ROC286CC

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Technical Profile

Introduction

 

ROC286CC

 

7STARLAKE has been working on developing ruggedised sever for energy use. ROC286CC is the latest 1U fanless system designed for anti-aggression use. It is based on Intel® Coffeelake 14nm Core™ Q370 Chipset and can support up to 64GB of memory capacity. Moreover, redundant power DC-DC 9V~36V provides extra power support to the power plant so that it will not have to suffer from the unexpected shutdown. It is worth noting that what makes ROC286CC stand out is its application of conformal coating that for battling against harsh environment. With further advantages such as MIL-STD 810 anti-shock and vibration, we believe that ROC286CC is a best choice for clients that are looking for an ideal server to meet the requirements in harsh environment.

 

Key Features

ROC286CC_20210604-2_1.IU Fanless_2.jpg

1. 1U Fanless

Most 1U system is equipped with fan to conduct heat dissipation. As an ruggedised computer trailblazer in the industry, 7STARLAKE designed ROC286CC to be 1U fanless server for better portability and heat dissipation with the adoption of heat pipe.

 


 

2. Redundant DC-DC

ROC286CC is designed with power redundancy as most power plant is highly automotive, and any disruption will cost a huge amount of money. Power redundancy allows power plants to have back up even if one of the power experiences shutdown. Therefore, the potential risk of shutting down suddenly can be avoided.

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ROC286CC_Conformal Coating on PCB

3. Conformal Coating on PCB

In nuclear power plants that are located in seaside, salt, sand, dust, and fog can all damage the functionality and inner components. In order to protect the system, the PCB of ROC286CC is applied with conformal coating to prevent the system from being corroded but also provide protection against moisture, dust, chemicals, and temperature extremes.

 


 

4. Anti-Corrosion Painting on Aluminium Enclosure

Because power plants are commonly seen by sea, rust can develop on iron and steel when they are subjected to water and air and consequently lead to critical power failure. In order to block such deterioration to the system, ROC286CC is applied with the proper anti-corrosion painting on aluminium enclosure to provide it with essential protection against the deteriorating effects that occur from exposure to water.

ROC286CC_Anti-Corrosion Painting

ROC286CC I/O Placement

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Specification

System

CPUSocket LGA 1151 for Intel® Core i7/i5/i3/Celeron® (Supports up to 65W) Intel® 8th/9th Processor
Memory type2x DDR4 SO DIMM up to 64 GB
ChipsetIntel® Q370 Chipset
Storage Device2x SATAIII, 2.5” SSD
Expansion Slot1x PCIe x16

1x M.2 (Key M, 2242/2280) with PCIe and SATA Signal

 

Storage

HDD/SDD2x 2.5” SATA HDD/SSD easy swap tray
 

Ethernet

EthernetIntel® I210 & I219LM GbE LAN (support 10/100/1000 Mbps for x2 RJ45 ports)
 

Rear I/O

Display Port2x
HDMI1x
Ethernet2x RJ45 Intel® I210 & I219LM GbE LAN (support 10/100/1000 Mbps)
Audio2x 3.5mm Audio Jacks (1x MIC, 1x Line-Out)
COM2x RS232/422/485 ( 422/485 select by BIOS)
USB Port4x USB 3.1(10Gb/s)
DC-IN9V~36V DC-IN (2X 4P Terminal Block)
 

Front I/O

Button1x Power Button w/Indicator LED
Indicator LED1x HDD
USB Port2x USB 2.0
Easy Swap SSD Tray2x
 

Applications, Operating System

ApplicationsCommercial and Industrial Platforms, Embedded Computing, Process Control

Intelligent Automation and manufacturing applications

Operating SystemWindows 10 64Bit

Ubuntu13.04, Ubuntu13.10, Ubuntu14.04, Fedora 20

 

Physical

Dimension (W x D x H)430 x450 x 44 mm
Weight8.92Kg
ChassisSECC
HeatsinkAluminum Alloy, Corrosion Resistant
FinishAnodic aluminum oxide
 

Environmental

MIL-STD-810G TestMethod 507.5, Procedure II (Temperature & Humidity)

Method 501.5, Procedure I (Storage/High Temperature)

Method 501.5, Procedure II (Operation/High Temperature)

Method 502.5, Procedure I (Storage/Low Temperature)

Method 502.5, Procedure II (Operation/Low Temperature)

Method 503.5, Procedure I (Temperature shock)

Green ProductRoHS compliance
Operating Temperaturew/o Graphic Card (ET: -20 to 60°C; UT: -30 to 70°C) ; w/Graphic Card (0 to 50°C)
Storage Temperature-30 to 85°C
Relative Humidity5% to 95%, non-condensing
EMCCE and FCC compliance

Thermal Solution

Dual Side Thermal Solution, Fanless Design for 1U Slim Size

 

With combination of high CPU computing power and graphic GPU performance generate numerous heat, 7STARLAKE emphasizes on providing exceeding thermal design guarantee system offers superior performance under critical environment. Based on our experience, ROC286 adopts dual side thermal solution, with copper heat spreader directly touches the heat source components processor and graphic GPU to absorb the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid which can provide high efficiency heat transmission, the aluminum heat sink dissipates the heat into surrounding air promptly. Both side thermal solution is mainly for processor. With unique thermal design, 7STARLAKE is capable to integrate high power consumption CPU into 1U such slim size fanless system.

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