SR10A

8x D1 Video Capture Fanless Rugged Vibration-Proof System with Intel® Core™ i7-4700EQ, Haswell Processor, mPCIe expansion 9V~36V DC-IN, Wide Temp. -40°C to 70°C

 

  • 8x D1 Video Frame Grabber (Optional)
  • Intel® Core™ i7-4700EQ, 2,4/3.4 GHz, 4C, 8T, 6MB Cache, TDP 47W
  • DDR3 XR-DIMM Up to 8GB
  • mSATA Up to 256GB
  • Multi-Displays: 2x DP, 1x DVI-I
  • 1x mPCIe Expansion slot – 2x PCIe Intel® Gigabit Ethernet
  • 4x USB 3.0, 1x COM ports (RS232/422/485)
  • 9V~36V DC-IN with power delay on/off
  • Extended Temperature -40°C to 70°C
  • Optional unique accessory bumper design for vibration resistence

Intel Gold

Technical Profile

Introduction

The SR10A, based on the Intel® Haswell QM87 chipset, is powered by an Intel® 4th generation Core™ i7/i5/i3 processor onboard. It operates effectively in harsh environments with a temperature range from -40 to 70°C, making it an ideal solution for military, transportation, factory automation, and digital signage applications. The SR10A, utilizing the EBX form factor and Swissbit XR-DIMM up to 8GB, supports triple-display (2 DP and 1 DVI-I), 2 GIGA LAN ports, 4 USB 3.0 ports, and 1 COM port. Additionally, the SR10A supplies a wide power voltage range from 9 to 36V DC-in.

http://7starlake.dev.zhelang.com.tw/sites/default/files/inline-images/NEW_STYLE_products_SR10A_02.jpg

 

Unique Challenges

 

http://7starlake.dev.zhelang.com.tw/sites/default/files/inline-images/NEW_STYLE_products_SR10A_03.jpg

 

MIL-STD-810G standard designed for shock and vibration

 

The SR10 is meticulously crafted to meet the MIL-STD-810G standard for shock and vibration. This standard serves as the utmost principle, ensuring the system attains superior quality and stability when operating in extreme and harsh environments. We have subjected the system to a series of testing procedures, assessing its resistance to shock, vibration, dust, humidity, and extreme temperatures.

What makes the SR10A even more rugged is its design with the EBX form factor and stackable ability. These two features provide maximum solidity when stacked together, preventing loosening from vibration. Key components, such as the CPU and SSD, are soldered onto the board to enhance shock and vibration resistance. Additionally, the optional Bumper design further increases the system’s level of vibration resistance.

 

Wire Rope Vibration Isolator Design for Higher Vibration Resistance

 

7starlake has specially designed a Wire Rope Vibration Isolator for the SR10A. This isolator enhances the product’s vibration resistance significantly.

Wire Rope Vibration Isolators are commonly employed in supporting military equipment due to their ability to absorb and protect objects from vibration damage in all axes simultaneously. With this protection, the product’s operational life can be extended when exposed to prolonged periods of vibration and vibration shock. The isolator is a long-life, maintenance-free tool that can be unloaded whenever necessary. Additionally, Wire Rope Vibration Isolators are capable of withstanding extreme temperatures, corrosion, radioactivity, extreme dryness or high humidity, and UV radiation environments.

 

Frame Grabber Card (Analog to Digital / PAL )

 

Frame grabbers find utility in military applications. For example, when detecting a potential breach of abnormal signals, a frame grabber captures images or a sequence of images in digital form and transmits the data to pilots or the command control center. The SR10A supports the expansion of frame grabber cards, enhancing the ability to process data promptly to meet frontline needs. This capability allows for the collection of useful images, aiding pilots in reacting promptly to the ever-changing battlefield.

