OXY5323A

3.5″ SBC Intel® Apollo Lake Atom / Celeron /Pentium BGA processor, 1 x DDR3L SO-DIMM, 6 x USB, 4 x COM, 8V to 24V DC-in, -20°C to 70°C, -40°C to 85°C (Optional)

 

  • Intel® Apollo Lake Atom / Celeron /Pentium BGA processor
  • 1 x DDR3L SO-DIMM and support up to 8GB
  • Support triple display for HDMI, VGA and LVDS / Edp
  • 1 x Mini PCIe + 1 x M.2 slot
  • 2 x SATAIII (1 x SATA is multiplexed with 1 x mSATA port)
  • 2 x Intel® Gigabit Ethernet
  • 2 x USB 2.0, 4 x USB 3.0 and 4 x COM
  • 8V to 24V wide voltage power input
  • mPCIe with SIM card holder
Categories: ,

Technical Profile

Introduction

OXY5323A is a highly integrated 3.5″ rugged SBC driven by Intel® Apollo Lake Processor. It features rich I/O interface, such as: 4 COM Ports; 2 LAN Ports; 6 USB Ports. Support triple display for HDMI, VGA and LVDS / eDP, OXY5323A can fulfill diverse needs of modern day display & monitor control applications. Moreover, OXY5323A can avoid damage from sudden surge of voltage with its 8V to 24V wide range DC input design.

 

Rich I/O interface – Extensive Functionality

Rich I/O design endows OXY5323A with the ability to comprehend present day automation devices, display, and other applications that require extensive I/O features. With 4 COM, 6 USB, 2 LAN, and triple display for HDMI, VGA and LVDS / eDP, OXY5323A provides a wide array of choices to expand and connect to different devices.

 

OXY5323A.jpg

OXY5323A-拉線圖

 

投影片1_23.JPG

 

Extended Temperature Operation

7STARLAKE aims to provide excellent performance to all types of temperature zone. From component selection to layout design, we dedicate our knowledge to make sure that our boards can stand extreme temperature. OXY5323A can operate from -20°C to 70°C, our strict manufacture procedure guarantees supreme performance in severe environment.

 

Efficient thermal solution

A tailor-made heat spreader is what 7STARLAKE provide for engineers to reduce mechanical design period also ensures the highest efficacy for dissipation. For OXY5323A, the customized heat sink is placed on top of the CPU and chipset, acting as the medium that exchanges the heat to the surrounding atmosphere. The highly efficient aluminum heat sink has a thermal conductivity to absorb the heat generated by the pumping CPU.

Specifications

System

 

CPUIntel® Apollo Lake-M N3350/N4200 Processor
Intel® Apollo Lake-I E3930 Processor
Memory typeDDR3L 1866MHz, 1 x 204-pin SO-DIMM, Max. 8GB (Non-ECC)
ChipsetIntel® SoC Integrated
GraphicsIntel® HD Graphics
Ethernet2 x Intel® I210-IT Giga LAN
AudioRealtek® ALC662
I/O ChipsetNuvoton NCT6116D
TPMNuvoton NPCT650ABCYX TPM2.0 (Optional)
Expansion SlotStorage: Mini PCIe Full size (USB / PCIe / SATA), w/ SIM Card Holder

Wireless: M.2 2230 E-key (PCIe / USB)

BIOSAMI BIOS
H / W MonitorTemperature Monitor, Voltage Monitor
Watchdog Timer1 to 255 Steps by Software Program
Smart Fan ControlCPU Fan
 

Graphics

VGAUp to 1920 x 1200 @60 Hz
HDMIUp to 4K (3840 x 2160) @30 Hz
LVDSUp to 1920 x 1200 @60 Hz
eDP (Option)Up to 4K (3840 x 2160) @60 Hz
 

Rear I/O

USB4 x USB 3.0
Display I/O1 x HDMI 1.4, 1 x VGA
LAN I/O2 x RJ-45
 

Internal Connectors

Storage2 x SATAIII ( 1 x SATA is multiplexed with 1 x mSATA port)
USB2 x USB 2.0
Display I/O1 x LVDS, 1 x eDP

1 x Backlight Connector

Audio I/O1 x Audio Header (Front Panel Mic-in & Line-out)
Serial Port4 x RS232 (One Supports RS232/422/485)
GPIO1 x MiAPI Header (Programmable. Support 10bit GPIO)
Fan1 x 4-pin CPU Fan Header
Power1 x 8~24V ATX Power Connector, 1 x AT/ATX Mode Select Jumper
Others1 x CMOS Jumper
 

Power Requirement

Power Input8~24V Wide Range DC Input w/4-pin ATX connector (Pitch: 4.2mm)
 

Environmental

Operating Temperature-20 to 70°C (Optional -40 to 85℃)
Storage Temperature-40 to 85°C
Operating Humidity10% to 95% R/H, non-condensing

 

 

Standard Compliance

Standard ComplianceCE/FCC
 

OS

OS SupportWindows® 10 64bit

Linux(Support by request)

Download

Attachment

Size

210922_OXY5323A_KC EMC Test Report.pdf (2.54 MB)2.54 MB
OXY5323A KC Certificate_Registration of Broadcasting and Communication Equipments.pdf (284.27 KB)284.27 KB