefield.


Digital HD-SDI video input

1CH, Mini PCIe HW encode video capture card


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Analogic PAL video input

4CH, Mini PCIe Video Capture Card




Analogic PAL video output

1CH, Scan Converter Board




Unique Features


MIL-STD-810G standard designed for shock and vibration

SR10B is designed to meet MIL-STD-810G standard for shock and vibration. MIL-STD-810G standard is considered the upmost principle, which guarantees the system achieves superior quality and stability when operate under extreme harsh environment. We have conducted the test with series of testing procedures for resistance to shock, vibration, dust, humidity, and extreme temperatures. What’s more to make the system more rugged is SR10B designed with EBX form factor and stackable ability. With those two features can provide maximum exceeding solidity when stacking together to prevent loose from vibration. With key components- CPU and SSD soldering on board to enhance the capability of shock and vibration. With unique Wipe Rope Vibration Isolator design, the level of vibration resistance increased.


Wire Rope Vibration Isolator Design for Higher Vibration Resistance

7starlake has especially design a Wire Rope Vibration Isolator for SR10B. The Wire Rope Vibration Isolator may sustain higher vibration resistance of the product itself. 

A Wire Rope Vibration Isolator is widely apply on supporting Military equipment because it may absorb and protect the object from vibration damage in any axes simultaneously, with the protection it may extended the product life operating under long hour vibration environment and vibration shock. The isolator is long life maintenance free tool and it may unload whenever required. Besides, Wipe Rope Vibration Isolators may survive under extreme temperature, corrosion, radioactivity, extreme dry or high humidity and UV Radiation environment.


Operating Temp.


-40°C to 60°C


CPUIntel® 7th Gen Core™ i7-7820EQ (Frequency 3GHz, Turbo Boost Frequency up to 3.7GHz)
ChipsetIntel® QM175 Chipset providing integrated USB 3.0 and supporting 7th generation Intel® Core™ processor families.
Memory Type2x DDR4 SO-DIMM up to 32GB
Expansion Slot2x Full-size miniPCIe (ACES 88911-5204M) ,one co-lay with mSATA for operating system, Rugged -40/+85C High Capacity Military-Grade mSATA. 1x Onboard SIM Card slot (ASTRON 5190006-007-R) for 3.5G connectivity )
Ethernet Chipset4x Intel Gigabit Ethernet LAN Interfaces (10/100/1000Mbps)

Front I/O

Power Button1x
DC-IN1x 4P Rugged Terminal connector
Indicator LED1x 2.5″ SSD Storage
USB Port2x USB3.0
Serial Port2x RS-232

Rear I/O

Display Port2x
Ethernet4x RJ45 ports
USB2x USB 3.0
Audio2x 3.5mm Audio Jacks (1x MIC, 1x Line-Out)
Serial Port2x RS-232/422/485, jumper select


Display PortResolution up to 3840 x 2160@60Hz
DVI-IResolution up to 1920 x 1200@60Hz

Mechanical and Environment

Power Requirement9V~36V DC-IN, AT/ATX mode with power delay on/off
Dimension250 x 149 x 69 mm
Weight4.5 KG (9.9 LBS)
Operating Temp.-40°C to 60°C(ambient with air flow)
Storage Temp.-40°C to 85°C
Relative Humidity5% to 95%, non-condensing

Test Standard


Operating Tests

Low TemperatureMethod 502.4 Procedure 2-20°C (Cold Boot) -40°C (Continue Operating)
High TemperatureMethod 501.4 Procedure 2+55°C
HumidityMethod 507.45 x 48 hour cycles
VibrationMethod 514.5 Category 410—500Hz 1.04Grms
ShockMethod 516.540G 11mSec TPS 3 axis
AltitudeMethod 500.5 Procedure 2-1,000m to +12,000m

Non-Operating Tests

ShockMethod 516.540G 11ms TPS 3 axis
Low Temperature StorageMethod 501.4-40°C
High Temperature StorageMethod 502.4 Procedure 1+75°C
VibrationMethod 514.5 Category 24 fig 514.5C-1720 to 1000Hz @ 0.02g²/Hz falling @ -6dB to 2000Hz
AltitudeMethod 500.5 Procedure 2-1,000m to +12,000m
EMCCE and FCC certificated
Green ProductRoHS, WEEE compliance


The rugged MIL-STD compliant system, SR10B is equipped with highly effectively heat conductive and heat convective thermal solutions to meet extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system via 8.0 mm copper heat pipes. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.




Device Model


TesterMarc Liu
Test ResultPass
Test TemperatureHigh 0°C to 70°C / Low -40°C to 0°C
Test Time8 Hours / 3 Hours
Test StandardReference IEC60068-2
Test SoftwareBurnin test v9.0、
Crystal DiskMARK3.03,
Intel Extreme Tuning Utility1
CriteriaAfter testing, system can’t halt.


Test Configuration




CPUIntel® Core i7-7820EQ 3.0GHz
PCHMobile Intel QM175 Express Chipset
MemorySwissbit SO-DIMM 4 GB DDR4-1600
port3 SATAIIInnodisk 3ME3 mSATA 64GB
port4 SATA IIApacer 64GB Onboard SSD
LAN1Intel(R) I210 Gigabit Network Connection
LAN2Intel(R) I217-LM Ethernet Connection
Test SoftwareBurnin test v6.0、AS SSD Benchmark
Intel Extreme Tuning Utility
ChamberKSON THS-b4t-150 Chipeng SMO-3


Thermal Measurement

7starlake provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus 7starlake conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, 7starlake is able to analyse the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 5 hours which at each temperature point we burn in SR10A for one hour, from 50°C to 85°C.



SR10B-X3 IO Performance












CPU T-J02198100100100100100100100
CPU Die-17.37.481.584.292.193.595.597.397.7100.6
CPU Frenquency (GHz)2.792.792.692.592.492.192.001.701.200.90

Thermal Solution

Effective cooling solution for maximum heat dissipation 

7starlake implements unique cooling solution with copper heat spreader, pure copper heat pipe and aluminum heat sink for maximum heat dissipation. With the aluminum heat sink enclosure allows dual-sided heat dissipation. We especially adopt the physical property of copper and aluminum, the copper heat spreader touches the heat source – processor and chipset and absorbs the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid, the aluminum heat sink dissipates the heat into surrounding air promptly. With the benefits of fanless design, SR10B can ensure high reliability and stability while working under wide range temperature from -40 up to 70°C

Patent Designed Aluminum Heat Sink

The heat sink is made by heat radiating material, which is aim to lowering the temperature by dissipating heat into the surrounding air. 96 % of aluminum, 21 mm height and weighs 1039 g


Pure Copper Heat Pipe

The heat pipes are embedded in the heat sink to ensure 100% tight integration for superior heat dissipation. Especially adopts U shape copper heat pipe to fulfill utmost thermal conductivity, copper heat pipe transfers heat from the heat sources (e.g. CPU, chipset) to the heat sink over relatively long distance. Two-phase heat transfer involves the liquid-vapor phase change of a working fluid.


Copper Heat spreader

Copper heat spreader directly touches the power source area, which can absorb heat rapidly and transfer to heat pipe and allow the high efficiency heat pipe further bring out heat to upper heat sink enclosure

• 99.9% purity of copper, weigh 470 g

Wire Rope Vibration Isolator design may sustain higher vibration resistance of the product itself.

• 10Grms Vibration and 75Grms Vibration Shock proof with Wipe Rope Vibration Isolator.