HORUS422A

2U Fanless Storage Server , Intel® Xeon E3-1268Lv5 ,12 Bays 2.5″ SAS RAID ,10GbE Support, NVIDIA® RTX A2000

 

  • MIL-STD 810 Certified 2U Fanless Storage Server
  • 6th Gen Intel® Xeon E3-1268Lv5, i7-6700TE (2.4GHz up to 3.4GHz)
  • 4x DDR4 XR-DIMM up to 64GB
  • RocketRAID 840A RAID Card
  • 4x RJ45 LAN, 6x USB, 1x RS232 Console
  • 12x 2.5″ Easy swap SSD/HDD Tray
  • MIL-STD810H 500.6 Low Pressure Altitude
  • Extended Temperature -40°C to 60°C ( -20°C to+60°C for 10GbE)
  • NVIDIA® RTX A2000
  • MIL-STD-810 500.6 Low Pressure Altitude

Intel Gold

Technical Profile

Introduction

HORUS422A is designed with 6th Gen Intel® Xeon E3-1268L v5, i7-6700TE processor presents outstanding CPU performance with quad cores up to 3.4GHz clock speed. System especially builds in Highpoint RocketRAID 840A SATA RAID Card supports up to 12 SATA/SSD drives.

HORUS422A highlights on it rugged design and high functionality, system especially designed with dual sided thermal solution, allow powerful system presents supreme performance under harsh environment.

HORUS422A

 

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Dual sided thermal solution ensures supreme system performance

With combination of high end CPU computing and high bandwidth PCIe bus power generate numerous heat, 7starlake emphasizes on providing exceeding thermal design guarantee superior system performance under critical environment. HORUS422A innovatively adopts dual sided thermal solution, with copper heat spreader directly touches the heat source components processor and RAID card to absorb the heat rapidly, heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid which can provide high efficiency heat transmission. The aluminum heat sink dissipates the heat into surrounding air promptly. One side thermal solution is mainly for 6th Gen Intel® Xeon E3-1268L v5, i7-6700TE 35W processor and the other side is to dissipate the heat for RocketRAID 840A RAID card. With unique thermal design, HORUS422A can ensure high performance and reliability under harsh environment.

 

Maximizes SATA SSD Storage Performance

RAID 5 Performance Up to 6,000 MB/s!
RocketRAID 800 host bus adapters are the industry’s fastest SATA RAID Controllers. The PCIe Generation 3.0 host interface and dedicated 6Gb/s SATA channels work in tandem to deliver uncompromised transfer performance for up to 16 SSD’s or hard disks.

 

GPGPU server HORUS420

 

 

System main board: ATX AB20

 

1. 6th Gen Intel® Xeon E3-1268L v5, i7-6700TE powerful processor

HORUS422A is based ATX formfactor AB20 motherboard, powered by 6th Gen Intel® Xeon E3-1268L v5, i7-6700TE, Skylake processor presenting superior CPU and graphics performance, providing quad cores up to 3.4 GHz clock speed over compact size 2U rackmount.

 

2.Rich I/O interface

AB20 equips extensive I/O interface to fulfill different application requirements. The board supports four XR-DIMM RAM up to 64 GB, it offers 4x LAN, 10x USB and 6x COM for device connects ability, with 4x Mini PCIe slot, 1x PCIex8 and1x PCIex4 can add on extra feature for different demands. With MXM slot can integrate with graphic card for image processing usage.

 

MIL-STD-810

Operating

ReferenceTestCondition
Method 502.5
Procedure 2
Low Temperature5°C, 4 hours, ±3°C
Method 501.5
Procedure 2
High Temperature+55°C, 4 hours, ±3°C
Method 507.5Humidity85%-95% RH without condensation, 24 hours/ cycle, conduct 10 cycles.
Method 514.6Vibration5-500Hz, Vertical 2.20Grms, 40mins x 3axis.
Method 516.6Shock6 Grms, 11ms, 3 axes.
Method 500.5

Procedures I and II

Altitude25°C, 15,000ft
12,192M, (40,000 ft) for the initial cabin altitude (corresponding pressure in a standard atmosphere: 18.8Kpa or 2.73 Psia).

 

Non-Operating

ReferenceTestCondition
Method 502.5Low Temperature Storage-33°C, 4 hours, change rate:20°C/ Hour
‘-15°C, 72hours (By request)
Method 501.5
Procedure 1
High Temperature Storage+71°C, 4 hours, change rate:20°C/ Hour
‘+63°C, 240 hours (By request)
Method 514.6Vibration5-500Hz, Vertical 2.20Grms, 40mins x 3axis.
Method 516.6Shock6 Grms, 11ms, 3 axes.
Method 500.5

Procedures III and IV

Altitude25°C, 15,000ft
15,240, (50,000 ft) for the initial cabin altitude (corresponding pressure in a standard atmosphere: (14.9Kpa or 2.16 Psia)

 

Test Method/Specification:

Test method:                            Reference to MIL-STD-810 , Method 500.5, Test Procedure I: Storage, Air Transport

Temperature:                           25°C

Altitude:                                   4.572m (15.000ft) for the cabin altitude

Altitude change rate:               7.6m/s

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Specifications

Operating Temp.

