MIL-STD Fanless Rugged System with Intel® 8th Core i7-8700 Coffee Lake processor, Extended Temperature -40°C to 60°C


  • MIL-STD 810 Anti-Vibratin, Shock
  • 8th Gen Intel® Core i7-8700 Processor
  • Up to 32GB DDR4 RAM
  • Multi display with displayport, HDMI & DVI
  • 1x 2.5” SSD
  • 2x Intel gigabit Ethernet
  • 6x USB ports, 3x COM port
  • 12V~24V DC-IN
  • Extended temperature -40°C to 60°C

Intel Gold

Technical Profile


SR10-X3 is a high efficiency and powerful computing system driven by the Intel 8th Gen, 6 Core, 12 Thread processor, that can successfully operate with a high speed efficiency processing program. Besides, there are three independent display output ports supporting the system, including one Display Port, one HDMI, and one DVI-D. What’s more, SR10-X3 is equipped with two USB2.0 and four USB3.1, provide the best input and output efficiency. The system also supports a wide range DC-in from 12V to 24V, and accepts the extend range of temperature from -40°C to 60°C. SR10-X3 passes the MIL-STD-810G compliance which can operate successfully in any harsh environments.



Thermal solution for fanless system design

7starlake designs a unique enclosure that is able to stack together both horizontally and vertically. The aluminum heat sink enclosure allows perfect heat dissipation. 7starlake exclusively adopts special heat radiating material and combining with special CNC cutting, further forged into a lavish sophisticated metal. Apart from the special heat sink enclosure, SR10-X3 innovatively adopts two kinds of copper heat spreader. The shape and the size of the spreader are tailor-made based on the heat sources placement of CPU module and graphic module. In view of the gap difference between motherboard and heat sink, 7starlake builds two heat spreaders in different thicknesses. Combining all these exclusive thermal designs can alternatively replace traditional fan, and also ensures high reliability and stability while working under wide range temperature from -40°C up to 60°C.


MIL-STD-810G standard designed for shock and vibration


SR10-X3 is designed to meet MIL-STD-810G standard for shock and vibration. MIL-STD-810G standard is considered the upmost principle, which guarantees the system achieves superior quality and stability when operate under extreme harsh environment. We have conducted the test with series of testing procedures for resistance to shock, vibration, dust, humidity, and extreme temperatures.


1. Intel 8th Gen processor, 6 Core, 12 Thread supports

Intel 8th Core i7-8700 Coffee Lake processor with Intel Turbo Boost Technology that the operating Frequency can increase up to 4.0 GHz. The processor equipped with 12MB SmartCache to decrease the overall cache miss rate. The Intel 8th Core i7-8700 processor effectively operates with 6 Cores and 12 Threads, which supports the best high speed operations and processes.


2. Flexible display output & triple display

The various display output ports of SR10-X3 supports 1 x DisplayPort, 1 x HDMI, and 1 x DVI-D with Full HD 1080P resolution display. The system can not only provide the single desktop display but also allow triple screens display. The high flexible display output can accept diverse applications and provide the best display performance.

The integrated UHD Graphics supports three independent displays with 4k resolution each, and comes with hardware-based video encoding and decoding up to 4k. It features DVI, HDMI and DisplayPort outputs to provide advanced solutions for imaging, machine vision, infotainment, medical and gaming machines.


3. USB 3.1 Gen 2

SR10-X3 is equipped with USB 3.1 Gen 2, which dramatically enhance the transfer rate up to 10 Gbps, which means it efficiently saves the data transfer processing time. For example, USB 3.1 Gen 2 only needs to spend 4.13s for transferring a 5GB document, but USB 3.0 needs to spend 10s for transferring a 5GB document. Besides, USB 3.1 Gen 2 improves the Encoded Mode to 128b/132b, successfully decrease the dissipation rate of data transfer to 3%.

USB Type


Max. current

Data Rate

Encoded Mode

Encoded Loss

Actual Rate

USB 2.0HiSpeed500mA480 Mbps8b/10b-20%48 MB/s
USB 3.0/ 3.1 Gen 1SuperSpeed900mA5.0 Gbps8b/10b-20%500 MB/s
USB 3.1 Gen 2SuperSpeed+5000mA10 Gbps128b/132b-3.03%1.21 GB/s




Operating Temp.


-40°C to 60°C ( ambient with air flow )


CPUIntel® 8th Gen Core™ i7-8700 (Frequency 3.2GHz, Turbo Boost Frequency up to 4.6GHz),

6-Core, 12 Thread Support, 12MB SmartCache. Build-in UHD Graphics 630 for excellent 3D,

Turbo Boost Technology 2.0, VPro and Hyper-Threading support

MemoryDDR4, Up to 16GB RAM


GPUIntel® UHD Graphics 630
Display PortResolution up to 4096×2304@60Hz
HDMIResolution up to 4096×2160@30Hz
DVI-DResolution up to 1920×1200 @ 60Hz


Storage Device1x 2.5″ SATA 3.0 (SSD)

1x mSATA



2 x Intel Gigabit Ethernet LAN Interfaces (10/100/1000 Mbps)

Rear I/O

DisplayPort1x 20Pin DP connector (Female)
HDMI1x 19Pin HDMI connector (Female)
DVI1x 20Pin DVI-I connector (Female)
Ethernet2x RJ45 Gigabit Ethernet LAN Interfaces
USB4x USB3.1
Serial Port1x RS-232
Audio Port1x Line-Out, 1x MIC-In connector
DC-IN1x 4P Rugged Terminal connector

Front I/O

Button1x Power Button w/Indicator LED
Indicator LED1x HDD LED
USB2x USB2.0 standard-A connectors
Serial Port1x RS-232 +1x RS232/422/485

Applications, Operating System

ApplicationsIndustrial and Military Platforms Requiring Compliance to MIL-STD-810

Unmanned Platform, Robotic, Smart Surveillance applications where Harsh Temperature, Shock, Vibration, Altitude, Dust and EMI Conditions.

Operating SystemWindows 10 64 bit

Ubuntu16.04, Ubuntu14.04, Fedora 28



Dimension (W x D x H)308 x 149 x 65.2 mm
Weight3.21 Kg
ChassisAluminum Alloy, Corrosion Resistant.
FinishAnodic aluminum oxide (Color Iron gray)
CoolingNatural Passive Convection/Conduction. No Moving Parts
ConnectorsDC-IN : PHOENIX CONTACT 1776715 RJ45 Ethernet :




HDMI + DP : JKCR Display and HDMI Female

Ingress ProtectionDust Proof (Similar to IP50)


MIL-STD-810G TestMethod 507.5, Procedure II (Temperature ® Humidity)

Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock)

Method 516.6 Shock-Procedure I Operating (Mechanical Shock)

Method 514.6 Vibration Category 24/Non-Operating (Category 20 ® 24, Vibration)

Method 514.6 Vibration Category 20/Operating (Category 20 ® 24, Vibration)

Method 501.5, Procedure I (Storage/High Temperature)

Method 501.5, Procedure II (Operation/High Temperature)

Method 502.5, Procedure I (Storage/Low Temperature)

Method 502.5, Procedure II (Operation/Low Temperature)

Method 503.5, Procedure I (Temperature shock)

Operating Temperature-40°C to 60°C (ambient with 0.7m/s airflow)
Storage Temperature-40°C to 85°C
EMCCE and FCC compliance




SR10_Vibration_Test.pdf (1.19 MB)1.19 MB
SR10_Shock_Test.pdf (1.19 MB)1.19 MB