SCH-3X1

IEC-61850-3 , IEEE-1613 Substation Fanless Computer, with Intel® Core™ 9th Gen. Coffeelake-R i7-9700TE Processor, Operating Temperature -20°C to 60°C

 

  • Intel® Core™ i7-9700TE
  • 2 x DDR4 2666MHz, SO-DIMM up to 64GB
  • 2 x 2.5”Easy swap SSD Tray
  • 2 x PCIe expansion slot (PCIe Gen3.0 x 8)
  • 2 x RJ45 LAN
  • 6 x USB3.0, 2 x USB2.0, 1 x DP , 1 x DVI-I , 1 x HDMI
  • 2 x RS232 / 422 / 485 (Support Power 5V / 12V)
  • Operation Temperture : -20°C to 60°C
Categories: ,

Technical Profile

Gateways are rugged communication devices collecting numerous data, such as metering, status, events and fault report from any protection device while sending this information upstream to a control center, transfering commands issued from the control center to other devices. One example of a particular need for gateways is in the energy industry. The energy industry requires specific types of devices using specific protocols. With PLCs/PACs becoming popular in these applications, gateways has grown into a necessary part of Substation Automation Systems, and its reliability may affect the safety of whole system at a station level.

 

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As a leading company specialized in energy related application, 7Starlake’s experienced team designed an extremely reliable Gateway system SCH-3X1. Powered by Intel 9th Gen. Core i7-9700TE processor, SCH-3X1 owns highly efficient processing capability to deal with a large amount of data delivering between IEC-61850 devices and the Control Center. In advantage of other outstanding features, such as 2 x LAN port and 2 x COM, SCH-3X1 is an undoubtedly best choice for Gateway application in Substation.

 

GPU

 

SCH-3X1 Rear IO

 

(1)Security Redundancy

Integrating TPM module, operating systems can require an authentication to protect keys, data or systems.

 

(2)Network Redundancy

PRP/HSR network is an efficient and cost effective solution to construct a seamless/bumpless communication infrastructure.

 

(3)Rich communication Interface

In advantage of SCH-3X1’s diverse I/O, 2 x COM (All support RS232/422/485), 6 x USB3.0, 2 x LAN, the SCH-3X1 system can meet all clients’ communication requirement.

 

(4)IEC-61850-3

IEC 61850 defines the communication protocols for intelligent electronic devices at electric substations. IEC-61850-3 defines the complete testing requirement for the equipment which conforms to the standard.

 

(5)IEEE-1613

Detail environment and testing requirements for communications networking devices in electric power substations.

 

(6)Extreme Operating Temperature

Ensure high reliability and stability while operating under a harsh environment such as temperature from -20°C up to 60°C

 

(7)Ultra Wide Voltage Support

9V-48V, a very wide range voltage of DC-input capability, allows users to adopt all kinds of working site and applications scenario.

 

Why IEC-61850 Is Necessary

Although there are lots of protocols worldwide for substation automation, IEC-61850 is the only one that supports systems networked together to perform intelligent transmission and distribution protection, monitoring, automation, metering, and control. The standardization of IEC-61850 enables the integration of the equipment and systems from different suppliers, reducing the burden on the configuration and maintenance of these systems. The protocol also meets utilities’ requirements for long-term system expandability. Thus, there are more and more electric companies perform power-system automation by using IEC-61850 protocol with Intelligent electronic devices (IED).

 

Substation Main Features3

Specifications

System

CPUIntel® 9th Core™ i7-9700TE, 8C, 1.8/2.8GHz, 12MB cache, TDP 35W
ChipsetIntel®C246
Memory TypeDDR4-2666MHz, 2 x 260-pin SO-DIMM, Max 64GB
Expansion Slot2 x PCIe 3.0 x 8
Storage Device2 x 2.5”Easy swap SSD Tray
 

Front I/O

Power Button1 x Power Button w/Indicator LED
LED1 x PWR LED ; 1 x HDD LDD
HDMI1 x HDMI 1.4
USB2 x USB3.0
 

Rear I/O

COM2 x RS232/422/485 (Support Power 5V/12V)
Ethernet2 x RJ45
USB4 x USB3.0, 2 x USB2.0
PS/21
SidplayPort1 x DP1.2
DVI-I1 x DVI-I
Terminal Block1 x 2Pin Terminal Block Remote Power ON/OFF

