HPC3000-IL

3U IP65 Military Dual-GPU Server with Intel® Xeon SP ICe Lake-SP Processor

 

  • Intel® 3rd Gen Ice Lake  Xeon® Silver 4316 Processor, 20C, up to Xeon® Platinum 8380 Processor, 40C.
  • 2TB NVMe Gen 4.0 (W/R,3000MB/sec)-System Drive ; 8xSATA Drive Bay (SAS/SATA) RAID10
  • 2x 10GbE, Option : 2x 100GbE(QSFP28)
  • 2x Nvidia RTX A4000 GPU (6,144 CUDA),Option1 :  Nvidia RTX A4500 GPU (7,168 CUDA) ; Option2 : Nvidia RTX A2000 GPU (3,328 CUDA)
  • DC-DC 24V (800W) ; option1 : Redundant AC 100~240V Input ; option2 : MIL-STD -461 18~36V DC
  • MIL-STD-810 Thermal, shock, vibration, Humidity  EMI / EMC Resistance
  • Extreme Temperature : -20°C to +55°C

Intel Gold

Technical Profile

Introduction & Key Features

The global transformation is rapidly scaling the demands for flexible computer, networking, and storage. Future workloads will necessitate infrastructures that can seamlessly scale to support immediate responsiveness and widely diverse performance requirements. The exponential growth of data generation and consumption, the rapid expansion of cloud-scale computing and 5G networks, and the convergence of high-performance computing (HPC) and artificial intelligence (AI) into new usages requires that today’s data centers and networks evolve now— or be left behind in a highly competitive environment.

7Starlake’s HPC3000-IL 3U IP65 Military Dual-GPU Server features 3rd Gen. Intel Xeon Scalable (ICE LAKE) ® Silver 4316  processor ( 20 Cores, 2.3 GHz, 150W) with 2 x NVIDIA Quadro RTX A4000 GPU2TB RDIMM ECC DDR4-3200MHz and 2TB by Gen 3.0 NVMe M.2, 8 x 2.5” Easy Swap HDD/SSD Tray(RAID 10 support), to provide the seamless performance foundation for the data centric era from the multi-cloud to intelligent edge, and back.

 

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Intel’s 10nm Ice Lake Xeon With 40 Cores, PCIe4.0

Today’s scientific discoveries are fueled by innovative algorithms, new sources and volumes of data, and advances in compute and storage. Machine learning, deep learning, and AI converge the capabilities of massive compute with the flood of data to drive next-generation applications, such as autonomous systems and self-driving vehicles. Recognising this demand, 7STARLAKE employs 3rd Gen Intel® Xeon® Scalable processors that are built specifically for the flexibility to run complex AI workloads on the same hardware as existing workloads to be the CPU of HPC3000-IL.

Intel Ice Lake is based on 3rd Generation Intel Xeon Ice Lake Scalable Processor in LGA4189 Socket with C621A chipset, up to 40 cores, 270W TDP. Intel Ice Lake-SP processors will be based on 10 nm+ process node. The mail highlight of Ice Lake-SP processors will be support for PCIe Gen4 and 8-channel DR4 memory.

HPC3000-IL文案圖

 

NVDIA RTX A4000 GPU

NVIDIA RTX™ technology has fundamentally changed computer graphics, blending real-time ray tracing, artificial intelligence, and the power of advanced graphics and computing to drive the next wave of innovation in visual computing. The NVIDIA Ampere architecture is the second generation of NVIDIA RTX—providing a higher level of power and performance for professional workflows to accelerate time-to-market and time-to-solution.

The NVIDIA RTX A4000 series graphics cards bring the power of RTX to more professionals with a powerful low-profile dual-socket GPU design, delivering instant ray tracing, AI-accelerated computing, and high-performance graphics to your desktop. Based on the NVIDIA Ampere architecture, the VR ready RTX A2000 combines 48 second-generation RT cores, 192 third-generation Tensor cores, and 6,144 next-generation CUDA® cores with 16GB of GDDR6 .It is another industry first in this product range.

 

RTX A4000文案圖

-Dual 100GbE E810-2CQDA2

 

Highpoint RAID SSD-7502

The SSD7502 is the industry’s fastest Dual-Port PCIe Gen4 RAID controller, and features bootable RAID support for Windows and Linux based platforms. The low-profile SSD7502 incorporates a state of the art Gen4 PCIe Switch Chipset to ensure each M.2 port has x4 lanes of dedicated bandwidth. HighPoint’s 7500 Series combine dedicated, cutting edge PCIe Gen 4 x16 host connectivity with our industry proven RAID technology to deliver unbeatable storage performance.