 

Digital HD-SDI video input

1CH, Mini PCIe HW encode video capture card

 

AMP nanoVTV-EXT_0_2.png

 

Analogic PAL video input

4CH, Mini PCIe Video Capture Card

 

C351W_1_2_1.png

 

Analogic PAL video output

1CH, Scan Converter Board

 

CM313B_3_0_0.png

 

System main board: EBX SBC-OXY5737A

 

  1. Intel® Core i7 CPU Soldered Onboard The OXY5737A is based on the EBX rugged single-board computer, powered by the Intel Ivy Bridge i7-4700EQ quad-core processor with the QM87 chipset soldered onboard. Soldering the processor enhances shock and vibration resistance, enabling the product to operate under various conditions. This method also reduces resistance and inductance at the connection, ensuring effective transmission and guaranteeing better high-frequency performance for the system.
  2. Expandable with Two Extension mPCIe Slots The SR10A features two mPCIe slots, with one co-laying with mSATA and an additional slot for extra expansion.
  3. Wide Range DC Input from 9V to 36V In applications such as transportation and military, where unstable power poses a risk, a wide range DC input is essential. The SR10A supports a wide range of 9V to 36V DC-in, protecting the system from damage caused by sudden surges or peak voltage. This feature enhances system flexibility, offering an increased migration path without the need to redesign the existing power architecture.

Specifications

Operating Temp.

 

-40°C to 70°C
 

System

CPUIntel® Core™ i7 Haswell , BGA type
Intel® Core i7-4700EQ, 2,4/3.4 GHz, 4C, 8T, 6MB Cache, TDP 47W
ChipsetIntel® QM87 Chipset (Intel® DH82QM87 PCH)
Memory Type1x DDR3 1600 XR-DIMM up to 8 GB with ECC
Expansion Slot2x mPCIe (1 x colay with mSATA) for GEN2
Storage Device1x mSATA up to 512GB
Ethernet ChipsetIntel® I210IT & i217LM GbE
 

Front I/O

Power Button1x with backlight
Power LED1x
HDD LED1x
LAN LED2x
USB2x USB 3.0
POWER1x Terminal Block
 

Rear I/O

Display Port2x
DVI1x DVI-I
Ethernet2x RJ45
COM1x RS-232/422/485 ports, Jumper-selectable
Serial Signals
RS232: DCD-, RXD, TXD, DTR-, GND, DSR-, RTS-, CTS-
RS422: TX-, RX+, TX+, RX-, GND
RS485- 4W: TxD+, TxD-, RxD+, RxD-, GND
RS485- 2W: DATA-, DATA+, GND
USB2x USB 3.0
 

Display

Display Interface1x DVI-I connectors(female); resolution up to 1920 x 1200@60 Hz;
2x DisplayPort connectors (female); resolution up to 3840 x 2160@60 Hz
Graphics ControllerOnboard Intel® HD 4600 graphics
 

OS support list

WindowsWindows 7 x32/x64, Windows 8 x32/x64, Windows 10 x32/x64
LinuxFedora 20、Ubuntu 13.04、Ubuntu 13.10、Ubuntu 14.04
 

Mechanical and Environment

Power Requirement9V~36V DC-IN, AT/ATX mode with power delay on/off
Dimension262 x 149 x 69 mm
Weight3.81 Kg (8.39lbs)
Operating Temp.-40°C to 70°C(ambient with air flow)
Storage Temp.-40°C to 85°C
Relative Humidity5% to 95%, non-condensing
 

Test Standard

MIL-STD-810G TestMethod 507.5, Procedure II (Temperature & Humidity)
Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock)
Method 516.6 Shock-Procedure I Operating (Mechanical Shock)
Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24, Vibration)
Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration)
Method 501.5, Procedure I (Storage/High Temperature)
Method 501.5, Procedure II (Operation/High Temperature)
Method 502.5, Procedure I (Storage/Low Temperature)
Method 502.5, Procedure II (Operation/Low Temperature)
Method 503.5, Procedure I (Temperature shock)
EMCCE and FCC certificated
Green ProductRoHS, WEEE compliance

CPU

The rugged MIL-STD compliant system, SR10A is equipped with highly effectively heat conductive and heat convective thermal solutions to meet extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system via 8.0 mm copper heat pipes. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.

 

SR10A

 

Device ModelSR10A
TesterIan Huang
Test ResultPass
Test TemperatureHigh 0°C~70°C / Low -40°C~0°C
Test Time8Hours / 3Hours
Test StandardReference IEC60068-2
Test SoftwareBurnin test v7.1、
Crystal DiskMARK3.03,
Intel Extreme Tuning Utility1
CriteriaAfter testing, system can’t halt.

