1.5 U Fanless Rugged GPU Server Intel® 6th Gen. Core i7-6820EQ processor, 9V~36V DC-IN, Operating Temp -20°C to 60°C.
GTX 1050 Ti(CUDA Cores: 768)/GTX1050(CUDA Cores: 640)/GTX1060 (CUDA Cores: 1280) /RTX3000(CUDA Cores:1920)


  • Intel® Skylake-H Core i7-6820EQ, 4C, 8T, 2.8/3.5GHz, 8MB cache, TDP 45W
  • 2x DDR4 SO-DIMM up to 32GB memory
  • 2x 2.5″ Easy Swap SSD/HDD tray
  • 2x RJ45 LAN, 4x USB 3.0
  • 2x mPCIe expansion slot (one supported with mSATA)
  • 9V~36V DC-IN, 12V DC-in for MXM graphics card (optional)
  • 2x I/O expansion (could be customized with 2x CAN bus/GbE LAN/ DisplayPort/ COM port)
  • Extended operating temperature -20°C to 60°C
  • NVIDIA® GTX 1050 Ti(CUDA Cores: 768)

Technical Profile


HORUS330, 1.5 U Fanless Rugged GPU Server is a powerful system driven by Intel® 6th generation Skylake-H Mobile CPU. Processor i7-6820EQ, the quad-core CPU, supports 2.8GHz, up to 3.5GHz clock speed for high-end computing performance. Not only with outstanding CPU performance, HORUS330 has integrated graphics card NVIDIA® to apply all sort of applications. HORUS330 has provided rich I/O such as 4 x USB 3.0, 1 x COM port, 2 x DisplayPort and 2 x LAN ports. HORUS330 is highlighting on rugged design and high functionality, the special dual thermal solution allows powerful system to present supreme performance under harsh environment. With rugged design, the system is suitable for the use in high-end automation and passenger information system in the field of military, transportation and so on.



Dual thermal solution ensures supreme system performanceHORUS330_04.jpg

With combination of high end CPU computing and graphic GPU power generate numerous heat, 7STARLAKE emphasizes on providing exceeding thermal design guarantee superior system performance under critical environment. HORUS330 innovatively adopts dual sided thermal solution, with copper heat spreader directly touches the heat source components processor and graphic GPU to absorb the heat rapidly, heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid which can provide high efficiency heat transmission. The aluminum heat sink dissipates the heat into surrounding air promptly. One side thermal solution is mainly for Core i7-6820 45W processor and the other side is to dissipate the heat for graphic GPU GTX 1050 Ti. With unique thermal design, HORUS330 can ensure high performance and reliability while working under extended range temperature from -20 up to 60°C.


NVIDIA GPU, Stunning GraphicsHORUS330_05.jpg



HORUS330 is installed with graphics card NVIDIA GTX 1050 Ti allowing generate excellent resolution and supports high efficiency and fluency of image processing with competitive G3D Mark and low power consumption. The system possess great superiority for image computing utilization, including 2D/3D mapping and real-time image process for autonomous vehicle, surveillance system for control room, other navigation, radar, detection, sensor and laser systems on all maritime, ground, and aerial applications in both defense and industrial fields.


I/O Expansions

HORUS330 is designed to fulfill demands of different application. Apart from standard I/O interface, HORUS330 equipped with two I/O expansions at the back panel in order to have more flexibility and be more use-friendly. Which that offers user to customize additional function such as optional quad LAN port from MT321 Ethernet module, CAN Bus/GPS and 4 display output from NVIDIA GTX 1050 Ti/GTX1050/GTX1060//RTX3000. With these expansions, HORUS330 can be easily applied to control room or driverless vehicles application.


19″rackmount bracket

The ability of keep HORUS330 inside cabinet is also an enhanced ways to keeping your server secure. Which S7STARLAKE has designed a 19”rackmount bracket allows HORUS330 place inside a cabinet in order to protect from climate issue, dust and pests attack.




Operating Temp.

