ROC254A

1U Short Depth Fanless Server with XEON-DE x 16 Cores, 100V to 240V AC-in ,Intel® Xeon® D-1541/D1587

 

  • 1U 380 mm Short Depth Fanless Rugged Server
  • MIL-STD 810G Compliance
  • Intel® Xeon® D-1587 (16xC) / D-1541(8xC) Processor
  • Up to 128GB Registered ECC RDIMM DDR4-2400MHz
  • 1x VGA , 6x USB Ports ,2x Gigabit Ethernet, 1x IPMI
  • 2x 10GbE ( By Request )
  • 100V ~ 240V AC-input
  • Optional for 220VAC/DC Redundant PSU
  • Dimension : 380 x 440 x 44 mm (DxWxH)
  • Extended Temperature -20°C to 60°C

Intel Gold

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Technical Profile

Introduction

ROC254A, 19″ 1U 380 mm, short depth Rackmount Fanless server is driven by Intel® Xeon®D-1587 (1.7GHz, 16 Cores, 32 Threads, 24MB Cache), providing superior performance in data processing and supporting high flexibility in application.

With 44mm of height and 380mm of short depth, it’s fit for rack mount, wall mount, and standalone application. Conduction cooled heat pipes and heat spreader are constructed on both component and system levels. Honeycomb vents are designed on the top, sides and back to allow natural convection cooling.

ROC254A’s power design is for 100V – 240V AC-in, which allows a flexible usage. ROC254A meets the demands of industrial embedded applied computing applications including the industrial PC platform, transaction, multimedia workstation, vehicle PC, and network server.

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System main board

 

With combination of high CPU computing power and graphic GPU performance generate numerous heat, 7STARLAKE emphasizes on providing exceeding thermal design guarantee system offers superior performance under critical environment. Based on our experience, ROC254A adopts dual side thermal solution, with copper heat spreader directly touches the heat source components processor and graphic GPU to absorb the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid which can provide high efficiency heat transmission, the aluminum heat sink dissipates the heat into surrounding air promptly. Both side thermal solution is mainly for processor. With unique thermal design, 7STARLAKE is capable to integrate high power consumption CPU into 1U such slim size fanless system.

 

1. Motherboard Features

The motherboard offer infrastructure optimization, by combining the performance and advanced intelligence of Intel® Xeon® processors into a dense, lower-power system-on-a-chip. With server-class reliability, availability and serviceability (RAS) features now available in an ultra-dense, low-power device, it will be able to deliver balanced compute, storage and intelligent edge networks and appliances. These advanced technology building blocks offer the best work load optimized solutions and long life availability with the Intel® Xeon® processor D family, with up to 128GB DDR4 ECC RDIMM operating at 2133MHz, USB 3.0 I/O, six SATA3.0 storage or dual 10 GbE LAN networking ports.

 

2. AC-in Power Design

ROC254A supports 100 to 240V AC-in power, allows the system to be utilized in extensive power types. The design of wide power range keeps the system’s reliability and you can expect longer life-span as well. Sudden drop or surge of power posts absolutely no threat to this smart system.

 

3.Ultra Slim Size

ROC254A is a compact yet capable industrial grade fanless system. With only 380mm in depth and 44mm (1.73″) in height, this 1U size system is superior in its compact yet durable exterior design and highly functional interior structure.

Specifications

Operating Temp.

 

-20°C to 60°C
 

System

CPUIntel® Xeon® D-1587 (1.7GHz, 16 Cores, 32 Threads, 24MB Cache)

Intel® Xeon® D-1541 (2.1GHz, 8 Cores, 16 Threads, 12MB Cache)

ChipsetSoC, integrated with CPU
Memory TypeUp to 128GB ECC RDIMM DDR4-2400MHz
Expansion Slot1x PCIex16

1x M.2 PCIe 3.0 x4 slot, M.Key for 2242/2280 SSD, SATA III support

Storage Device2x 2.5″ Solid State Disk (SSD)
Ethernet Chipset1x Intel® I350-AM2 GbE LAN
(support 10/100/1000 Mbps for RJ45 port)
 

Rear I/O

Display Port1 (Max Resolution 4096*2304)
Ethernet2x RJ45 Gigabit Ethernet LAN Interfaces
1x IPMI LAN Interface
USB Port2x USB3.0 standard-A connectors
2x USB2.0 standard-A connectors
AC-IN1x IEC C14 Plug
 

Front I/O

Button1x Power Button w/Indicator LED
Indicator LED1x HDD LED
USB2x USB2.0 standard-A connectors
Easy Swap SSD Tray2x 2.5 SSD Easy Swap Tray
 

Power Requirement

Power Input100V to 240V AC-in, 200W max
 

Physical

Dimension(WxDxH)430 x 380 x 44.6 mm
 

Environmental

Operating Temp.-20 to 60°C
Storage Temp.-40 to 85°C
Relative Humidity10% to 90%, non-condensing

Order Information

ROC254A

MIL-STD-810G, 19″ 1U Short Depth Fanless Server with Intel® Xeon® D-1541 Processor, 1x VGA, 1x IPMI , 2x Gigabit Ethernet, 6x USB Port

Thermal Solution

Dual side thermal solution, fanless design for 1U slim size

With combination of high CPU computing power and graphic GPU performance generate numerous heat, 7STARLAKE emphasizes on providing exceeding thermal design guarantee system offers superior performance under critical environment. Based on our experience, ROC254A adopts dual side thermal solution, with copper heat spreader directly touches the heat source components processor and graphic GPU to absorb the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid which can provide high efficiency heat transmission, the aluminum heat sink dissipates the heat into surrounding air promptly. Both side thermal solution is mainly for processor. With unique thermal design, 7STARLAKE is capable to integrate high power consumption CPU into 1U such slim size fanless system.

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