ROC250-D17

Military 1U Short Depth Xeon DE (Ice Lake) Fanless Server

 

  • Ultra-High Performance Intel® Xeon® Ice Lake D-1749NT, 10 Cores
  • MIL-STD 810 Vibration, Shock, Thermal
  • Short Depth 380mm, Fanless Cooled
  • Up to 128GB RDIMM/64GB UDIMM, 2CH DDR4 2933MHz in 2 Slots
  • 4x NVMe (Gen 4.0) U.2
  • 2x 25Gigabit Ethernet, 2x 10Gigabit Ethernet, 1 x IPMI
  • 1x VGA , 2x USB 3.0 Ports ,1x PCIe 4.0 x 8 Expansion Slot
  • Extended Temperature -20°C to 60 °C

Intel Gold

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Technical Profile

Introduction

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Intel® Xeon® D-1700 and D-2700 processors are high-performance SoCs with integrated Ethernet in high-density Ball-Grid Array packages. They deliver server-class computing, hardware-based security, and high-bandwidth I/Os for embedded and rugged applications at the edge.​

The Intel® Xeon® D-1700 and D-2700 processors with up to 20 cores, with Integrated AI acceleration, support for hard-real-time workloads, extreme temperature range and industrial use conditions.1 This makes them ideal for demanding applications in high-bandwidth video analytics, as well as manufacturing, aerospace, etc.

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Intel® Xeon® D processors, enhanced for IoT, are a high-density platform that packs server-class computing and I/Os, plus accelerated AI, into compact BGA packages for soldered-down embedded and rugged designs. ​

Extended operating temperature ranges and industrial-class reliability make Intel® Xeon® D-1700 and D-2700 SoCs ideal for high-performance rugged equipment and sealed fanless devices that must run nonstop in the toughest environments.​

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MAIN FEATURE

  • Ultra-High Performance Intel® Xeon® Ice Lake D-1749NT (10xC)
  • MIL-STD 810 Vibration, Shock, Thermal
  • Short Depth 380mm, Fanless Cooled
  • Intel® Xeon® ICELAKE-D LCC D-1749NT 10 Cores Processor
  • Up to 128GB RDIMM/64GB UDIMM, 2CH DDR4 2933MHz in 2 Slots
  • 4xNVMe (Gen 4.0) U.2
  • 2 x 25Gigabit Ethernet, 2 x 10Gigabit Ethernet, 1 x IPMI
  • 1 x VGA , 2 x USB 3.0 Ports ,1 x PCIe 4.0 x 8 Expansion Slot
  • Extended Temperature -20 to 60 °C

 

MIL-STD Environment

  • Operating Temperature High: 50°C, MIL-STD-810G, Method 501.5, Procedure I
  • Operating Temp Low: 0°C, MIL-STD-810G, Method 502.5, Procedure I
  • Non-Operating Temperature High: 70°C, MIL-STD-810G, Method 501.5, Procedure II
  • Non-Operating Temperature Low: -40°C, MIL-STD-810G, Method 502.5, Procedure II
  • Operating Altitude: Up to 15,000 ft., MIL-STD-810G, Method 500.5
  • Non-Operating Altitude: Up to 45,000 ft., MIL-STD-810G, Method 500.5
  • Humidity: MIL-STD-810G, Method 507.5, Procedure Ib (Natural Cycle B3)
  • Shock: MIL-STD-810G, Method 516.6, 30 g’s, Saw-tooth, 11ms & MIL-DTL-901E, Grade A, Class II; Type B
  • Vibration: MIL-STD-167, Type I, Deck Mounted Equipment
  • EMI/EMC: MIL-STD-461F, RE101, RE102 (Shipboard Level 1), RS103, CE101, CE102, CS101, CS114, CS116
  • Airborne Noise: MIL-STD-740-1 compliance: 43.7dBA (Idle), 52.5dBA (50%), 54.6dBA (80%).

Specifications

System

 

High Performance ProcessorIntel® Xeon® ICELAKE-D LCC Processor D-1749NT (Frequency 2.5GHz) 10-Core,20 Thread Support
Memory typeUp to 128GB RDIMM/64GB UDIMM, 2CH DDR4 2933MHz
ChipsetSystem on Chip
Expansion Slot1x PCI-E 4.0 x 8
 

Display

VGAResolution up to 1920×1200@60Hz
 

Storage

Storage Device4x NVMe Gen 4.0
 

Ethernet

Ethernet2x Intel 25GbE SFP28 (SoC)

2x 10GBase-T (Intel X550-AT2)

 

Front I/O

Button1x Power Button w/Indicator LED
Indicator LED1x HDD LED
SSD Tray4x NVMe Gen 4.0
 

REARI/O

Ethernet2x SFP28 25Gigabit Ethernet LAN Interfaces

2x RJ45 10Gigabit Ethernet LAN Interfaces

1x IPMI LAN Interface

VGA Port1x DB15 connector
USB Port2x USB3.0 standard-A connectors
AC-IN1x IEC C14 Plug
 

Power Requirement

Power Input100V~240V AC-IN

MIL-461 18V~36V DC-IN

 

Applications, Operating

ApplicationsCommercial and Military Platforms Requiring Compliance to MIL-STD-810G

Embedded Computing, Process Control, Intelligent Automation and

manufacturing applications where Harsh Temperature, Shock, Vibration,

Altitude, Dust and EMI Conditions.

