Intel®13th Raptor Lake-S GPU System


  • Intel® Raptor Lake-S Processor, i9-13900TE up to 24 cores
  • Up to 64GB DDR5 SO-DIMM 4800MHz
  • NVIDIA RTX™ A4500 16GB GDDR6 memory 5888 CUDA cores
  • Rich I/O interface with 2 x DP, 2 x COM, 6 x USB, 2 x LAN, 2 x CAN(Option 4 x CAN)
  • 1 x 2.5” SATA HDD/SSD
  • 9 – 36V wide voltage DC-IN design
  • Extended operating temperature. -40°C to 70°C

Technical Profile


PER335A-RS is a system of high performance and durability. It’s can thrive at +70℃ without processor throttling and max turbo frequency 4.8 GHz clock speed. Wide range DC input design from 9V to 24V can protect the system from sudden current fluctuation. For applications that require extreme resistance to shock and vibration, PER335A-RS has passed IEC 60068-2-64& IEC 60068-2-27 vibration and shock tests. In an effort to permanently vanquish the malfunction due to crash and collision, PER335A-RS is equipped with four rubber foot stands at the front side to prevent possible damages to I/O and power switch. With industrial grade handles assembled on two sides of the system, easy installation and utmost mobility are warranted.



Effective cooling devices for maximum heat dissipation w/FAN

The cooling solution for system will define the efficiency of system and the real power it can release. Boosted by high-speed Intel® Core™ i9-13900TE Processor (24 cores (8P+16E), 36MB cache, Freq. up to 5.0 GHz and TDP 36W), and MXM RTX A4500 (46 RT Cores, 184 Tensor Cores, and 5888 CUDA® cores, 16GB GDDR6 and TDP 200W), PER335A-RS when handling abundant intricate data from the versatile peripherals at a blistering pace, generates unavoidably massive heat. That is why the top operation efficiency requires an equal premium thermal solution.Devoted to ensure the best operation efficiency and performance, 7StarLake comes up with a cooling structure called “dual-sides thermal design”, which makes the most of space to combine fans, heat spreader and heat sink to create dual ways for heat dissipation.

Two main heat source components (CPU module and GPU module) are first covered with thermal pads to build a tight connection between heat sources and copper heat spreader (Copper is one of the most commonly used heat dissipation metal). The heat spreaders, with 4 circle trails precisely CNC milled, houses 4 copper pipes filled with liquid and are topped with two fans. Heat, being conducted from hot thermal sources to heat spreader, largely dissipates to the outside air via fans working above and the dissipation process is accelerated benefiting from the heat convention. Simultaneously, the remaining heat which turns liquid in heat pipes to vapor is continuously passed to heat sink and finally the surrounding air. The two main features of Dual-sides Thermal Design are: 1) the whole configuration of the fans and heat sinks fully utilizes the inner space to get rid of heat from the top and both sides of system 2) the vaporization phase which absorbs large amount of heat speedups heat transfer via form of gas.

Dual-sides Thermal Design combining conduction, vaporization and convention brings not just efficient heat removal but a guarantee of continuous high performance during operation.

Intel-Nvidia logo


System concept

1. Ever powerful Intel Raptor Lake-S Core i7 CPU Rugged system demands an even stronger heart to pump it through all types of tough applications. Powered intel i7 CPU, both the computing power and the rugged ability are tightly secured. With Turbo Boost Technology, the computing power is even more mighty and robust.

2.Ergonomic sturdy design – Handles &Foot Sands By placing two industrial grade, extremely reliable handles on the side, the system can be installed and moved with ease. For operations that require mobility and flexibility, the handle design helps to establish a convenient setting. Robust handles also help to form a sturdier framework. Four rubber foot stands are installed in the front to protect front I/O and power switch from collision. The foot stands can absorb the vibration and

3. Comprehensive thermal design PER335A-RS incorporates four pure copper heat pipes and a copper & aluminum passive heat spreader. On the two sides of the system are aluminum heat sinks to push the dissipation ability to a complete new level.

4. Supreme resistance to shock & vibration (IEC compliant) The ability to withstand high level of shock and vibration is guaranteed through EC 60068-2-64& IEC 60068-2-27 vibration and shock tests.



PER335A-RS 拉線圖_1PER335A 拉線圖_2



CPU13th Gen Intel® Raptor Lake-S LGA1700 Socket Processor Core i9-13900TE Processor up to 24 cores, TDP 35W
ChipsetIntel® H610
Memory typeUp to 64GB DDR5 SO-DIMM 4800 MHz
GPUNVIDIA RTXTM  A4500 16GB GDDR6 memory, 5888 CUDA cores

NVIDIA RTXTM  5000 16GB GDDR6 memory, 3072 CUDA cores

NVIDIA RTXTM  A2000 8GB GDDR6 memory, 2560 CUDA cores

NVIDIA GTX 1050Ti 4GB GDDR5 memory, CUDA cores



DPDP 1.4a, up to 4096 x 2304@60Hz


NVMe1 x M.2 2242 128G


ChipsetIntel® I219-LM / Intel® I226V

Front I/O

Power Button1 x PW Button w/Inducator LED
COM2 x RS232/422/485
USB2 x USB3.1

Rear I/O

DP2 x DP
Ethernet2 x RJ45 ( 1 x GbE / 1 x 2.5GbE )
Audio1 x Line-out
USB4 x USB3.1
CAN2 x CAN(DB9) (Option 4 x CAN)
Power Connector1 x 4Pin terminal block


Power Input9~36V DC-IN 400W

Operation System

OSWindows® 10 / 11 64 bit / Linux (support by request)

Mechanical Environmental

Dimension370(W) x 240 (L) x 77 (H) mm
Operating Temp.-40°C to 70°C
Storage Temp.-40°C to 85°C
Relative Humidity5% to 95%, non-condensing
ExtraIncluding current turbo FAN

Order Information




Thermal Solution

PER335A-RS Thermal Solution