Mezzanine COM Express Type 6 Carrier Board with MXM , PCI/104 Express Expansion


  • COM Express Type 6 Support Intel® 9th Coffee Lake-H Processor
  • Standard MXM Type 3.1 Support NVIDIA® Quadro® RTX
  • PCI/104 Express Expansion Slot for Modular Open Structure
  • Multi-Expansion Slots include Dual Mini PCIe Express Slots, 1x M.2 Slot
  • Extreme Temperature Support -40°C to 85°C
  • 2x DP, 1x LVDS, 4x COM, 6x USB, 2x miniPCIe, 1x M.2, 2x SATA
  • 9V~36V DC-IN

Intel Gold

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Technical Profile


Computer-On-Module (COM) is a highly integrated board with CPU, chipset, memory, and peripherals designed into a component module. COM Express Type 6 has become the most versatile and most scalable COM standard supporting everything from small-scaled and cost-sensitive applications up to high-end computing and graphics-intensive solutions.

7StarLake’s SK513-T6 COM Express defines Open Scalable Modular Architecture and pin-out Type 6 platform which is ensuring amazing computing performance and offering a broad range of I/O interfaces including intense graphics support, Digital Display Interfaces (Display Port, HDMI) and super-fast USB 3.0 to serve all kind of different application requirements.

513SK513-T6 features a range of Intel processors, including Intel 11th Tiger Lake-H, 9th Coffee Lake-H. From low power consumption to high performance processing power, SK513-T6 is built to suit a wide range of computing applications from signal processing to unmanned vehicles.

Additionally, SK513-T6 is purposely designed to supported wide range temperature from -40°C to 85°C, which is perfectly suitable for withstanding harsh environmental conditions in military, aerospace, and transportation industry.


Coffee Lake-H


Rich Expansion Slot

SK513-T6 provides rich expansion to make the whole solutions easier. We could use PCIe 104 related product SK506, SK303 , SK1050 and SK1660:

506P_0_0.png SK506P_2_0_1.png



StackPC-FPE form factor – PCIe/104 stackable bus structure – Reliable Ethernet technology from Intel i350-AM4 controllers – Total 6 independent LAN connections (2 from host board, 4 from Intel controllers) – Flexible options for Ethernets through RJ45 or 10 pin-headers – High-performing bridgeless design supporting PCI Express Gen 2.1 5GT/s – Extended temperature -40°C to 85°C


  • SK401:

  1. StackPC form factor –
  2. PCIe/104 stackable bus structure –
  3. Reserve PCI/104 connector for different stacking criteria –
  4. Extended temperature -40°C to 85°C



  • SK303:

  1. PCI/104-Express, PCI & PCIe connectors (w/StackPC design)
  2. PCIe/104 stackable bus structure –
  3. PCIe to PCI adapter function –
  4. COM: 4 x RS232/422/485 with 5V/12V selectable and isolation function –
  5. Extended Temp.: -40°C to 85°C


  • NVIDIA® Quadro® RTX5000 MXM 3.1 Graphics Module:

  1. Powered by NVIDIA® Quadro® RTX5000
  2. MXM 3.1Type-B Module
  3. 256-bit, 16GB GDDR6 Memory
  4. 3072 CUDA cores, 48 RT cores, and 384 Tensor cores
  5. 9.4 TFLOPS peak FP32 performance
  6. Support up to 4 DP 1.4b displays, 110W TGP
Nvidia RTX 5000 MXM
Nvidia RTX 5000 MXM
  • NVIDIA® Quadro® RTX3000 MXM 3.1 Graphics Module:

  1. Powered by NVIDIA® Quadro® RTX3000
  2. MXM 3.1Type-B Module
  3. 192-bit, 6GB GDDR6 Memory
  4. 1920 CUDA cores, 30 RT cores, and 240 Tensor cores
  5. 5.3 TFLOPS peak FP performance
  6. Support up to 4 DP 1.4a displays, 80W TGP



NVIDIA® GTX 1050 Ti(CUDA Cores: 768)/GTX1060 (CUDA Cores: 1280) GPU. Designed for Driverless Vehicle