 

SSD7502 文案圖

Specifications

System

 

CPUIntel® Xeon® Sliver 4316, 150W, Ice Lake 3rd Scalable, 20C, Freq. 2.3/3.4 GHz, 30MB cache

Intel® Xeon® Platinum 8380, 270W, Ice Lake 3rd Scalable, 40C, Freq. 2.3/3.4 GHz, 60MB cache.

Memory typeUp to 2TB ECC RDIMM, DDR4-3200MHz
 

Display

GPUDual x NVIDIA RTX A4000 PCI-E (16GB-GDDR6, CUDA 6,144)

Option 1 :  NVIDIA RTX A4500 PCI-E (20GB-GDDR6, CUDA 7,168)

Option 2 : NVIDIA RTX A2000, PCI-E (12GB-GDDR6, CUDA 3,328)

 

Storage

NVMe2TB NVMe 3.0 M.2 (R/W, 3000MB/sec)

Option : 2TB RAID1 NVMe 3.0 (R/W, 3000MB/sec)

HDD/SSD8 x 2.5” Easy Swap HDD/SSD Tray, RAID 10 Support
 

Ethernet

Ethernet2 x 10GbE Intel® X550

Option : 2 x Intel 100GbE (QSFP28) E810-CQDA2*2

 

Front I/O

USB3.02 x DTL38999(USB3FTV7AZNF312)
100GbE2 x DTL38999(LCFTV6MDGN)
10GbE2 x DTL38999(LCFTV6MDGN)
IPMI1 x DTL38999(LCFTV6MDGN)
VGA1 x DTL38999(TV07RW-9-09S)
COM1 x DTL38999(TV07RW-9-09S)
DIO1 x DTL38999(TV07RW-9-09S)
DC-IN1 x DTL38999(TV06RW09-98S)
Power Button1 x Power Button with LED backlight
SDD1 x SSD light

8 x 2.5” Easy swap HDD/SSD Tray

Option : AES Button

CMOS SWOP1 x CMOS SWOP Battery
 

Power Requirement

Power InputDC-DC 24V (800W)

Option 1 : Redundant AC 100~240V Input

Option 2 : MIL-STD -461 18~36V DC-Input

 

Application

ApplicationMilitary Platforms Requiring Compliance MIL-STD-810

Embedded Computing and applications subject to Harsh Temperature, Shock, Vibration, Attitude, Dust and EMI Conditions.

 

OS support list

WindowsWindows 10
LinuxBy request
 

Environment

Dimension480 mm x 132 mm x 500 mm (WxHxD)
ClassisAluminum Alloy, Corrosion Resistant
Operation Temp.-20 to +55°C
Storage Temp.-40 to +85°C
Relative Humidity5% to 95%, non-condensing
MIL-STD-810

 

Method 501.5, Procedure I (Storage/High Temperature)

Method 501.5, Procedure II (Operation/High Temperature)

Method 502.5, Procedure I (Storage/Low Temperature)

Method 502.5, Procedure II (Operation/Low Temperature)

Method 503.5, Procedure I (Temperature shock)

Method 507.5, Procedure II (Temperature & Humidity)

Method 514.6, Vibration Category 24/Non-Operating (Category 20 & 24,Vibration)

Method 514.6, Vibration Category 20/Operating (Category 20 & 24,Vibration)

Method 516.6, Shock-Procedure V Non-Operating (Mechanical Shock)

Method 516.6, Shock-Procedure I Operating (Mechanical Shock)

Method 500.5, Procedures I and II (Altitude, Operation): 12,192M, (40,000 ft) for the initial cabin altitude (18.8Kpa or 2.73 Psia)

Method 500.5, Procedures III and IV (Altitude, Non-Operation): 15,240, (50,000 ft) for the initial cabin altitude (14.9Kpa or 2.16 Psia)

MIL-STD-461CE102 : 10kHz – 30 MHz

RE102-4 : 1.5 MHz -30 MHz – 5 GHz

RS103 : 200 MHz – 3.2GHz, 50 V/m equal for all frequencies

Order Information

HPC3000-IL_Order Information

Thermal Solution

IP65 GPU Server