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Technical Profile

Related System:1U Rack Mount ROC236A

7STARLAKE rugged box PCs provides flexible options in terms of processors performance, I/O requirements as well as different industrial applications. 7STARLAKE develops 1U rack mount fan-less system featuring Core i7 processor high computing performance with only 15W low power consumption. The fanless design ensures silent operation and eliminates the possibility of gathering dust and external debris inflow which may cause system failure over time. ROC236A integrates wide range DC input from 9V to 36V with extended temperature operation up to +70°C without CPU throttling which makes it a powerful computing model specially designed for automatic control and base station management in automation applications.


ROC236A main board: 3.5” SBC – OXY5336A


1.Intel Core i7 CPU soldering onboard

ROC236A is based on 3.5” SBC—OXY5336A, powered by Intel Ivy Bridge i7-3517UE plus HM76 chipset (QM77 by request) soldered onboard. The processor supports 1.7GHz dual core but consumes only 17W which is relatively low power consumption. With CPU soldering onboard, there is less conduction of heat and high density interconnection between the motherboard and the component, which reduces the MB from the crisis of overheating. Apart from overheating, soldering onboard also provides the best level of shock and vibration protection, removing the unnecessary concern about poor connection that CPU socket type may bring. Generally speaking, it is rare to find 1U rackmount system that is driven by Intel core i7 processor since it is hard to completely dissipate the heat generated by Intel core i7 CPU. Therefore, ROC236A is comparatively valuable with its high computing power but fanless solutions.


2.Special rear I/O placement

Viewing that COM port, VGA port and power connector are tilt-out connectors that protrude from the surface, 7STARLAKE deliberately arranges these I/O to be placed at rear side; and further makes the rear I/O configuration is placed inwards for 1.5cm. Therefore, the spare 1.5cm outer chassis will form a shield to protect these tilt-out connectors from getting damaged by external force or by collision. By applying this, users can be double sure that the system is under dual protection.


3.Wide Range DC input

For heavy automation applications, instable voltage always brings headaches about damaging the electric components. ROC236A supports 9V to 36V DC-in, the flexible acceptance of inconsistent power input makes it capable of surviving tough engine cranks and transient over-voltage situations. With wide range DC-in, users can take the advantages of longer product life and dependability as the system performance remains at same level even when the power input is instable.


4.Three-stage thermal design

For automation applications, the environment is always harsh and under high temperature as the machine engines are operating 24/7 nonstop. Therefore the importance of extended operating temperature is undoubted. ROC236A is one of the master work pieces that supports Intel core i7 high computing performance under high operating temperature from -20 to +70°C thanks to its unique three-stage thermal design. The thermal solution flexibly maximize the metal characteristic, using copper heat spreader to absorb heat directly from heat sources, then using heat pipe to transfer heat to aluminum heat sink. The copper heat pipe is the key factor among the whole thermal design. The heat conductivity coefficient of heat pipe can be up to 5000, nearly 12 times better than copper heat spreader. With a perfect combination of copper plus aluminum thermal kit which efficiently manage the heat dissipation up to 70°C.


Operating Temp.

-40°C to 70°C


CPUIntel® Ivy Bridge 22nm Core™ i7/i5/i3, BGA type

Intel® Core™ i7-3517UE (2C, 1.7 GHZ), 4M L2 cache (17W)

Intel® Core™ i5-3610ME (2C, 2.7 GHZ), 3M L2 cache (35W)

Intel® Core™ i3-3217UE (2C, 1.66 GHZ), 3M L2 cache (17W)

ChipsetIntel® HM76 Express Chipset (Intel® BD82HM76 PCH)

Intel® QM77 Express Chipset (Intel® BD82QM77 PCH) by request

Memory Type1x DDR3 204-pin SO-DIMM 1333/1600 MHz up to 8GB
Expansion Slot1x Mini PCIe
Storage Device1x 2.5″ SATA HDD/SSD

