SR100

Intel® QM87 MIL-STD Fanless Rugged System with Intel® Core™ i7-4700EQ, Haswell Processor, 9V~36V DC-IN, Wide Temp. -40°C to 70°C

 

  • Intel® Core™ i7-4700EQ, 2,4/3.4 GHz, 4C, 8T, 6MB Cache, TDP 47W
  • DDR3 XR-DIMM up to 8 GB RAM
  • Onboard uSSD SATAIII up to 64 GB
  • Multi-Displays: 2x DP, 1x DVI-I
  • 2x mPCIe Expansion slot (One Co-Layout with mSATA)
  • 2x PCIe Intel® Gigabit Ethernet
  • 4x USB 3.0, 1x COM ports
  • 9V~36V DC-IN with power delay on/off
  • Extended Temperature -40°C to 70°C

Intel Gold

Technical Profile

Introduction

The SR100 based on Intel® Haswell QM87 chipset, is powered by Intel® 4th generation Core™ i7/i5/i3 processor onboard. The SR100 can operate effectively in harsh environment under temp range from -40 to 70°C and is a perfect solution for military, transportation, factory automation and digital signage applications. SR100 is based on EBX form factor which features with stackable PCIe/104 and FPE expansions, on board Nano SATA(3.0)16/32 Giga Byte SSD and Swissbit XR-DIMM up to 8GB. It supports triple-display, 2 DP and 1 DVI-I, 2 GIGA LAN port, 4 USB 3.0, 1 COM port and 2 mPCIe Expansion slots (one co-layout with mSATA). SR100 supplies wide power voltage from 9 to 36V DC-in.

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Frame Grabber Card (Analog to Digital / PAL )
Frame grabbers may be used in military applications. For instance, when a potential breach of abnormal signal is detected, a frame grabber captures an image or a sequence of images in digital form, and then transmits the data to pilots or command control center.  SR100 support frame grabber cards expansion to be better process data promptly to meet front line needs, to collect useful images and help pilots to react promptly on the ever-changing battlefield.
AMP nanoVTV-EXT_0_2.png

Digital HD-SDI video input

1CH, Mini PCIe HW encode video capture card

 

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Analogic PAL video input

4CH, Mini PCIe Video Capture Card

 

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Unique Features

 

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Effective cooling solution for thermal design

7starlake implements unique cooling solution on SR100 to achieve maximum heat dissipation with copper heat spreader, pure copper heat pipe and aluminum heat sink. With the aluminum heat sink enclosure allows dual-sided heat dissipation. We especially adopt the physical property of copper and aluminum, the copper heat spreader touches the heat source – processor and chipset and absorbs the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid, the aluminum heat sink dissipates the heat into surrounding air promptly. With the benefits of fanless design, SR100 can ensure high reliability and stability while working under wide range temperature from -40 up to 70°C.

 

MIL-STD-810G standard designed for shock and vibration

SR100 is designed to meet MIL-STD-810G standard for shock and vibration. MIL-STD-810G standard is considered the upmost principle, which guarantees the system achieves superior quality and stability when operate under extreme harsh environment. We have conducted the test with series of testing procedures for resistance to shock, vibration, dust, humidity, and extreme temperatures. What’s more to make the system more rugged is SR100 designed with EBX form factor and stackable ability. With those two features can provide maximum exceeding solidity when stacking together to prevent loose from vibration. With key components- CPU and SSD soldering on board to enhance the capability of shock and vibration.

 

Stackable with PCIe/104 & FPE expansion

Known for application ruggedness, reliability, sealing properties, and compactness characteristics, PCIe/104 & FPE connectors are ideal for high-end electronic equipment and use in extreme environment conditions. With easy connect/disconnect and blind mating, SR100 has a functional life greater than 10,000 mating cycles. The PCIe/104 connector on SR100 that specifies standard of SAMTEC Q2™ QMS/QFS series in a three bank (156-pin) orientation for module stacking. SAMTEC designed the QMS/QFS series with a 15.24 mm stack height for top and bottom board stacking. And the Q2™ has triple the wipe of many high-speed mezzanine interconnects making SR100 the best choice for tough environmental conditions.

