OXY5361A

3.5″ SBC Intel® Skylake-U Core™ i7-6600U Processor, 2 x DDR4 SO-DIMM, 2 x Display Port, 1 x LVDS, 6 x USB, 2 x COM, 9~ 36V DC-IN, -20 to 85°C

 

  • Support 6th Generation Intel® Core™ i7-6600U Processor
  • 2 x SO-DIMM, supports Dual Channel DDR4 1866/2133 up to 32GB
  • 1 x Full-size mPCIe, 1 x Half-size mPCIe
  • Multi display: 2 x Display Port ; 1 x Dual Channel 24 Bit LVDS
  • Dual LAN Ports (1 x  Intel® I210-IT & 1 x Intel® I219-LM GbE LAN)
  • 2 x COM Ports: 1 x RS-232, 1 x RS232/422/485
  • 6 x USB Ports: 4 x USB 3.0, 2 x USB 2.0
  • Wide range 9~36V DC-IN
  • Extended operating temp. -20 to 85°C
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Technical Profile

Technical Profile OXY5361A is a highly integrated 3.5" rugged SBC driven by Intel® Skylake U SoC i7-6600U soldering onboard With processor soldered onboard can significantly enhance the resistance of vibration and shock. Processor supports graphics (HD Graphics 500 Series) and CPU performance and equips with rich legacy I/O features such as: 2 COM Ports; 8 Bit DIO; 6 USB Ports. With 2 DisplayPort and a Dual Channel 24 Bit LVDS, OXY5361A can fulfill diverse needs of modern day display & monitor control applications.OXY5361A can operate in harsh environment under temperature range from -40°C to 85°C and avoid damage from sudden surge of voltage with its 9V to 36V DC input design.

Technical Profile

OXY5361A is a highly integrated 3.5″ rugged SBC driven by Intel® Skylake U SoC i7-6600U soldering onboard With processor soldered onboard can significantly enhance the resistance of vibration and shock. Processor supports graphics (HD Graphics 500 Series) and CPU performance and equips with rich legacy I/O features such as: 2 COM Ports; 8 Bit DIO; 6 USB Ports. With 2 DisplayPort and a Dual Channel 24 Bit LVDS, OXY5361A can fulfill diverse needs of modern day display & monitor control applications.OXY5361A can operate in harsh environment under temperature range from -40°C to 85°C and avoid damage from sudden surge of voltage with its 9V to 36V DC input design.

 

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Rich I/O interface – Extensive Functionality

Rich I/O design endows OXY5361A with the ability to comprehend present day automation devices, display, and other applications that require extensive I/O features. With 2 COM, 6 USB, 2 LAN, and dual Channel 24-bit LVDS, OXY5361A provides a wide array of choices to expand and connect to different devices.

 

Extended Temperature Operation

7STARLAKE aims to provide excellent performance to all types of temperature zone. From component selection to layout design, we dedicate our knowledge to make sure that our boards can stand extreme temperature. OXY5361A can operate from -20°C to 85°C, our strict manufacture procedure guarantees supreme performance in severe environment.

 

Efficient thermal solution

A tailor-made heat spreader is what 7STARLAKE provide for engineers to reduce mechanical design period also ensures the highest efficacy for dissipation. For OXY5361A, the customized heat sink is placed on top of the CPU and chipset, acting as the medium that exchanges the heat to the surrounding atmosphere. The highly efficient aluminum heat sink has a thermal conductivity to absorb the heat generated by the pumping CPU.

Specifications

System

 

CPU TypeIntel® Skylake-U series , BGA Type
Intel® Core™ i7-6600U Processor (4M Cache, 2.6GHz)(15W)
Intel® Core™ i5-6300U Processor (3M Cache, 2.4GHz)(15W)
Intel® Core™ i3-6100U Processor (3M Cache, 2.3GHz)(15W)
Memory type2 x SO-DIMM DDR4 2133 MHz up to 32GB
BIOSAMI® UEFI BIOS
Super I/OFintek F8786E
Watchdog1-255 sec.
Expansion Slot1 x Full-size mPCIe/mSATA
1 x Half-size mSATA
 

Display

ChipsetIntel® Integrated
DisplayPortMax. resolution 4096 x 2304
LVDSDual Channel 24bit LVDS
Display TypeDisplay Port, LVDS
 

Audio

CodecRealtek ALC888 High Definition Audio Codec
 

Ethernet

Chipset1 x Intel® I210-IT , 1 x Intel® I219-LM GbE LAN
(support 10/100/1000 Mbps for 2 x RJ45 ports)
WOLYes
Boot from LANYes for PXE
 

Rear I/O

DisplayPort2 x DisplayPort
Ethernet2 x RJ45
USB4 x USB 3.0
COM1 x RS232
 

Internal I/O

SATA1 x SATAIII (6 Gb/s)
USB2 x USB 2.0
COM1 x RS232/422/485
AUDIOMic-in, Line-in/out

1 x 3W amplifier (Optional)

FAN1 x CPU fan
LVDS30-pin connector
DIO8bit
 

Mechanical and Environment

Form Factor3.5″ SBC
Power Type9~36V DC-IN4-pin ATX power connector,AT/ATX mode support
Dimension146mm x 101mm (5.7″ x 4″)
Operating Temp.ET : -20 to 70℃

UT : -20 to 85℃

Storage Temp.-40 to 85°C
Relative Humidity10% to 90%, non-condensing
 

Standard Compliance

Standard ComplianceCE/FCC
 

OS

OS SupportWindows®10 64-bit

Linux(Support by request)

CPU

The OXY5361A offers highly effectively heat conductive and heat convective thermal solutions to meet the demands of customers’ extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.

 

Test Result

Device Model OXY5361A Tester Marc Liu Test Result Pass Test Temperature High 0°C to 85°C/ Low -40°C to 0°C Test Time 5 Hours / 2 Hours Test Standard Reference IEC60068-2 Test Software Burnin test v6.0 Criteria After testing, system can't halt.

Device Model

OXY5361A

TesterMarc Liu
Test ResultPass
Test TemperatureHigh 0°C to 85°C/ Low -40°C to 0°C
Test Time5 Hours / 2 Hours
Test StandardReference IEC60068-2
Test SoftwareBurnin test v6.0
CriteriaAfter testing, system can’t halt.

 

Test Configuration

 Device Configuration Manufacturer Part Number
 CPU Type Intel® i7-6600U ( 2.60 GHz) Intel i7-6600U
 XR-DIMM APACER DDR4 SO-DIMM 16GB 2133
 Port1 SATAIII TRANCED 256G SSD
 Port2 msata half innodisk 3me 64G
 Port3 msata innodisk 3me2 256G
 USB3 ~ USB4 USB Keyboard / Mouse
 LAN1 Intel® I219 GbE Intel Intel® I219 GbE
 LAN2 Intel® I210 GbE Intel Intel® I210 GbE
 Test Software Burnin test v8.1、AS SSD、iperf
 Chamber KSON THS-b4t-150 Chipeng SMO-3 KSON Chipeng THS-b4t-150 SMO-3

 

Thermal Measurement

PERFECTRON provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus PERFECTRON conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, PERFECTRON is able to analyze the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 5 hours which at each temperature point we burn in OXY5361A-i7-6600U for one hour, from 50°C to 85°C.