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Technical Profile



ROC235A is an industrial 19” 1U Rack-mount fanless rugged system, suitable for demanding industrial embedded applied applications. Powered by Intel® Ivy Bridge i7/i5/i3 (i7-3610QE, i5-3610ME, i3-3120ME) CPU and QM77 chipset, the power consumption is (45W for i7 and 35W for both i5 & i3), 4.1W for QM77 PCH. PERFECTRON emphasizes on providing exceeding thermal design, with heat pipes and heat sink construct on both component and system levels. Supporting extended operating temperature from -40 up to 70°C, ROC235A is capable of heat transfer in a limited space. This rigorous industrial 1U rack mount fanless system features a black SECC finish and measures 44mm (1.73”) in height. Honeycomb vents are designed on the top, sides and back to allow natural convection cooling. 9 – 24V wide voltage design enables a more flexible power environment. ROC235A meets the demand of multimedia workstation, network server and high-end digital signage.



System main board: Mini ITX INS8335A


1. Rich I/O, Infinite Possibility ROC235A contains rich indicators including power, HDD and LAN LED in the front side. For easy integration with all sorts of systems, versatile I/O interface can be found on the rear side. It supports three display (HDMI/VGA/DVI), audio Mic-in, Line-out, 1 x COM, 2 x Ethernet LAN and 6 x USB. Onboard 1x PCI or 1 x PCIe and 1 x mPCIe slots push the expansion ability to the utmost.

2. Wide Voltage Design ROC235A supports 9 to 24V DC-in power, allows the system to be utilized in extensive power types. The design of wide power range keeps the system’s reliability and you can expect longer life-span as well. Sudden drop or surge of power posts absolutely no threat to this smart system.

3. Ultra Slim Size ROC235A is a compact yet capable industrial grade fanless system. With a black SECC finish and 44mm (1.73”) in height, this 1U size system is superior in its compact yet durable exterior design and highly functional interior structure.


Operating Temp

-40°C to 70°C


CPUIntel® 22nm Ivy Bridge Processor (Mobile) socket(rPGA988)

Intel® Core™ i7-3610QE (4C, 3.3 GHZ), 6M L2 cache (45W)

Intel® Core™ i5-3610ME (2C, 2.7 GHZ), 3M L2 cache (35W)

Intel® Core™ i3-3120ME (2C, 2.4 GHZ), 3M L2 cache (35W)

Memory Type2x 204-pin SO-DIMM DDR3 1333/1600 MHz up to 16GB
ChipsetIntel® QM77 Express Chipset (Intel® BD82QM77 PCH)
Expansion Slot1x PCI, 1x PCIe x 1, from PCH

1x Mini PCIe for GEN2



HDD/SDD2x 2.5″ SATA HDD/SSD (Easy Swap 2.5″ HDD cage)
Supports RAID 0,1


EthernetIntel® 82579LM & 82574IT GbE LAN (support 10/100/1000 Mbps for x2 RJ45 ports)

Rear I/O

Audio1x Mic-in, 1x Line-out
COM1x RS232/422/485

Serial Signals

RS422: TX-, RX+, TX+, RX-, GND,
USB4x USB 3.0
DC-IN1x (Terminal Block)

Front I/O

Power Button1x
USB2x USB 2.0
Power LED1x

OS support list

WindowsWindows 7 x32/ x64、Windows 8.1 x32/ x64、Windows 10 x32/ x64
LinuxOpen SUSE 12.2、Ubuntu 12.04

Mechanical and Environment

Power Requirement9V~24V DC-IN
Dimension440 x 44 x 380 mm (17.32″ x 1.73″ x 14.96″)
Operating Temp.-40 to 70°C (ambient with air flow)
Storage Temp-20 to 80°C
Relative Humidity10% to 90%, non-condensing







Device Model


TesterIan Huang
Test ResultPass
Test TemperatureHigh 0°C~85°C / Low -40°C~0°C
Test Time5 Hours / 2 Hour
Test StandardReference IEC60068-2
Test SoftwareBurnin test v6.0
CriteriaAfter testing, system can’t halt.


