AI Inference GPU system supporting NVIDIA® GTX1080 (CUDA2560, 8GB GDDR5) and 9th Coffee-Lake I7-9850HE (6 Cores , 4.40GHz) 


  • Intel® 9th Coffee-Lake i7-9850HE  (2.7 GHz, up to 4.4 GHz, 6-cores, 12 threads)
  • NVIDIA MXM Graphic Engine support up to GTX1080(CUDA2560,8 GB GDDR5X)
  • NVIDIA MXM Support Up to 180W
  • Dual 10 GbE SFP+
  • DDR4 Up to 64GB (ECC for Options)
  • 2 x LAN, 4 x USB, 2 x DVI ,
  • Rugged MIL-DTL-38999 connectors
  • MIL-STD-461/1275  18V-36V DC-Input
  • Operating Temperature -20°C to +55°C

Intel Gold

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Technical Profile


Artificial intelligence (AI) is quickly becoming one of the most crucial components to business success now and in the foreseeable future. Today, the necessity of deploying powerful computing platforms that can accelerate and cost-effectively scale their AI-based products and services has become vital for successful enterprises.

7STARLAKE is innovating to address the rapidly emerging high-throughput inference market driven by technologies such as 5G, Smart Cities and IOT devices, which are generating huge amounts of data. The combination of NVIDIA Tensor RT and the new architecture based GeForce Accelerator as the ideal combination for these new demanding and latency-sensitive workloads and are aggressively leveraging them in GPU system.

Achieving the Power of AI Inference_20200831-01.jpg

Edge AI Inference GPU System

With more threads and more cores, 9th Gen Intel® Core™ H-series processors for IoT bring high performance and connectivity to the edge—all in an efficient package with long-life availability that’s ideal for embedded use conditions. These processors are the first in the Intel® Core™ IoT family to offer up to eight cores, delivering dramatic improvements over the previous generation. New features include integrated graphics and even more robust connectivity to support the most demanding IoT use cases—all on the latest 14 nm technology. And with TDP ranges from 25W to 65W, form factors can vary without compromising performance.



HORUS430-X1 is installed with graphics card NVIDIA GTX1080 (CUDA 2560,8 GB GDDR5X) , allowing generate excellent resolution and supports high efficiency and fluency of image processing with competitive G3D Mark and low power consumption. The GPGPU provides a simple and easily implementable parallel software architecture paradigm using general purpose programming languages like C / C++. The entire data / signal processing task can be realized as a sequence of software activities taking the advantage of very high throughput possible with the GPUs. The system possess great superiority for image computing utilization, including 2D/3D mapping and real-time image process for autonomous vehicle, surveillance system for control room, other navigation, radar, detection, sensor and laser systems on all maritime, ground, and aerial applications in both defense and industrial fields.



Modern Radar Sensor systems are being deployed to carry out multi-tasking for detection and tracking of several objects simultaneously. Active Electronically steered phased array technology is the key element being utilized for design and development of these modern radar systems. A radar system receives digitized video data from receivers and carries out a set of highly compute intensive Data / Signal Processing activities. The GPGPU provides a simple and easily implementable parallel software architecture paradigm using general purpose programming languages like C / C++. The entire data / signal processing task can be realized as a sequence of software activities taking the advantage of very high throughput possible with the GPUs.



GPGPU system

HORUS430-X1, Intel® Core™ i7-9850HE Processor, the 8-Core CPU, supports 1.8 GHz, up to 3.8 GHz clock speed for high-end computing performance. Not only with outstanding CPU performance, HORUS430-X1 has integrated graphics card NVIDIA®Quadro P5000 (CUDA2560,16GB-GDDR5X)to apply all sort of applications. HORUS430-X1 has provided rich I/O such as 4 x LAN, 4 x USB, 2 x DVI. HORUS430-X1 is highlighting on rugged design and high functionality, the special dual thermal solution allows powerful system to present supreme performance under harsh environment. HORUS430-X1 is design to withstand the most challenging combat requirements with many being MIL-STD 810G certified for extreme environmental conditions. HORUS430-X1 GPGPU platform are used by the most demanding customers including the US Military, NATO forces and among many others.


I/O Expansions

HORUS430-X1 is designed to fulfill demands of mission critical applications. Apart from standard I/O interface, HORUS430-X1 equipped with 4 x LAN, 4 x USB, 2 x DisplayPorts. With these rich interfaces, HORUS430-X1 can be easily applied to targeting & acquisition system to link with diversified sensors, such as thermal image camera, scanned array radar..etc.



Rugged D38999 Series connectors

D38999 connectors offer the highest performance capabilities and reliability for both general duty and severe environment applications.
This cylindrical connector family designed for cable-to-panel I/O applications in military, aerospace and other demanding hazardous situations. D38999 connectors are capable of operation within a temperature range -65 to 200°C. They are lightweight and can stand up
to environmental challenges. Made with removable crimp or fixed hermetic solder contacts, these connectors provide high-vibration characteristics and are suitable for severe wind and moisture problem areas.




HORUS430-X1 meets MIL-STD-810G for mechanical shock and vibration, it is designed and tested to withstand extended extended temperature (-20° to +55°C). Combining critical components soldering on board and solid connection, HORUS430-X1 is compliant to MIL-STD 810G standard, can withstand 5g vibration, 100g single shocks and 50g multiple shocks.


