OXY5740A

Intel® 7th Gen. Kaby Lake-H Core™ i7 Processors,Stackable with PCIe / 104 & FPE Expansion, Extended Temperature -40 to 85°C

 

  • Support Intel® Kaby Lake-H Core™ i7-7820EQ Processor
  • 1x DDR4-2133 SO-DIMM up to 32GB
  • 1x PCIe/104 Type II, 1x FPE by PCIe x16
  • 2x Mini PCIe (1x Half size ; 1x Hull size)
  • Multi display: 2x DisplayPort; 1x DVI; Dual Channel 24bit LVDS
  • Dual LAN Ports (1x Intel® I210-IT & 1x Intel® I219-LM GbE LAN)
  • 8x USB ports: 4x USB3.0, 4x USB2.0
  • Extended operating temp. -40 to 85°C

Intel Gold

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Technical Profile

Introduction

 

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OXY5740A, a powerful rugged EBX SBC is driven by Intel® 7th generation Kabylake CPU and chipset soldering onboard. Processor i7-7820EQ plus Intel® QM175 chipset supports clock speed up to 3.7GHz. Quad cores, the SBC with high computing power is capable for multi-tasking while reducing idle power consumption. In order to cater various application usages, OXY5740A integrates ample I/O interfaces on one board, reserving expansion possibility for easy system integration. For mission-critical applications, OXY5740A take advantage of key components soldered onboard and extended operating temperature from -40 to 85°C to ensure ultimate durability, utmost resistance to shock & vibration. OXY5740A is truly a rugged SBC ideal for defense, military, high-end automation and heavy-duty railway applications.

 

Thermal Solution for Fanless System Design

7STARLAKE provides customized thermal kit for motherboard based on evaluation of each motherboard in term of thermal and mechanical design. Heat spreaders are used to transfer heat from heat generating point to heat sink, and heat sink cools down device’s temperature by dissipating heat into surrounding air.

7STARLAKE’s specially designed heat sink reaches best heat dissipation via wave line on the interface, which increases up to 30-40% air contact area. The exclusive thermal designs are able to replace traditional fan, as well as ensure high reliability and stability while working under wide range temperature from -40 to 70°C.

 

Rich I/O Supporting Configuration Flexibility

OXY5740A’s rich I/O provides embedded system developers with diverse embedded applications. It features multiple displays, including 2 x DisplayPort and DVI-D display port with dual channel 24bit LVDS. OXY5740A also reserves various expansion flexibility: StackPC + FPE for Stackable PCIe/104 module expansion; 1 x Full-size mPCIe/mSATA and 1 x Half-size mPCIe for compact and rugged storage option. The board further includes four COM ports, eight USB ports, two Gbe LANs and two SATAIII, helping system integrators develop solutions quickly.

 

Excellent Resistance to Shock and Vibration

OXY5740A has key components soldered onboard to eliminate risk of harm caused by vibration. Rugged XR-DIMM RAM option enhances drastically the resistance to vibration as well as shock. The stackable expansion slots, FPE (PCIe_16) and StackPC (PCIe/104) enable to expand more functions by installing extra cards. The cable-free operation removes the concern of loosening cable connections due to shock & vibration. With fundamental components soldered onboard and a solid PCIe/104 connection, OXY5740A serves as a perfect solution for critical application and harsh environment.

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Installation Instruction Procedure

Stick thermal pad on CPU and chipset, then simply place passive heat sink on thermal pad. Two budges are specially designed at the bottom, contacting directly with CPU and chipset to absorb heat efficiently from the bottom layer, then spread the collected heat to upper aluminum heat sink. After transferring heat from bottom layer to heat sink, high and low fin design create airflow along with wave line to dissipate heat.

 

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Copper Heat Spreader

  • The copper heat spreader directly touches heat sources of OXY5740A.
  • 99.9 % purity copper, weighs 68g and consumes 87mm
  • 36mm height gap between OXY5740A and heat sink enclosure
  • Nickel plated to prevent corrosion and rust after long-term use
  • Tailor-made two bulges on heat spreader correspond to CPU and chipset placement on OXY5740A

 

Aluminum Passive Heat Sink

Heat sink lowers the temperature by dissipating heat into the surrounding air.

  • It contains 96 % aluminum, 40 mm height and weighs 135 g
  • Tailor-made two bulges on the bottom of heat sink correspond to the placement of CPU and PCH on OXY5740A
  • High and low fin design plus wave line increase contact surface up to 30-40% and create airflow. Consume shorter heat dissipating time owing to lower metal density.
  • Better performance in heat dissipating

 

Operating Temp.

Can withstand extended temperature from -40 to 85°C

Specifications

System

 

CPU TypeIntel® Kaby Lake-H Core™ Processor

Intel® Core™ i7-7820EQ (4 Cores/8 Threads, 8M Cache, up to 3.70GHz), 45W

ChipsetIntel® QM175
Memory Type1x DDR4 SO-DIMM up to 32 GB
NAND Flash64GB SATA SSD onboard
BIOSAMI® UEFI BIOS
Watchdog1-255 sec. or 1-255 min. software programmable, can generate system reset
Expansion SlotStackPC + FPE

1x Half-size mPCIe

1x Full-size mPCIe/mSATA

 

Display

ChipsetIntel® HD Graphics
Display Port2x Max resolution up to 3840 x 2160
DVI-D1x Max resolution up to 2048 x 1536
LVDSDual channel 24bit LVDS
 

Audio

CodecRealtek ALC888S
 

Ethernet

Chipset1x Intel® I210-IT & 1x Intel® I219-LM GbE LAN

(support 10/100/1000 Mbps)

WOLYes
Boot from LANYes for PXE
 

External I/O

Display Port2x
DVI-D1x
Ethernet2x RJ45
USB 3.04x
Audio Jack1x Mic-In, 1x Line-Out
COM1x RS232/422/485

(1 with 5V/12V Selectable)

 

Internal I/O

SATAIII2x (0,1 RAID)
COM3x RS232

(1 with 5V/12V Selectable)

USB 2.04x
SIM card holder1x
DIO8bit, 6x DI/ 2x DO
LPC1x
LVDS1x
 

Mechanical and Environment

Form FactorEBX
Power type12V DC-IN
Dimension203mm x 146mm
Operating Temp.-40°C to 85°C
Storage Temp.-40°C to 85°C
Relative Humidity10% to 90%, non-condensing
Standard Compliance
Standard ComplianceCE/FCC
OS
OS SupportWindows®10 64-bit

Linux(Support by request)