 

System main board: EBX SBC-OXY5737A

 

1. Intel Core i7 CPU soldering onboard

OXY5737A is based on EBX rugged single board computer, powered by Intel Ivy Bridge i7-4700EQ quad core processor plus QM87 chipset soldered onboard.With processor soldering on board can enhance the resistance of shock and vibration to allow product operates under every possible condition. With processor solder on board would lowerresistance and inductance at the connection enhance effective transmission that could guarantee better and more high frequency performance for the system.

 

2. Expandable by Extension Storage Module, the SK401

SR100 carries stacking PCIe 104 and FPE expansion slot, which allows the system with optional module connects ability to increase a variety of possibility for device, connects. SR100 can use with stackable storage module SK401. With SK401 storage module stacking on board can additionally support 2x 2.5”SSD or HDD and 2x mSATA. The SK401 supports OS of Win 7, Win XP, Linux, DOS, etc.

 

3. Wide range DC input from 9V~ 36V

For certain application such like transportation and military always challenge the risk of unstable power that might cause damage to the system. Wide range DC input becomes an indispensable element for those applications. SR100 supports Wide range 9V~ 36V DC-in to protect system from damage caused by sudden surge or peak voltage. This feature guarantees the system increasing migration path flexible and eliminates redesign of existing power architecture.

Specifications

Operating Temp.

 

-40°C to 70°C
 

System

CPUIntel® Core™ i7 Haswell , BGA type
Intel® Core i7-4700EQ, 2,4/3.4 GHz, 4C, 8T, 6MB Cache, TDP 47W
ChipsetIntel® QM87 Chipset (Intel® DH82QM87 PCH)
Memory Type1x DDR3 1600 XR-DIMM up to 8 GB with ECC
Expansion Slot2x mPCIe (1 x colay with mSATA) for GEN2
Storage Device1x SATA III 6 Gb/s, 2.5″ SSD/HDD
Ethernet ChipsetIntel® I210IT & i217LM GbE
 

Front I/O

Power Button1x with backlight
Power LED1x
HDD LED1x
LAN LED2x
USB2x USB 3.0
POWER1x Terminal Block
 

Rear I/O

DisplayPort2x
DVI-I1x DVI-I
Ethernet2x RJ45
Audio1x Mic-in, 1x Line-out
COM1x RS-232/422/485 ports, Jumper-selectable
Serial Signals
RS232: DCD-, RXD, TXD, DTR-, GND, DSR-, RTS-, CTS-
RS422: TX-, RX+, TX+, RX-, GND
RS485- 4W: TxD+, TxD-, RxD+, RxD-, GND
RS485- 2W: DATA-, DATA+, GND
Audio1x MIC, 1x Line out
USB2x USB 3.0
 

Display

Display Interface1x DVI-I connectors(female); resolution up to 1920 x 1200@60 Hz;
2x Display port connectors (female); resolution up to 3840 x 2160@60 Hz
Graphics ControllerOnboard Intel® HD 4600 graphics
 

OS support list

WindowsWindows 8 x32/x64、Windows 8.1 x32/x64、Windows 10 x32/x64
LinuxFedora 20、Ubuntu 13.04、Ubuntu 13.10、Ubuntu 14.04
 

Mechanical and Environment

Power Requirement9V~36V DC-IN, AT/ATX mode with power delay on/off
Dimension250 x 149 x 76 mm
Operating Temp.-40°C to 70°C(ambient with air flow)
Storage Temp.-40°C to 85°C
Relative Humidity5% to 95%, non-condensing
 

Test Standard

MIL-STD-810G TestMethod 507.5, Procedure II (Temperature & Humidity)
Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock)
Method 516.6 Shock-Procedure I Operating (Mechanical Shock)
Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24, Vibration)
Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration)
Method 501.5, Procedure I (Storage/High Temperature)
Method 501.5, Procedure II (Operation/High Temperature)
Method 502.5, Procedure I (Storage/Low Temperature)
Method 502.5, Procedure II (Operation/Low Temperature)
Method 503.5, Procedure I (Temperature shock)
EMCCE and FCC compliance
Green ProductRoHS, WEEE compliance

CPU

The rugged MIL-STD compliant system, SR100 is equipped with highly effectively heat conductive and heat convective thermal solutions to meet extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system via 8.0 mm copper heat pipes. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.

