SK518 COM HPC Carrier Board-Server

COM-HPC Server Size D Carrier Board with PCIe/104, Slim-SAS Expansions Extreme Temperature -40°C to 85°C

 

  • COM-HPC Server (D) Support Ampere Altra/Intel Ice-Lake HCC
  • Intel Ice Lake Xeon D-2796TE, D-2775TE, D-2752TER
  • PCIe/104 Express Expansion Slot for Rugged StackPC
  • Multi-Expansion Slots :                                                
    4x Slim-SAS(Vertical)
    (2 x PCIe Gen4 x 4 / 2 x PCIe Gen4 x 8)
    1x mPCIe(Full Size)
    2x M.2 2280 M-Key(PCIe Gen4 x 4)
  • I/O : 2x GbE, 4x 10GbE, 1x VGA, 2x SATAIII, 2x COM(RS232), 4x USB3.0, 2x USB2.0
  • 12V DC Input
  • Dimension : 350 mm x 210 mm
  • Extreme Temperature -40°C to 85°C

Intel Gold

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Technical Profile

Introduction

In the ever-evolving landscape of high-performance embedded computing, a groundbreaking leap forward takes center stage: meet the 7StarLake COM-HPC Server Size D Solution SK518-SDHSE. This revolutionary marvel, propelled by the formidable Intel Xeon D HCC processor (20 Cores) and the powerhouse Nvidia RTX A4500 MXM (5,888 CUDA Cores), transforms the essence of your computing journey. Redefining the boundaries of server-class computing power, the SK518-SDHSE effortlessly navigates through compute-intensive workloads in AI Targeting and Vision analysis, swiftly processing vast unstructured data within tight timelines.

What truly distinguishes the SK518-SDHSE is its capacity to support up to 2 x 100GbE, creating a seamless web that interconnects computing nodes and sensors with virtually zero latency—ensuring your projects operate at the speed of thought. Yet, there’s more: boasting an exceptional blend of PCIe/104 architecture, two M.2 expansion slots, and four Slim SAS interfaces (2 x PCIe Gen4 x 8 and 2 PCIe Gen4 x 4), the SK518-SDHSE offers unparalleled flexibility, empowering you to shape fully-featured projects in ways previously unimaginable. Step into the future of embedded computing with the SK518-SDHSE and elevate your possibilities.

 

Efficiency Product Design

 

COM-HPC Block Diagram

 

Raw Power, Unmatched Performance

 

Intel Ice Lake Xeon D HCC processorIntel Ice Lake Xeon D HCC processor

Empower your projects with the SK518’s Xeon D 20 Cores processor and 768GB DDR4 memory, delivering unparalleled computational throughput. Ideal for AI-targeting and object detection, experience unmatched efficiency in handling demanding workloads.

 

Nvidia GA104-based RTX A4500 MXMNvidia GA104-based RTX A4500 MXM

Elevate data processing with the SK518’s Nvidia GA104-based MXM, housing up to 5,888 CUDA Cores. From EO/IR to thermal cameras and 3D radar, the SK518 excels in transforming visual data into actionable insights for superior project outcomes.

 

Ready For Harsh Environment

 

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7StarLake COM-HPC has the capability to operate in harsh environments, with the ability to withstand an extended temperature range from -40°C to 85°C. Thanks to its outstanding computing capability and efficient thermal design, SK518 is highly suitable for industrial, military/aerospace, and transportation applications, representing an efficient product design.

 

Block Diagram

 

SK518
SK518 COM HPC Size E

Specifications

System

 

CPUAmpere Altra : Up to 80 Arm-based cores at 175W TDP

Intel ICE-Lake HCC : Up to 20 cores at 118W TDP

GPU Module OptionsNVIDIA® RTX A4500, 115W, 16GB GDDR6, 5,888 CUDA Cores

NVIDIA® RTX A2000, 60W, 8GB GDDR6, 2,560 CUDA Cores

Intel® Arc™ A370M, 30-50W, 4GB GDDR6, 8Xe Cores

Intel® Arc™ A730M, 80-120W, 12GB GDDR6, 24Xe Cores

Memory typeDDR4 R-DIMMs up to 768GB
ChipsetOn CPU Module
StorageSlimSAS/M.2/SATA interface
WatchdogOn CPU module :

1-255 sec. or 1-255 min.

software programmable and can be generate system reset.

 

Expansion Slot

PCIe/104 (Type2)1x (2*PCIe Gen3 x 4、4*PCIe Gen3 x 1、2*SATA)
SlimSAS (Vertical)2x (PCIe Gen4 x 8)
SlimSAS (Vertical)2x (PCIe Gen4 x 4)
MiniPCIe (Full Size)1x (PCIe Gen3 x 1)
M.22x (M.2 2280 M-Key) (PCIe Gen4 x4)
 

Display

ChipsetOn CPU Module / AST2510
VGA1x
 

Ethernet

Chipset1x Intel® I210iT

1x C827

IPMIAST2500 by request
 

External I/O

VGA1x
USB3.04x
10GbE4x
GbE2x
 

Internal I/O

USB2.02x (Header)
DIDO1x (4in/4out)
SATAIII2x
SATA Power2x
Serial2x (RS232)
SM BUS/I2C BUS1x
LPC1x
System Fan1x
CPU Fan1x
Front Panel Control1x
Power Connector1x (2x 4-pin terminal block)
 

Mechanical and Environmental

Form FactorCOM-HPC Carrier Server Size D
Power Type12V DC-IN
Dimension350 mm x 210 mm
Operating Temperature-40°C to 85°C
Storage Temperature-40°C to 85°C
Relative humidity10% to 90%, non-condensing
 

Standard Compliance

Standard ComplianceCE/FCC
 

OS

OSOn CPU Module

Order Information