  • Intel® 7th Gen. Core i7-7820EQ
  • 2 x DDR4 SO-DIMM up to 32GB
  • MXM Graphic Card support
  • 2 x RJ45 LAN, 6 x USB
  • 2 x 2.5″ Easy swap SSD/HDD Tray
  • 2 x I/O Expansion Design
  • Extended Temperature -20°C to 60°C
  • NVIDIA® GTX950M (CUDA Cores: 640)/GTX1050(CUDA Cores: 640)/GTX 1050 Ti(CUDA Cores: 768)/GTX1060 (CUDA Cores: 1280) GPU


1.5 U Fanless Rugged GPU Server Intel® Xeon® D Processor, MXM Graphic Card, 9~36V DC-IN, Operating Temp -20°C to 50°C.
NVIDIA® GTX950M (CUDA Cores: 640)/GTX1050(CUDA Cores: 640)/GTX 1050 Ti(CUDA Cores: 768)/GTX1060 (CUDA Cores: 1280) GPU 

  • MIL-STD 810G Compliance
  • Intel® Xeon® D-1548 Processor
  • 2 x DDR4 SO-DIMM up to 32GB RAM
  • MXM Graphic Card support
  • 4 x Intel® Gigabit Ethernet
  • 2 x CAN bus
  • 4 x USB, 1 x COM
  • 9~36V DC-IN
  • Operating Temp. -20°C to 50°C
  • NVIDIA® GTX 1050 Ti(CUDA 768 GDDR5-4GB) / GTX1650 (CUDA 896 GDDR5-4GB) / GTX1660 Super (CUDA 1408 GDDR6-6GB)




COM Express CPU Options(Type6)Intel® Xeon® E-2276ME, 45W Coffee Lake 9th Gen, 6C , Freq. 2.8 /4.5 GHz, 12MB cache

Intel® Xeon® E-2276ML, 25W Coffee Lake 9th Gen, 6C , Freq. 2.0 / 4.2 GHz, 12MB cache

Intel® Core™ i7-9850HE, 45W Coffee Lake 9th Gen, 6C, Freq. 2.7 / 4.4 GHz, 9MB cache

Intel® Core™ i7-9850HL, 25W Coffee Lake 9th Gen, 6C, Freq. 1.9 / 4.1 GHz, 9MB cache

GPU Module OptionsNVIDIA® Quadro™ RTX 5000, 110W, 16GB GDDR6, 3,072 CUDA Cores

NVIDIA® Quadro™ RTX 3000, 80W, 6GB GDDR6, 1,920 CUDA Cores

COM Express CompatibilityCOM Express® Type 6


MiniPCIe Expansion2x Full-size mini PCIe (1 with mSATA supported)
M.2 Expansion1x 2280 M-key (SATA only)
PCIe/104 Expansion4x PCIe x1、1x PCIe x4、5x USB2.0、1x LPC、1x SPI


Display Port2x Display Port outputs from COM Express® , 4x outputs from GPU, 6 total
VGA1x output from COM Express® , 1x output from GPU
LVDS1x dual channel 18/24-bit LVDS


Gigabit Ethernet2x 10/100/1000 Ethernet Ports


USB4x USB3.0; 2x USB2.0
COM Port4x RS232/422/485
Audio1x Line-out, 1x MIC-In

Power System

Input Power_SYS9V~36V (4P Terminal Block)
Input Power_MXM12V (ATX 4P)
Power ConsumptionVaries per COM Express /MXM with different CPU and GPU models
RTC Battery3V CR2032

Mechanical and Environment

Dimensions190 x 185 mm
Operating Temperature-40 to 85°C
Storage Temperature-40 to 85°C
Relative Humidity10% to 90%, non-condensing

Standard Compliance

Standard ComplianceCE/FCC


OS SupportWindows®10 64-bit

Linux(Support by request)


SK513_COMe CPU Board_MXM GPU 3D PDF.pdf (5.68 MB)5.68 MB
Datasheet5.68 MB
Manual5.68 MB