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Technical Profile


ROC270A-DD is an industrial 19” 1U Rack-mount rugged fanless server. Based on Intel® Xeon W-1270TE Comet Lake-S Processor W480E Chipset, ROC270A-DD can be processed by 10th Processor (up to 35W). It supports up to 64GB of memory capacity, 1 x PCIe x16 Slot 1 x M.2(Key M, PCIe x4 and SATA) Expansion Slot, 6 x USB, 2 x DisplayPort, 1 x HDMI, 2 x LAN, 1 x Line-out/Mic-in, 2 x COM, 2 x 2.5” SATA HDD/ SSD Easy Swap Tray.

With further advantages, for example, HDD/ SSD easy swap tray and multi-expansion slot, we believe that ROC270A-DD  is a best choice for those, who are looking for an ideal server to meet the requirements of commercial and industrial platforms, process control, intelligent automation and manufacturing applications.



High Performance ProcessorSocket LGA1200 for Intel® Xeon W-1270E(80W/8C/16T)
Memory type2x SO-DIMM DDR4 2933 MHz up to 64GB
ChipsetIntel® W480E Chipset
Expansion Slot1x PCIex16
1x M.2 (Key M, 2242/2260/2280) with PCIex4 and SATA
1x M.2 (Key E, 2230) with PCIe x1, USB 2.0 and CNVi for Wireless
1x M.2 (Key B, 3042 / 3052) with PCIe x1 / USB 3.2 Gen1 /USB2.0 and SIM for 4G / 5G


HDD/SDD2x 2.5” SATA HDD/SSD easy swap tray (up to 2TB for each)


EthernetLAN1: Intel® I225LM with 10/100/1000/2500 Mbps
LAN2: Intel® I219LM with 10/100/1000 Mbps

Rear I/O

Display Port2x DP
Ethernet1x 2.5GbE / 1x GbE
Audio1x Mic-in / 1x Line-out
COM2x RS232/422/485
USB Port4x USB 3.1
Speaker Out1x  3W amplifier
DC-IN110V DC-IN Terminal Block

Front I/O

Button1x Power Button w/Indicator LED
Indicator LEDHDD/SSD
USB Port2x USB 2.0
Easy Swap SSD Tray2x

Applications, Operating System

ApplicationsCommercial and Industrial Platforms, Embedded Computing, Process
Control, Intelligent Automation and manufacturing applications
Operating SystemWindows 10 64Bit
Linux (support by request)


Dimension (W x D x H)430 x 450 x 44.4 mm
HeatsinkAluminum Alloy, Corrosion Resistant
FinishAnodic aluminum oxide


MIL-STD-810G TestMethod 507.5, Procedure II (Temperature & Humidity)
Method 501.5, Procedure I (Storage/High Temperature)
Method 501.5, Procedure II (Operation/High Temperature)
Method 502.5, Procedure I (Storage/Low Temperature)
Method 502.5, Procedure II (Operation/Low Temperature)
Method 503.5, Procedure I (Temperature shock)
Green ProductRoHS compliance
Operating Temperature-20 to 60°C
Storage Temperature-40 to 85°C
Relative Humidity5% to 95%, non-condensing
EMCCE and FCC compliance

Therma Solution

 Dual side thermal solution, fanless design for 1U slim size


With combination of high CPU computing power and graphic GPU performance generate numerous heat, 7STARLAKE emphasizes on providing exceeding thermal design guarantee system offers superior performance under critical environment. Based on our experience, ROC270A-DD adopts dual side thermal solution, with copper heat spreader directly touches the heat source components processor and graphic GPU to absorb the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid which can provide high efficiency heat transmission, the aluminum heat sink dissipates the heat into surrounding air promptly. Both side thermal solution is mainly for processor. With unique thermal design, 7STARLAKE is capable to integrate high power consumption CPU into 1U such slim size fanless system.