-20°C to 60°C


CPUIntel® Skylake-H Processor
Intel® Core™ i7-6820EQ, 4C, 8T, 2.8/3.5GHz, 8MB cache, TDP 45W
Memory Type2x DDR4 SO-DIMM support up to 32 GB
Expansion Slot2x mPCIe (1 supported with mSATA)
Storage Device1x mSATA
2x 2.5″ SATA HDD/SSD
GPUNVIDIA® GTX 1050 Ti(CUDA Cores: 768)

Front I/O

Power Button1x with LED backlight
USB2x USB2.0
2.5″ HDD/SSD Tray2x

Rear I/O

USB4x USB3.0
Ethernet2x RJ45 GbE LAN
Display2x DP
Audio1x Min-in, 1x Line-out
AntennaReserved three antenna holes
I/O Expansion2x I/O Expansion
#Could be customized with 2x (GbE LAN/ DisplayPort/ COM port/ CANbus)
Power Input9V~36V DC-IN (1x 4-pin terminal block)
Additional 12V DC-in for MXM graphic card if necessary

OS support list

WindowsWindows 8 x32/x64、Windows 8.1 x32/x64、Windows 10 x32/x64
LinuxFedora 20、Ubuntu 13.04、Ubuntu 13.10、Ubuntu 14.04、Open SUSE 12.2

Mechanical and Environment

Power Requirement9V~36V DC-IN
Dimension342.0 x 228.4 x 69.8 mm (13.5″ x 9.0″ x 2.8″)
Operating Temp.-20°C to 60°C (ambient with air flow)
Storage Temp.-40°C to 85°C
Relative Humidity5% to 95%, non-condensing




The HORUS330 offers highly effectively heat conductive and heat convective thermal solutions to meet the demands of customers’ extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.

Device ModelHORUS330
TesterRobin Chang
Test ResultPass
Test TemperatureHigh 0°C~60°C / Low -20°C~0°C
Test Time8 Hours / 1.5 Hours
Test StandardReference IEC60068-2
Test SoftwareBurnin test v6.0
CriteriaAfter testing, system can’t halt.


Test Configuration



CPUIntel® Core™ i7- 6820EQ Processor 3.50 GHz
Memory DIMMInnodisk 8GB DDR4 SODIMM
SATA Port1Innodisk 3ME4 2.5″ SATA SSD 64GB
SATA Port2Innodisk 3MG2 2.5″ SATA SSD 512GB
LAN1Intel® I219 Gigabit Network
LAN2Intel® I210 Gigabit Network
Test SoftwareBurnin test v7.1、AS SSD、
Intel Extreme Tuning Utility、iperf
ChamberKSON THS-b4t-150


Thermal Measurement

STACKRACK provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus STACKRACK conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, STACKRACK is able to analyses the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 5.5 hours which at each temperature point we burn in HORUS330 for two hour, from 50°C to 60°C.



HORUS330 CPU Performance








CPU T-J82865869697
CPU Die11.533.265.881.391.093.0
CPU Heatsink-
CPU Frenquency (GHz)

Thermal Solution

Effective cooling solution for maximum heat dissipation:

STACKRACK implements unique cooling solution with copper heat spreader, pure copper heat pipe and aluminum heat sink for maximum heat dissipation. With the aluminum heat sink enclosure allows dual-sided heat dissipation. We especially adopt the physical property of copper and aluminum, the heat spreader touches the heat source – processor and chipset and absorbs the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid, the aluminum heat sink dissipates the heat into surrounding air promptly. With the benefits of fanless design, HORUS330 can ensure high reliability and stability while working under wide range temperature from -20°C up to 60°C.

Patent Designed Aluminum Heat Sink

The heat sink is made by heat radiating material, which is aim to lowering the temperature by dissipating heat into the surrounding air. 96 % of aluminum.


Heat spreader

Heat spreader directly touches the power source area, which can absorb heat rapidly and transfer to heat pipe and allow the high efficiency heat pipe further bring out heat to upper heat sink enclosure.

Pure Copper Heat Pipe

The heat pipes are embedded in the heat sink to ensure 100% tight integration for superior heat dissipation. Especially adopts U shape copper heat pipe to fulfill utmost thermal conductivity, copper heat pipe transfers heat from the heat sources (e.g. CPU, chipset) to the heat sink over relatively long distance. Two-phase heat transfer involves the liquid-vapor phase change of a working fluid.



COM Express carrier + CPU Module is in the middle of the system as a cutoff point, dividing segmentation type thermal design into upper and lower module.Upper thermal module is applied to cool down the heat generated from graphic card and processor.