Used in all aspects of the military

Operating SystemWindows 10 64Bit, Windows Server 2008 R2, Windows Server 2012 R2

Ubuntu14.04, Fedora 20/23, RedHat Linux EL 7.1/7.2, Vmware ESXi 6.0, ESXi 6.5

 

Physical

Dimension (W x D x H)430 x 380 x 44.6 mm
Weight5.75kg(12.68lbs)
ChassisSECC
FinishAnodic aluminum oxide (Black)
CoolingNatural Passive Convection/Conduction. No Moving Parts
Ingress ProtectionDust Proof (Similar to IP40)
 

Environmental

MIL-STD-810G

Test

Method 507.5, Procedure II (Temperature & Humidity)

Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock)

Method 516.6 Shock-Procedure I Operating (Mechanical Shock)

Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24, Vibration)

Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration)

Method 501.5, Procedure I (Storage/High Temperature)

Method 501.5, Procedure II (Operation/High Temperature)

Method 502.5, Procedure I (Storage/Low Temperature)

Method 502.5, Procedure II (Operation/Low Temperature)

Method 503.5, Procedure I (Temperature shock)

Operating Temperature-10 to 60°C (ambient with 0.7m/s airflow)
Storage Temperature-40 to 85°C
EMCCE and FCC compliance

Order Information

ROC250-D17-10C-12V-4N

MIL-STD-810G 19″ 1U Short Depth Fanless Server with Intel® Xeon® ICELAKE-D LCCD-1749NT Processor, 1 x VGA, 1 x IPMI , 2 x25 Gigabit Ethernet, 2 x10 Gigabit Ethernet, 2 x USB 3.0 Port, DC 12V, 4NVMe

 

ROC250-D17-10C-18V-2N

MIL-STD-810G 19″ 1U Short Depth Fanless Server with Intel® Xeon® ICELAKE-D LCCD-1749NT Processor, 1 x VGA, 1 x IPMI , 2 x25 Gigabit Ethernet, 2 x10 Gigabit Ethernet, 2 x USB 3.0 Port, MIL-STD-461 EMI 18 ~36V, 2NVMe

 

ROC250-D17-10C-AC-2N

MIL-STD-810G 19″ 1U Short Depth Fanless Server with Intel® Xeon® ICELAKE-D LCCD-1749NT Processor, 1 x VGA, 1 x IPMI , 2 x25 Gigabit Ethernet, 2 x10 Gigabit Ethernet, 2 x USB 3.0 Port, AC 100~240V, 2NVMe

 

ROC250-D17-8C-12V-4N

MIL-STD-810G 19″ 1U Short Depth Fanless Server with Intel® Xeon® ICELAKE-D LCCD-1736NT Processor, 1 x VGA, 1 x IPMI , 2 x25 Gigabit Ethernet, 2 x10 Gigabit Ethernet, 2 x USB 3.0 Port, DC 12V, 4NVMe

 

ROC250-D17-8C-18V-2N

MIL-STD-810G 19″ 1U Short Depth Fanless Server with Intel® Xeon® ICELAKE-D LCCD-1736NT Processor, 1 x VGA, 1 x IPMI , 2 x25 Gigabit Ethernet, 2 x10 Gigabit Ethernet, 2 x USB 3.0 Port, MIL-STD-461 EMI 18 ~36V, 2NVMe

 

ROC250-D17-8C-AC-2N

MIL-STD-810G 19″ 1U Short Depth Fanless Server with Intel® Xeon® ICELAKE-D LCCD-1736NT Processor, 1 x VGA, 1 x IPMI , 2 x25 Gigabit Ethernet, 2 x10 Gigabit Ethernet, 2 x USB 3.0 Port, AC 100~240V, 2NVMe

 

ROC250-D17-4C-12V-4N

MIL-STD-810G 19″ 1U Short Depth Fanless Server with Intel® Xeon® ICELAKE-D LCCD-1718T Processor, 1 x VGA, 1 x IPMI , 2 x25 Gigabit Ethernet, 2 x10 Gigabit Ethernet, 2 x USB 3.0 Port, DC 12V, 4NVMe

 

ROC250-D17-4C-18V-2N

MIL-STD-810G 19″ 1U Short Depth Fanless Server with Intel® Xeon® ICELAKE-D LCCD-1718T Processor, 1 x VGA, 1 x IPMI , 2 x25 Gigabit Ethernet, 2 x10 Gigabit Ethernet, 2 x USB 3.0 Port, MIL-STD-461 EMI 18 ~36V, 2NVMe

 

ROC250-D17-4C-AC-2N

MIL-STD-810G 19″ 1U Short Depth Fanless Server with Intel® Xeon® ICELAKE-D LCCD-1718T Processor, 1 x VGA, 1 x IPMI , 2 x25 Gigabit Ethernet, 2 x10 Gigabit Ethernet, 2 x USB 3.0 Port, AC 100~240V, 2NVMe

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