Rear I/O

EthernetIntel® 82579LM & 82574IT GbE LAN (support 10/100/1000 Mbps for x2 RJ45 ports)

RS422: TX-, RX+, TX+, RX-, GND,


USB Port2x USB 3.0, 4x USB 2.0

Front I/O

USB2x USB 2.0


Dimension440 x 44.6 x 287.2 mm (17.32″ x 1.73″ x 11.30″)


Operating Temp.-40°C to 70°C (ambient with air flow)
Storage Temp.-40°C to 85°C
Relative Humidity10% to 95%, non-condensing



Test Result


Device Model


TesterIan Huang
Test ResultPass
Test TemperatureHigh 0~85°C / Low -40~0°C
Test Time5 Hours / 2Hours
Test StandardReference IEC60068-2
Test SoftwareBurnin test v6.0
CriteriaAfter testing, system can’t halt.


Test Configuration




CPUIntel® Xeon® Processor D-1587
Memory64GB ECC RDIMM DDR4 2133MHz in 2 sockets
LAN1Intel® i350 100M Ethernet
LAN2Intel® i350 1G Ethernet
Test SoftwareBurnin test v8.1, CPU Z-1.86, iperf, Passmark USB3.0
AS SSD Benchmark 2.0.6694, Hard Disk Sentinel 5.01
ChamberKSON THS-b4t-150
Chipeng SMO-3


Thermal Measurement

7STARLAKE provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus 7STARLAKE conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, 7STARLAKE is able to analyse the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 5 hours which at each temperature point.

Thermal Solution

Advanced cooling solution for better heat dissipation

To meet the demands of customer’s extended temperature requirements, the whole thermal solution of ROC236A simultaneously embraces three heat transfer methods, heat conduction, heat convection and water circulation. For heat conduction, the solution utilizes a copper heat spreader on the bottom layer which directly contact with the processor and chipset. Heat is then transferred to upper aluminum heat sink. Further, comes to water circulation that formed in heat pipe. The working fluid indirectly brings away the heat to dual side aluminum heat sink for faster heat dissipation. Regarding to heat convection, the temperature differences caused by high and low fin design forms a mild airflow that could bring away heat efficiently. Breakdown drawing and detailed description are provided as below.


Housing with honeycomb venting design
The enclosure features large, open honeycomb vents on the top, sides, front and back to enhance natural ventilation. The venting design enables greater airflow through the entire area of the honeycomb surface without occupying too much space.
•features a black SECC finish and measures 44mm (1.73”) deep
•1U Rackmount slim size, is suitable for space limited or standard rackmount applications.


Copper heat spreader

99.9 % purity of copper, 6.7 mm height and weigh 329 g, 126 x 72 mm2


2 x Copper heat pipes

Heat pipe transfers heat from the heat sources to the heat sink over relatively long distance. Two-phase heat transfer involves the liquid-vapor phase change of a working fluid.
•heat pipe 1: 6.0 mm width diameter, 147×69 mm length and 56-61% purity of copper which
weighs 48g

•heat pipe 2: 6.0 mm width diameter, 267×147 mm length and 56-61% purity of copper which
weighs 94g


SSD Bracket

To protect and make the SSD fixed


Add-on module

•Extra 2 x USB ports module


Aluminum heat sink

96 % purity of aluminum, 16.5 mm height and weighs 320 g, 126 x 60mm2


Copper heat spreader

99.9 % purity of copper, 6.7 mm height and weigh 360 g, 126 x 72 mm2

•60W DC/DC Converter Module

•Wide Input Range: 9V to 36V DC

• 12V DC Output up to 5 Amp

•Over voltage/ Over current/ Surge protection

•Extended operating temp. -40 to 85°C


Main board: 3.5” SBC—OXY5336A


Easy swap open window for SSD


Verification – CE_3.pdf (383.7 KB)383.7 KB
Verification – FCC_3.pdf (360.17 KB)360.17 KB