Technical Profile
Introduction
OXY5740C, a powerful rugged EBX SBC is driven by Intel® 7th generation Kabylake CPU and chipset soldering onboard. Processor i7-7820EQ plus Intel® QM175 chipset supports clock speed up to 3.7GHz. Quad cores, the SBC with high computing power is capable for multi-tasking while reducing idle power consumption. In order to cater various application usages, OXY5740C integrates ample I/O interfaces on one board, reserving expansion possibility for easy system integration. For mission-critical applications, OXY5740C take advantage of key components soldered onboard and extended operating temperature from -40 to 85°C to ensure ultimate durability, utmost resistance to shock & vibration. OXY5740C is truly a rugged SBC ideal for defence, military, high-end automation and heavy-duty railway applications.
Thermal Solution for Fanless System Design
7STARLAKE provides customized thermal kit for motherboard based on evaluation of each motherboard in term of thermal and mechanical design. Heat spreaders are used to transfer heat from heat generating point to heat sink, and heat sink cools down device’s temperature by dissipating heat into surrounding air.
7STARLAKE’s specially designed heat sink reaches best heat dissipation via wave line on the interface, which increases up to 30-40% air contact area. The exclusive thermal designs are able to replace traditional fan, as well as ensure high reliability and stability while working under wide range temperature from -40 to 70°C.
Rich I/O Supporting Configuration Flexibility
OXY5740C’s rich I/O provides embedded system developers with diverse embedded applications. It features multiple displays, including 2 x DisplayPort and DVI-D display port with dual channel 24bit LVDS. OXY5740C also reserves various expansion flexibility: 1 x Full-size mPCIe/mSATA and 1 x Half-size mPCIe for compact and rugged storage option. The board further includes four COM ports, eight USB ports, two Gbe LANs and two SATAIII, helping system integrators develop solutions quickly.
Board Placement
Installation Instruction ProcedureStick thermal pad on CPU and chipset, then simply place passive heat sink on thermal pad. Two budges are specially designed at the bottom, contacting directly with CPU and chipset to absorb heat efficiently from the bottom layer, then spread the collected heat to upper aluminum heat sink. After transferring heat from bottom layer to heat sink, high and low fin design create airflow along with wave line to dissipate heat.
Copper Heat Spreader
- The copper heat spreader directly touches heat sources of OXY5740C.
- 99.9 % purity copper, weighs 68g and consumes 87mm.
- 36mm height gap between OXY5740C and heat sink enclosure.
- Nickel plated to prevent corrosion and rust after long-term use.
- Tailor-made two bulges on heat spreader correspond to CPU and chipset placement on OXY5740C.
Aluminum Passive Heat Sink
Heat sink lowers the temperature by dissipating heat into the surrounding air.
- It contains 96 % aluminum, 40 mm height and weighs 135 g.
- Tailor-made two bulges on the bottom of heat sink correspond to the placement of CPU and PCH on OXY5740C.
- High and low fin design plus wave line increase contact surface up to 30-40% and create airflow.
- Consume shorter heat dissipating time owing to lower metal density.
- Better performance in heat dissipating.
Operating Temp.
Can withstand extended temperature from -40 to 85°C.