300W Military Standard DC/DC Converter Module

SK711 - 01 W1500xh800

SK711 is a wide input board type converter supporting input range from 18V to 36V. Possessing military standard filter for EMI avoidance, SK711 guarantees the stability of voltage and electric current for system operation, especially suitable for application in military or other harsh environment. Furthermore, with parallel design, two SK711 can be combined for double power of 300W, supporting prominent system performance. Compliant with MIL-STD 1275/461,  extended operating temperature from -40 to 85°C, SK711 performs as an ideal converter module for severe environmental usage. The Cosel Hi-Rel DC/DC CONVERTER it also provides , Output Over Current Protection (OCP), Output Overvoltage Protection (OVP) and Over Temperature Protection (OTP) to made stability and safety.


Test report







CPUIntel® 9th Coffee-Lake i7-9850HE (2.7 GHz, up to 4.4 GHz, 6-cores, 12 threads)
Memory TypeDDR4-2666 Up to 64GB (ECC for Options)
GPUNVIDIA MXM Graphic Card support up to GTX1080 (8GB GDDR5X, CUDA 2560)


Display Port4 x DisplayPort 1.4 digital video outputs (DP++), 1 x HDMI, 2 x DVI, 1x eDP


HDD/SSD2 x mSATA, up to 1TB


LAN2 x Intel I350-AM2 Gigabit LAN Interfaces ( 10/100/1000Mbps)
10GbE2 x 10GbE supported

Front I/O

X11 x USB x 4 MIL-38999 22Pin connector (Amphenol TV07RW-13-S)
X2, X32 x 10G LAN M12 8Pin connector (X CODE Cat6)
X4, X52 x 1G LAN MIL-38999 10Pin connector (Amphenol TV07RW-13-98S)
X6>1 x RS232 MIL-38999 10Pin connector (Amphenol TV07RW-13-98S)
X7, X82 x DVI MIL-38999 22Pin connector (Amphenol TV07RW-13-S)

Power Requirement

Power Input18V to 36V DC-DC 300W

Applications, Operating System

Applicationsmanufacturing applications
OSWindows 10 64Bit Ubuntu13.04, Ubuntu13.10, Ubuntu14.04, Fedora 20

MIL-STD-810 Specifications (Operating)

Method 502.5Low Temperature-20°C, 4 hours, ±3°C
Procedure 2
Method 501.5High Temperature+55°C, 4 hours, ±3°C
Procedure 2
Method 507.5Humidity85%-95% RH without condensation, 24 hours/ cycle, conduct 10 cycles.
Method 514.6Vibration5-500Hz, Vertical 2.20Grms, 40mins x 3axis.
Method 516.6Shock6 Grms, 11ms, 3 axes.

MIL-STD-810 Specifications (None-Operating)

Method 502.5Low Temperature-33°C, 4 hours, change rate: ≦20°C/ Hour
Storage-15°C, 72hours (By request)
Method 501.5Low Temperature+71°C, 4 hours, change rate: ≦20°C/ Hour
Storage+63°C, 240 hours (By request)
Method 514.6Vibration5-500Hz, Vertical 2.20Grms, 40mins x 3axis.
Method 516.6Shock6 Grms, 11ms, 3 axes.

MIL-STD-461 Specifications (EMC)

Conducted EmissionsCE102 basic curve10kHz – 30 MHz
Power Leads
Conducted EmissionsRE102-41.5 MHz -30 MHz – 5 GHz
Electric Field
Radiated SusceptibilityRS1031.5 MHz – 3 GHz, 50 V/m equal for all frequencies

2 MHz – 80 MHz 50 V/m equal for all frequencies

80 MHz – 3 GHz 50 V/m equal for all frequencies

3 GHz – 5 GHz, 50 V/m equal for all frequencies

Electric Field
Electrostatic DischargeEN 61000-4-2Air discharge: 8 kV, Contact discharge: 6kV
Electromagnetic compatibilityEN 61000-4-4Signal and DC-Net: 1 kV
Electromagnetic compatibilityEN 61000-4-5Leads vs. ground potential 1kV, Signal und DC-Net: 0.5 kV
Radio disturbanceEN 55022Class A
Electromagnetic compatibilityEN 61000-4-310 V/m
Electromagnetic compatibilityEN 61000-4-5Leads vs. ground potential 1kV, Signal und DC-Net: 0.5 kV
Conducted Susceptibility*CS10130HZ to 150KHZ
Power Leads
Conducted Susceptibility*CS11410kHz to 200MHz
Bulk Cable Injection
Conducted Susceptibility*CS11550 V/m
Bulk Cable Injection
Conducted Susceptibility*CS11650 V/m
Damped Sinusoidal Transients
Radiated Susceptibility*RS10130 Hz to 100 kHz
Magnetic Field
Radiated Susceptibility*RS1035 GHz to 18 GHz, 50 V/m equal for all frequencies
Electric Field
Radiated Emissions*RE10310 kHz to 40 GHz
Antenna Spurious and Harmonic Outputs
Conducted Emissions*CE10610 kHz to 40 GHz
Antenna Terminal
*   Option Test item : CS101/CS114/CS115/CS116/RS101/RS103/RE103/CE106

*   Test item for Antenna system : RE103/CE106


MIL-STD-1275 Specifications

Steady State20V to 33V
Surge Low20V to 33V
Surge High18V/500ms


HORUS430-X1 (i7-9700HE processor) CPU Performance




CPU Frequency(GHz)
CPU T-J(℃)47536499100100
GPU Frequency(GHz)
CPU T-J(℃)283445909090

Thermal Solution

Thermal Solution : Conduction cooling

The conduction cooling passive solutions don’t require moving components, meaning high reliability, less wear and tear, and low maintenance. It guarantees that our products are made in accordance with your requirements on wide temperature range, compact design, durability, high performance and extended lifecycle. We implement a design principle that uses wide temperature grade components, optimal power circuits, constructed cooling; thermal design, and wideband extended temperature testing.