OXY5741A

  • 9th / 8th Gen Intel® Xeon® / Core™ processor with up to 6 Intel® Xeon® E-2276ME / Xeon® E-2276ML / Core™ i7-9850HE / Core™ i7-9850HL / Core™ i5-8400H
  • PCIe/104 stackable bus structure(Type 2)
  • FPE connector ( 1*PCIe x16 or 2*PCIe x8 or 1*PCIe x8+2*PCIe x4)
  • 4x DDR4-2666MHz SO-DIMM , up to 128GB, ECC for Xeon® SKU
  • Multi display” Triple simultaneous displays with 48-bit LVDS+DP
  • 1x M.2 2280 M-key, 2x Full size mPCIe, 1x PCIe/104, 1x FPE
  • Dual GbE, 4x SATA III, 2x RS232/422/485
  • 6x USB3.0, 4x USB2.0
  • Extended operating temp. -40 to 85°C

Intel Gold

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Technical Profile

Introduction

7STARLAKE, the leading pioneer in ruggedised and embedded systems, introduces the latest EBX SBC OXY5741A. The EBX SBC measures 243*146 mm, providing extraordinary computing performance under extreme environment. It is powered by 9th / 8th Gen Intel® Xeon® / Core ™. Featuring Intel’s Xeon E-2276ME and ruggedised open-standard EBX architecture, 7STARLAKE EBX series is built tentatively and triumphs on environmental testing. It still operates effectively under harsh environments ranging from -40°C to 85°C so that it is a perfect solution for defence, transportation, and automation applications. More key functions such as stackable PCIe/104 expansion ability, flexible I/O, and NVMe Gen 3.0 PCIex4 for fast and large capacity storage, all contribute to this versatile architecture that can meet clients’ needs.

 

OXY5741A Banner橫式_0.jpg Xeon E-2276ME PCIe104

 

Key Features

  • 9th / 8th Gen Intel® Xeon® / Core ™ processor with up to 6 cores and 45W/25W TDP
  • EBX SBC Dedicates PCIe/104 Type 2
  • Dual channel DDR4-2666MHz with up to 128GB *, ECC for Xeon SKU
  • Three simultaneous displays with 48 bit LVDS + HDMI + DP
  • USB 3.0, TPM 2.0 and NVMe / PCIe Gen3x4 SSD
  • Dual GbE, SATA III, RS-232/422/485
  • M.2 M-Key 2280 and Full size mPCIe(one support SIM card)

 

What is Small Form Factor (S.F.F)?

 

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Small form factor computer is the crucial component that drives the entire system operation as they can fit into smaller spaces and consume less power. They can be packaged and mounted in diverse ways than larger boards. The reduction of size, weight, and cost (SWaP) has been continuously emphasised as more computer systems demand smaller processor and network connectivity solutions. As a result, application such as automation and transportation which demand more differently stackable ways often employ small form factors architecture.

 

DDR4 2666 128GB Optimised Performance

Since speed and power matters most in computing performance, OXY5741A is built in 4 x SO-DIMMs up to 128GB to deliver optimisation of the performance. Adding DDR4-128GB not only maximises CPU and computing performance, but also enables more robust and responsive virtual machines and applications. Taking advantage from the cutting edge DRAM technology, OXY5741A EBX XEON SBC can optimise system performance by accelerating the memory capacities of servers.

 

Ruggedised Open Standard PCIe/104 Facilitate Flexible Expansion

Choosing an embedded architecture for computer systems can be a formidable task. This kind of stackable and mezzanine architecture often results in tradeoffs that include off-the-shelf or custom design requirements. PCIe/104 compact, ruggedised, easily expandable traits support a lot of expansion flexibility in systems. This architecture evolved to address these resulting issues by keeping the common background while eliminating limitations. OXY5741A employs PCIe/104 technology to reduce constraints and create flexibility of expansion. Its M.2 extension offers M-key 2280, and PCIe 3.0 x 4 NVMe. Additionally, OXY5741A provides 3.0 ports for data redundancy by supporting RAID 0/1.

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High Performance and Fast StorageToday, ruggedised systems or computers are expected to possess speedy and smooth response times. In light of making these systems render high performance, NVMe protocol delivers a high-bandwidth and low-latency user experience. Moreover, via accessing a PCIe bus that supports a huge number of parallel command queues, NVMe can effortlessly access flash storage. This platform incorporates Intel® Xeon E-2276ME with 4 cores. OXY5741A supports up to 128GB of dual-channel DDR4 2400MHz memory and features an M.2 M-Key 2280 slot for NVMe / PCIE Gen3x4 high-speed PCIe SSD storage, thus offering extremely high data speeds for processing. The above features make OXY5741A an outstanding solution for applications that demand high performance in a EBX form factor.

 

Board Placement

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Specifications

System

 

CPUIntel® Core™ i7-9850HE Processor (6 Cores/12 Threads, 9M Cache, up to 4.40 GHz), 45W

Intel® Core™ i7-9850HL Processor (6 Cores/12 Threads, 9M Cache, up to 4.10 GHz), 25W

Intel® Xeon® E-2276ME Processor (6 Cores/12 Threads, 12M Cache, up to 4.50 GHz), 45W

Intel® Xeon® E-2276ML Processor (6 Cores/12 Threads, 12M Cache, up to 4.20 GHz), 25W

Intel® Core™ i5-8400H Processor (6 Cores/12 Threads, 8M Cache, up to 4.20 GHz), 45W

Memory Type4 x 260 Pin DDR4 2400MHz SO-DIMM (up to 128GB, XEON®SKU support ECC)
ChipsetCM246
BIOS CoreAMI UEFI BIOS
BIOS FlashSPI Flash
TPMTPM 2.0(SLB9665)
iAMTiAMT 12.0
Watchdog1-255 sec. or 1-255 min. software programmable and can be generate system reset
 

Expansion slot

M.21x M.2(M-key,Type: 2280 , SATA/PCIe 3.0 x4 NVMe)
Mini PCIe2x Full size (USB / PCIe and 1x micro SIM Card)
FPE1x
PCIe/1041x TYPE 2
 

Display

ChipsetIntel® UHD Graphics 630
LVDSDual channel 24-bit LVDS, up to 1920 x 1080 @ 60Hz
Display PortUp to 4096 x 2304 @ 60Hz
Multi-DisplayTriple simultaneous displays with 48-bit LVDS+DP
 

Ethernet

ChipsetIntel® I210 & I219LM GbE LAN(10/100/1000 Mbps supported)
WOLYes
Boot from LANYes for XPE
 

Audio

CodecALC888S
 

Rear I/O

Display Port2x
USB4x USB3.0
LAN2x
 

Front I/O

PW Button1x
USB2x USB3.0
 

Internal I/O

USB2.04x
GPIO4x DI/4x DO
SATAIII4x (0,1,5 RAID)
DP1x
Audio1x Line-out /1x Mic-in)
Serial2x RS232/422/485 autoflow control
DC connector1x
LVDS Inverter1x
LVDS connector1x
LPC1x
System Fan1x
Front Panel Control1x Power LED, HD LED, Reset, Power Switch, Buzzer
 

Mechanical and Environmental

Form FactorEBX
Power Type12V DC-IN
Power Consumption180W
Dimension146mm X 243mm
Operating Temperature-40℃ to 85℃
Storage Temperature-40℃ to 85℃
Relative humidity10% to 90%, non-condensing
 

Standard Compliance

Standard ComplianceCE/FCC
 

OS

OS SupportWindows®10 64-bit

Linux(Support by request)

Video

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