 

Test Standard

 

Device

Configuration

CPUIntel® Core i7-4700EQ (4C x 2.4Ghz),
6M Cache (47W)
PCHIntel®QM87
Memory8GB DDR3 1600 MHz XR DIMM
onboard SSDApacer 64G SATA SSD
mSATA PORTInnodisk 256GB mSATA
SoftwareBurnin test v7.1、
Crystal DiskMARK3.03,
Intel Extreme Tuning Utility1
ChamberKSON THS-b4t-150 Chipeng SMO-3

 

Thermal Measurement

 

The rugged MIL-STD-compliant system, SR10A, is equipped with highly effective heat-conductive and heat-convective thermal solutions to meet extended temperature requirements. The heat-conductive solution uses an aluminum flat mass placed in direct contact with the processor and chipset, transferring heat from the chips to the system case via 8.0 mm copper heat pipes. Additionally, the convective thermal solutions introduce airflow directed to move across the surface of a fin-style heatsink placed on top of the processor and chipset. This can be achieved with the aid of an appropriately sized fan placed on top of the fin-style heatsink. Alternatively, enclosure airflow can be routed to flow across a fin-style heatsink.

 

SR10A – IO Performance

 

Point-40°C-20°C25°C40°C45°C50°C55°C60°C65°C70°C
CPU T-J22098100100100100100100100
CPU Die-9.78.581.584.292.193.595.597.397.7100.6
Heatsink-33.7-16.261.364.369.472.476.279.883.587.2
Δ1=(TJ-Die)11.711.516.515.87.96.54.52.72.3-0.6
Δ2=(Die-Sink)2424.720.219.922.721.119.317.514.213.4
CPU Frenquency (GHz)2.792.792.692.592.492.192.001.701.200.90

Thermal Solution

Effective Cooling Solution for Maximum Heat Dissipation:

7starlake has implemented a unique cooling solution featuring a copper heat spreader, pure copper heat pipe, and aluminum heat sink for optimal heat dissipation. The aluminum heat sink enclosure allows dual-sided heat dissipation. Leveraging the physical properties of copper and aluminum, the copper heat spreader makes direct contact with the heat source—the processor and chipset—absorbing heat rapidly. The heat then transfers to the heat pipe, which involves the liquid-vapor phase change of a working fluid. Finally, the aluminum heat sink dissipates the heat into the surrounding air promptly. With the benefits of a fanless design, the SR10A ensures high reliability and stability while operating within a wide temperature range from -40°C to 70°C.

http://7starlake.dev.zhelang.com.tw/sites/default/files/inline-images/NEW_STYLE_products_SR10A_Thermal01_0.jpg

 

Patent Designed Aluminum Heat Sink

 

The heat sink is made by heat radiating material, which is aim to lowering the temperature by dissipating heat into the surrounding air. 96 % of aluminum, 21 mm height and weighs 1039 g

 

Pure Copper Heat Pipe

The heat pipes are embedded in the heat sink to ensure 100% tight integration for superior heat dissipation. Especially adopts U shape copper heat pipe to fulfill utmost thermal conductivity, copper heat pipe transfers heat from the heat sources (e.g. CPU, chipset) to the heat sink over relatively long distance. Two-phase heat transfer involves the liquid-vapor phase change of a working fluid.

• 8.0 mm diameter heat pipe, 225 mm length of each heat pipe, 99.9% purity of copper
• High heat conductivity coefficient up to 5000

 

Copper Heat Spreader

Copper heat spreader directly touches the power source area, which can absorb heat rapidly and transfer to heat pipe and allow the high efficiency heat pipe further bring out heat to upper heat sink enclosure

• 99.9% purity of copper, weigh 470 g

 

OXY5737A

EBX SBC is installed in the middle of the system, dividing segmentation type thermal design into upper and lower module. Lower thermal module decomposition is the same as upper module, which is explained above.

 

Wire Rope Vibration Isolator design may sustain higher vibration resistance of the product itself.

• 10Grms Vibration and 75Grms Vibration Shock proof with Wipe Rope Vibration Isolator.

Download

AttachmentSize
SR10_Vibration_Test_4.pdf (1.19 MB)1.19 MB
SR10_Shock_Test_4.pdf (1.19 MB)1.19 MB