SR10-X3A

  • MIL-STD-810 Anti-Vibration, Shock
  • Intel 8th Coffee-Lake (H) Core i7-8850H (2.6 GHz, up to 4.3 GHz)
  • DDR4-32GB
  • Multi display : DisplayPort, HDMI & VGA
  • Storage (1) : M.2 for Boot Up
  • Storage (2) : 1x 2.5” SATA SSD
  • 2x LAN, 4x USB3.1
  • 9V~36V DC-DC
  • Extended temperature -40°C to 60°C

Intel Gold

Technical Profile

Introduction

SR10-X3A — A system born to succeed in mission critical projects and harsh environment provides a multi-layer backup plan encompassing data redundancy and power protection that are highly valued by demanding Global Tier 1 companies. It’s driven by Intel 8th Gen Coffee Lake H i7-8850H (6C, 2.6/4.3GHz) and can enlarge its capacity of storages in such a compact size by leveraging dual storage design (1 x mSATA, 1 x 2.5″ swappable SATAIII SSD). Further more, SR10-X3A merges three kinds of video outputs: DisplayPort, HDMI and VGA, transforming itself into a perfect choice for multi-screen utilization.

 

Purpose-Built System For Agile Reconnaissance
SR10-X3A offers an extension to Frame grabbers which is extremely vital in applications related to agile reconnaissance, e.g., target acquisition, smart surveillance, and security. For instance, when a potential breach of abnormal signal is detected, a frame grabber captures an image or a sequence of images in digital form, and then transmits the data to user and command control center. By adding a slim frame grabber card, SR10-X3A can collect useful images and help our clients to react promptly in the ever-changing world. Frame grabbers  

1. Intel 8th Gen Coffee Lake H processor

As a member of Coffee Lake H, i7-8850H is a Hexa-Core processor supporting Max Turbo Frequency up to 4.3GHz. When paired with an Intel QM370 chipset, i7-8850H offers enhanced CPU/graphics performance and security feature Intel Software Guard eXtensions (SGX) over previous generation and introduce native USB 3.1. What’s more, i7-8850H takes the reliability of SR10-X3A to a higher level based on BGA 1440 packaging, yet it provides TDP option of 45W giving excellent balance of performance and power suited for space-constrained designs, embedded use conditions & excellent longevity.

 

2. Flexible display output & triple display

The various display output ports of SR10-X3A supports 1 x DisplayPort, 1 x HDMI, and 1 x VGA with Full HD 1080P resolution display. The system can not only provide the single desktop display but also allow triple screens display. The high flexible display output can accept diverse applications and provide the best display performance.

The integrated UHD Graphics supports three independent displays with 4k resolution each, and comes with hardware-based video encoding and decoding up to 4k. It features HDMI and DisplayPort outputs to provide advanced solutions for imaging, machine vision, infotainment, medical and gaming machines.

 

3. MIL-STD-810

7Starlake’s computers are designed to meet the strict standards of MIL-STD-810. When it comes to true ruggedness, MIL-STD-810 standard is considered the upmost principle. Originally established by the US government to simulate how materials would hold up to harsh environments, It provides a series of testing procedures for resistance to shock, vibration, extreme temperatures…etc.

  • Vibration

810_Vibration

Vibration test is conducted to create an environment, in which long-term and high level vibration is simulated. The test is performed with both the system operating/non. Various levels and duration of vibration is simulated with up to 7g transitions in X & Y axis, and 5Grms in Z axis.

  • Shock

810_Shock

Mechanical Shock test is conducted to ensure that equipment can withstand drops encountered during handling, transportation, and normal use. The test is performed with both the system operating/non. We expose the system to 3 pulses/direction of sawtooth shock at 40g 11ms. 6 directions for a total of 18 pulses.

 

I/O

fanless i7-8850H computer

Specifications

Operating Temp.

 

-40°C to 60°C ( ambient with air flow )
 

System

ModelSR10-X3A
CPUIntel® 8th Gen Core™ i7-8850H (2.6Ghz, Up to 4.3Ghz)
ChipsetQM370
MemoryUp to 32GB DDR4 RAM
 

Display

GPUIntel® UHD Graphics 630
Display PortResolution up to 4096×2304@60Hz
HDMIResolution up to 4096×2160@30Hz
DVI-DResolution up to 1920×1200 @ 60Hz
 

Storage

Storage Device1x 2.5″ SATA 3.0 SSD

1x mSATA

 

Ethernet

2x Intel Gigabit Ethernet LAN Interfaces (10/100/1000 Mbps)
 

Rear I/O

DisplayPort1x 20Pin DisplayPort connector (Female)
HDMI1x 19Pin HDMI connector (Female)
Ethernet2x RJ45 Gigabit Ethernet LAN Interfaces
USB Port4x USB3.1 Gen2 standard-A connectors
VGA Port1x VGA
Audio Port1x Line-Out, 1x MIC-In connector
DC-IN1x 4P Rugged Terminal connector
 

Front I/O

Button1x Power Button w/Indicator LED
Indicator LED1x HDD LED
USB Port2x USB2.0 — By Options
Serial Port2x RS232/422/485 (By Options)
 

Applications, Operating System

ApplicationsIndustrial and Military Platforms Requiring Compliance to MIL-STD-810

Unmanned Platform, Robotic, Smart Surveillance applications where Harsh Temperature, Shock, Vibration, Altitude, Dust and EMI Conditions.

Operating SystemWindows 10 64 bit

Ubuntu 16.04, Ubuntu 14.04, Fedora 28

 

Physical

Dimension (WxDxH)308 x 149 x 65.2 mm
Weight3.21 Kg
ChassisAluminum Alloy, Corrosion Resistant.
FinishAnodic aluminum oxide (Color Iron gray)
CoolingNatural Passive Convection/Conduction. No Moving Parts
ConnectorsDC-IN : PHOENIX CONTACT 1776715 RJ45 Ethernet :

RTB-19GB9J1A

COM: FEN YING SM10-09P

HDMI + DP : JKCR Display and HDMI Female

Ingress ProtectionDust Proof (Similar to IP50)
 

Environmental

MIL-STD-810Method 507.5, Procedure II (Temperature ® Humidity)

Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock)

Method 516.6 Shock-Procedure I Operating (Mechanical Shock)

Method 514.6 Vibration Category 24/Non-Operating (Category 20 ® 24, Vibration)

Method 514.6 Vibration Category 20/Operating (Category 20 ® 24, Vibration)

Method 501.5, Procedure I (Storage/High Temperature)

Method 501.5, Procedure II (Operation/High Temperature)

Method 502.5, Procedure I (Storage/Low Temperature)

Method 502.5, Procedure II (Operation/Low Temperature)

Method 503.5, Procedure I (Temperature shock)

Operating Temperature-20°C to 60°C (ambient with 0.7m/s airflow)
Storage Temperature-40°C to 85°C
EMCCE and FCC compliance

Download

Attachment
Datasheet