1 x 2Pin Terminal Block Remote Reset

1 x 4Pin Terminal Block External FAN connector

1 x 3Pin Terminal Block Power input

Audio1 x Mic-in, 1 x Line-out
DC-IN1 x 9~48V
 

Mechanical and Environment

Dimension( W x D x H )170 x 264 x 250 mm
System DesignFanless
MountingRackmount Cube
Operating Temp.-20°C to 60°C(35W CPU)
Storage Temp.-40°C to 85°C
Relative Humidity5% to 95%, non-condensing
 

OS support list

WindowsWindows 10 64 Bit
LinuxUbuntu14.04, Fedora 20/23, RedHat Linux EL 7.1/7.2(By Request)
 

Certification

EMCCE . FCC Certification
Green ProductRoHS, WEEE compliance

CPU

Intel® Core™ i7-9700TE Processor (up to 3.8 GHz, 8 cores)

Thermal Point Testing Temp.

-40°C

-20°C

0°C

+25°C

+50°C

+55°C

+60°C

CPU T-J1658687591
CPU Die11.838.671.97681.5
CPU Heat sink8.234.767.87277.3
Δ1=(TJ-Die)4.75.05.07.07.0
Δ2=(Die-Heat Sink)4.75.05.06.05.0
CPU Frequency (GHz)3.153.023.022.682.572.452.41

 

Intel® Core™ i7-8700T Processor (up to 2.4 GHz, 6 cores)

Thermal Point Testing Temp.

-40°C

-20°C

0°C

+25°C

+50°C

+55°C

+60°C

CPU T-J16779599100
CPU Die11.838.671.97681.5
CPU Heat sink8.234.767.87277.3
Δ1=(TJ-Die)4.75.05.07.07.0
Δ2=(Die-Heat Sink)4.75.05.06.05.0
CPU Frequency (GHz)2.832.852.662.972.262.182.19

 

Intel®i7-8700 Processor( up to 3.2 GHz,6 cores)

Test 50°C with air flow

Description

System Top Sink

CPU Die

CPU T-j

CPU Freq

100%CPU Loading
with Graphic50°C with hot air flow
71.468.81003.1 GHz
100%CPU Loading
without Graphic50°C with hot air flow
70.473.21003.2 GHz

 

Test 60°C with air flow

Description

System Top Sink

CPU Die

CPU T-j

CPU Freq

100% CPU Loading
with Graphic60°C with hot air flow
76.881.51002.99 GHz
100% CPU Loading
without Graphic60°C with hot air flow
7579.61003.15 GHz

 

Test 50°C with no air flow

Description

System Top Sink

CPU Die

CPU T-j

CPU Freq

100% CPU Loading
with Graphic50°C without air flow
7881.11003.05 GHz
100% CPU Loading
without Graphic50°C without air flow
7781.11003.06 GHz

Order Information

SCH-3X1

IEC-61850-3 , IEEE-1613 Substation Fanless Computer with Intel® Core™ i7-9700TE, 2 x 2.5” Easy swap SSD Tray, 2 x PCIe expansion slot, 2 x RJ45 LAN , 6 x USB 3.0 , 2 x USB 2.0 , 1 x PS/2, 1 x DP , 1x DVI,1 x HDMI , 2 x COM(RS232/422/485), 1 x Mic-in / 1 x Line-out, 9~48V DC-IN, 2Extend Temp -20 to 60°C

Download

Attachment

Size

SCH3X1_IEC61850_TEST REPORT – 0916.pdf (1.83 MB)1.83 MB
T210708D08-D (SCH-3X1) FCC Part 15 B.pdf (810.86 KB)810.86 KB
T210708D08-E (SCH-3X1) EN 55032&35.pdf (2.23 MB)2.23 MB
Verification – CE.pdf (147.62 KB)147.62 KB
Verification – FCC.pdf (146.95 KB)146.95 KB
SCH300_Vibration_Shock_Test_Report.pdf (1.58 MB)1.58 MB
SCH3X1.pdf (641.67 KB)641.67 KB
Datasheet
Manual