 

5°C to 50°C
 

System

CPU6th Gen Intel®  i7-6700TE
GPUNVIDIA® RTX A2000(CUDA Cores: 2,560)
ChipsetQ170
Memory Type4x DDR4 XR-DIMM up to 64GB
BIOSAMI® SPI BIOS
Expansion Slot4x mPCIe (two support with mSATA)
1x PICex4
Storage Device12x 2.5″ (7mm) Esay Swap HDD / SSD Tray
 

Display

ChipsetIntel® HD Graphics 500 Series
Display Type1x DisplayPort ; 1x HDMI
 

Ethernet

Chipset3x Intel® I210-IT ; 1x I219-LM GbE LAN
( support 10 / 100 / 1000 Mbps for RJ45 port )
WOLYes
Boot from LANYes for PXE
 

Rear I/O

Ethernet4x RJ45 Gigabit Ethernet LAN Interfaces
Display1x HDMI ; 1x DisplayPort
USB4x USB3.0 standard-A connectors
AC-INIEC C14 AC-IN
 

Front I/O

Button1x System On/Off, 1x System FAN On/Off
Indicator LED1x HDD LED
COM1x DB9
USB2x USB2.0
2.5″ SSD / HDD Tray12x ( 7mm height SSD / HDD only )
 

OS support list

WindowsWindows 8 x32 / x64、Windows 8.1 x32 / x64、Windows 10 x32 / x64
LinuxFedora 20、Ubuntu 13.04、Ubuntu 13.10、Ubuntu 14.04
 

Mechanical and Environment

Form FactorATX
Power TypeAC to DC 100V~240V 400W FLEX ATX Switch Power Supply with fan
Dimension430 x 396 x 88 mm ( W x D x H )
Operating Temp. -40°C to 60°C

-20°C to+60°C for 10GbE

Storage Temp.-20°C to 70°C
Relative Humidity5% to 95%, non-condensing

CPU

The HORUS422A offers highly effectively heat conductive and heat convective thermal solutions to meet the demands of customers’ extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.

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Device ModelHORUS422A
TesterMarc
Test ResultPass
Test TemperatureHigh 0°C~50°C / Low 0°C~5°C
Test Time8.5 Hours
Test StandardReference IEC60068-2
Test SoftwareBurn in test 8.0 AS SSD 1.9
CriteriaAfter testing, system can’t halt.

 

Test Configuration

Device

Configuration

CPUIntel® Core™ i7-6700TE Processor 2.4 GHz
PCHIntel Q170
MemoryInnodisk 16GB SOD DDR4 2133
Test SoftwareBurnin test v8、、IntelBurnTest 1.9
XTU CPU STRESS,FU MARK
ChamberKSON THS-b4t-150 Chipeng SMO-3

 

Thermal Measurement

7starlake provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus 7starlake conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, 7starlake is able to analyses the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 5.5 hours which at each temperature point we burn in HORUS422 for two hour, from +40 to +50°C.

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HORUS422A System – IO Performance

Point5°C15°C25°C40°C50°C
CPU T-J4352657586
CPU Die26.428.139.557.571
Heatsink24.226.932.747.368
Δ1=(TJ-Die)16.623.925.517.515
Δ2=(Die-Sink)2.21.26.810.23
CPU Frenquency (GHz)2.92.92.92.862.86

Thermal Solution

Effective cooling solution for maximum heat dissipation:

HORUS420 - 10GbE, Rackmount GPU Server Supporting 150W NVIDIA® GPU

With HORUS422A, it’s all about the incorporation of different heat dissipating part to create an almighty thermal conduction power. HORUS422A adopts dual sided thermal solution, with copper heat spreader directly touches the heat source components processor and graphic GPU to absorb the heat rapidly, the heat then transfer to heat pipe, the aluminum heat sink dissipates the heat into surrounding air promptly. With unique thermal design, HORUS422A can ensure high performance and reliability while working under extended range temperature from -40°C up to 50°C.

 

HORUS420 - 10GbE, Rackmount GPU Server Supporting 150W NVIDIA® GPU  

Dual Sided High Efficiency Thermal solution

HORUS422A adopts dual sided thermal solution, with copper heat spreader directly touches heat source components processor and graphic GPU to absorb the heat rapidly, the heat then transfer to heat pipe, aluminum heat sink dissipates the heat into surrounding air promptly. One side thermal solution is mainly for Core I processor and the other side is to dissipate the heat for graphic GPU.

 

Active cooling fan kits (By option)

By integrating active cooling fan kits ensures system CPU i7-6700 and GPU RTX A2000 run full speed without throttling even under harsh environment -40°C~60°C.

 

Motherboard AB20

ATX AB20 powered by Intel 6th generation Skylake Core i7-6700 CPU, Skylake processor offers superior CPU and graphics performance, providing quad cores up to 4 GHz clock speed.

 

HORUS420 - 10GbE, Rackmount GPU Server Supporting 150W NVIDIA® GPU