Technical Profile
Introduction
HORUS422A is designed with 6th Gen Intel® Xeon E3-1268L v5, i7-6700TE processor presents outstanding CPU performance with quad cores up to 3.4GHz clock speed. System especially builds in Highpoint RocketRAID 840A SATA RAID Card supports up to 12 SATA/SSD drives.
HORUS422A highlights on it rugged design and high functionality, system especially designed with dual sided thermal solution, allow powerful system presents supreme performance under harsh environment.
Dual sided thermal solution ensures supreme system performance
With combination of high end CPU computing and high bandwidth PCIe bus power generate numerous heat, 7starlake emphasizes on providing exceeding thermal design guarantee superior system performance under critical environment. HORUS422A innovatively adopts dual sided thermal solution, with copper heat spreader directly touches the heat source components processor and RAID card to absorb the heat rapidly, heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid which can provide high efficiency heat transmission. The aluminum heat sink dissipates the heat into surrounding air promptly. One side thermal solution is mainly for 6th Gen Intel® Xeon E3-1268L v5, i7-6700TE 35W processor and the other side is to dissipate the heat for RocketRAID 840A RAID card. With unique thermal design, HORUS422A can ensure high performance and reliability under harsh environment.
Maximizes SATA SSD Storage Performance
RAID 5 Performance Up to 6,000 MB/s!
RocketRAID 800 host bus adapters are the industry’s fastest SATA RAID Controllers. The PCIe Generation 3.0 host interface and dedicated 6Gb/s SATA channels work in tandem to deliver uncompromised transfer performance for up to 16 SSD’s or hard disks.
System main board: ATX AB20
1. 6th Gen Intel® Xeon E3-1268L v5, i7-6700TE powerful processor
HORUS422A is based ATX formfactor AB20 motherboard, powered by 6th Gen Intel® Xeon E3-1268L v5, i7-6700TE, Skylake processor presenting superior CPU and graphics performance, providing quad cores up to 3.4 GHz clock speed over compact size 2U rackmount.
2.Rich I/O interface
AB20 equips extensive I/O interface to fulfill different application requirements. The board supports four XR-DIMM RAM up to 64 GB, it offers 4x LAN, 10x USB and 6x COM for device connects ability, with 4x Mini PCIe slot, 1x PCIex8 and1x PCIex4 can add on extra feature for different demands. With MXM slot can integrate with graphic card for image processing usage.
MIL-STD-810
Operating
| Reference | Test | Condition |
| Method 502.5 Procedure 2 | Low Temperature | 5°C, 4 hours, ±3°C |
| Method 501.5 Procedure 2 | High Temperature | +55°C, 4 hours, ±3°C |
| Method 507.5 | Humidity | 85%-95% RH without condensation, 24 hours/ cycle, conduct 10 cycles. |
| Method 514.6 | Vibration | 5-500Hz, Vertical 2.20Grms, 40mins x 3axis. |
| Method 516.6 | Shock | 6 Grms, 11ms, 3 axes. |
| Method 500.5 Procedures I and II | Altitude | 25°C, 15,000ft |
| 12,192M, (40,000 ft) for the initial cabin altitude (corresponding pressure in a standard atmosphere: 18.8Kpa or 2.73 Psia). |
Non-Operating
| Reference | Test | Condition |
| Method 502.5 | Low Temperature Storage | -33°C, 4 hours, change rate:≦20°C/ Hour ‘-15°C, 72hours (By request) |
| Method 501.5 Procedure 1 | High Temperature Storage | +71°C, 4 hours, change rate:≦20°C/ Hour ‘+63°C, 240 hours (By request) |
| Method 514.6 | Vibration | 5-500Hz, Vertical 2.20Grms, 40mins x 3axis. |
| Method 516.6 | Shock | 6 Grms, 11ms, 3 axes. |
| Method 500.5 Procedures III and IV | Altitude | 25°C, 15,000ft |
| 15,240, (50,000 ft) for the initial cabin altitude (corresponding pressure in a standard atmosphere: (14.9Kpa or 2.16 Psia) |
Test Method/Specification:
Test method: Reference to MIL-STD-810 , Method 500.5, Test Procedure I: Storage, Air Transport
Temperature: 25°C
Altitude: 4.572m (15.000ft) for the cabin altitude
Altitude change rate: 7.6m/s