 

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Device ModelSR100
TesterIan Huang
Test ResultPass
Test TemperatureHigh 0°C~75°C / Low -40°C~0°C
Test Time9Hours / 1.5Hours
Test StandardReference IEC60068-2
Test SoftwareBurnin test v6.0
CriteriaAfter testing, system can’t halt.

 

Test Configuration

 

Device

Configuration

CPUIntel® Core i7-4700EQ 2.40GHz
PCHMobile Intel QM87 Express Chipset
MemorySwissbit XR-DIMM 4 GB DDR3-1600
port3 SATAIIInnodisk 3ME3 mSATA 64GB
port4 SATA IIApacer 64GB Onboard SSD
LAN1Intel(R) I210 Gigabit Network Connection
LAN2Intel(R) I217-LM Ethernet Connection
Test SoftwareBurnin test v6.0、AS SSD Benchmark
Intel Extreme Tuning Utility 4.3.0.11
ChamberKSON THS-b4t-150 Chipeng SMO-3

 

Thermal Measurement

7starlake provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performanceunder high temperature, thus 7starlake conducts long time experiments tomake sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, 7starlake is able to analyse the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 5 hours which at each temperature point we burn in SR100 for one hour, from 50°C to 85°C.

 

SR100 MB HeatSink – IO Performance

 

Point-40°C25°C40°C45°C50°C55°C60°C65°C70°C75°C
CPU T-J0808189949999100100100
CPU Die-24.366.47075.7838988.193.995.698
Heatsink-32.85860.565.572.377.777.984.787590.7
Δ1=(TJ-Die)24.313.61113.3111010.96.14.42
Δ2=(Die-Sink)8.58.49.510.210.711.310.29.28.67.3
CPU Frenquency (GHz)2.792.792.792.792.792.602.592.001.61.1

Thermal Solution

Effective cooling solution for maximum heat dissipation

7starlake implements unique cooling solution with copper heat spreader, pure copper heat pipe and aluminum heat sink for maximum heat dissipation. With the aluminum heat sink enclosure allows dual-sided heat dissipation. We especially adopt the physical property of copper and aluminum, the copper heat spreader touches the heat source – processor and chipset and absorbs the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid, the aluminum heat sink dissipates the heat into surrounding air promptly. With the benefits of fanless design, SR100 can ensure high reliability and stability while working under wide range temperature from -40°C to 70°C

 

Patent Designed Aluminum Heat Sink

The heat sink is made by heat radiating material, which is aim to lowering the temperature by dissipating heat into the surrounding air. 96 % of aluminum, 21 mm height and weighs 1039 g

 

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Pure Copper Heat Pipe

The heat pipes are embedded in the heat sink to ensure 100% tight integration for superior heat dissipation. Especially adopts U shape copper heat pipe to fulfill utmost thermal conductivity, copper heat pipe transfers heat from the heat sources (e.g. CPU, chipset) to the heat sink over relatively long distance. Two-phase heat transfer involves the liquid-vapor phase change of a working fluid.

• 8.0 mm diameter heat pipe, 225 mm length of each heat pipe, 99.9% purity of copper
• High heat conductivity coefficient up to 5000

 

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Copper Heat spreader

Copper heat spreader directly touches the power source area, which can absorb heat rapidly and transfer to heat pipe and allow the high efficiency heat pipe further bring out heat to upper heat sink enclosure

• 99.9% purity of copper, weigh 470 g

 

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OXY5737A

EBX SBC is installed in the middle of the system, dividing segmentation type thermal design into upper and lower module. Lower thermal module decomposition is the same as upper module, which is explained above.

 

http://7starlake.dev.zhelang.com.tw/sites/default/files/inline-images/NEW_STYLE_products_SR100_Thermal04.jpg

 

Copper Heat spreader

Copper heat spreader directly touches the heat source- processor and chipset, which absorb heat rapidly and transfer to heat pipe.

• 99.9% purity of copper, weigh 80g and consume 80x45x3 mm
• 3mm height to fulfill the gap between mainboard and heatsink enclosure

 

 

http://7starlake.dev.zhelang.com.tw/sites/default/files/inline-images/NEW_STYLE_products_SR100_Thermal05.jpg

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Video