Test Configuration

CPUIntel® Core™ i7-3610QE Processor

(6M Cache, up to 3.30 GHz)

PCHMobile Intel® QM77 Express Chipset
MemoryInnodisk 8GB DDR3 1600W/T SODIMM
port2 SATAIIIInnodisk 256G SATAIII SSD
USB1、USB2Passmark Loopback Plugs for USB 3.0
LAN1Intel® 82574L GbE
LAN2Intel® 82579LM GbE
Test SoftwareBurnin test v6.0、HD Tune v4.01、iperf、Passmark USB3.0


Thermal Measurement

7STARLAKE provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus 7STARLAKE conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink,7STARLAKE is able to analyse the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 5 hours which at each temperature point we burn in ROC235A for one hour, from +50 to +85°C.

Thermal Solution

Effective cooling solution for maximum heat dissipation:

What composes of a perfect thermal solution? With ROCS235A, it’s all about the incorporation of different heat dissipating part to create an almighty thermal conduction power. Honeycomb dissipating vents are constructed on the top and the sides to increase the dissipating area. The honeycomb cells can achieve faster heat dissipation without occupying much space. Two heat spreaders and two heat sinks are installed to create a magnificent ventilating structure. Six heat pipes are implemented to conduct the heat to the thermal modules on the two sides of the system. This phenomenal combination can bring out the best dissipating effect.

Honeycomb Dissipating Vents

The honeycomb vents are pre-drilled in rigid aluminum frames to fasten thermal convection and the airflow that will astonishingly enhances ventilation. The enclosure features large, open honeycomb vents on the top, sides, front and back instead of fan solution that allows natural convection cooling that gather dust easily. This heat dissipating design can dispel heat quickly through the honeycomb cells without occupying much space. The unique design enables greater airflow through the entire area of the honeycomb surface. The metalized polymeric honeycomb also brings up excellent rigidity and pressure resistance.


Passive Heat Spreader

Heat spreader is known for improving the distribution of heat. Our tailor-made heat spreader is made with precision and consideration to every detail.

•It contains % of aluminum, the height is mm and it weighs g.

•Excellent performance in heat absorption


Dual Sided High Efficiency Thermal Modules

Dual Sided Thermal Modules can transmit the heat transferred by the heat pipes. Fen shaped design helps to emit the heat to the surrounding air, then release through the honeycomb dissipating vents on the front, back, and the sides.


Six Copper Heat Pipes


Six heat pipes are installed to ensure 100% tight integration for superior heat dissipation. Copper heat pipes transfer heat from the heat sources (e.g. CPU, chipset) to the thermal modules on the sides. Two-phase heat transfer involves the liquid-vapor phase change of a working fluid.

•8.0 mm diameter heat pipe, 99.9% purity of copper

•High heat conductivity coefficient up to 5000!


Aluminum Heat Sink


Heat sink is known for its ability to improve the distribution of heat. Our tailor-made heat sink is made with aluminum. It can dissipate the heat in the quickest fashion.

•It contains 96% of aluminum, 48mm in height and weighs 103.5g.

• Consumes shorter heat dissipating time owing to lower metal density

Better performance in heat dissipation




INS8335A is a Mini-ITX form factor industrial motherboard, powered by Intel® Ivy Bridge 22nm processor and QM77 chipset. Processor i7-3610QE plus Intel® QM77 chipset consumes only 45W and 4.1W individually. It supports four-core that can turbo up to eight-core. Extreme computing power and reliability are guaranteed by this powerful combination. Clock speed can boost from 2.3 GHz to 3.3 GHz. Turbo Boost – Full speed operation from 2.3GHz up to 3.3GHz


ROC235A_Vibration_Test_Report.pdf (1.26 MB)1.26 MB