1.5 U Fanless Rugged GPU Server Intel® Xeon® D Processor, MXM Graphic Card, 9V~36V DC-IN, Operating Temp -20°C to 50°C. 
NVIDIA® GTX 1050 Ti(CUDA Cores: 768) GPU 


  • MIL-STD 810 Compliance
  • Intel® Xeon® D-1548 Processor
  • 2x DDR4 SO-DIMM up to 32GB RAM
  • MXM Graphic Card support
  • 4x Intel® Gigabit Ethernet
  • 2x CAN bus
  • 4x USB, 1x COM
  • 9V~36V DC-IN
  • Operating Temp. -20°C to 50°C
  • NVIDIA® GTX 1050 Ti(CUDA 768 GDDR5-4GB)

Technical Profile


HORUS330-X2, 1.5 U Fanless Rugged GPU Server is a powerful system driven by Intel® multi-core Processor Xeon D-1548, the 8-core CPU, supports 2.0GHz, up to 2.6GHz clock speed for high-end computing performance. Not only with outstanding CPU performance, HORUS330-X2 has integrated graphics card NVIDIA® GTX 1050 Ti to apply all sort of applications. HORUS330-X2 has provided rich I/O such as 4 x USB 3.0, 1 x COM port, 2 x DisplayPort and 4 x LAN ports. HORUS330-X2 is highlighting on rugged design and high functionality, the special dual thermal solution allows powerful system to present supreme performance under harsh environment. With rugged design, the system is suitable for the use in high-end automation and passenger information system in the field of military, transportation and so on.



Dual thermal solution ensures supreme system performanceHORUS330X2_04.jpg


NVIDIA GTX1050Ti GPU, Stunning Graphics





HORUS330-X2 is installed with graphics card NVIDIA GTX1050Ti GPU (CUDA 768, Clock speed 1493MHz), allowing generate excellent resolution and supports high efficiency and fluency of image processing with competitive G3D Mark and low power consumption. The system possess great superiority for image computing utilization, including 2D/3D mapping and real-time image process for autonomous vehicle, surveillance system for control room, other navigation, radar, detection, sensor and laser systems on all maritime, ground, and aerial applications in both defense and industrial fields.


I/O Expansions

HORUS330-X2 is designed to fulfill demands of different application. Apart from standard I/O interface, HORUS330-X2 equipped with quad LAN ports, COM Port, CAN Bus and 2 display output from GTX1050Ti. With these expansions, HORUS330-X2 can be easily applied to control room or driverless vehicles application.


19″rackmount bracket

The ability of keep HORUS330-X2 inside cabinet is also an enhanced ways to keeping your server secure. Which 7starlake has designed a 19″””rackmount bracket allows HORUS330-X2 place inside a cabinet in order to protect from climate issue, dust and pests attack.




Operating Temp.

-20°C to 50°C (ambient with air flow)


CPUIntel® Xeon® D Processor
Intel® Xeon® Processor D-1548 2.6 GHz (12M Cache, 45W)
Memory Type2x DDR4 SO-DIMM up to 32GB
Expansion Slot1x 2280 M.2 (SATA signal)
Storage Device2x 2.5″Easy swap HDD/SSD Tray

Front I/O

Power Button1x with LED backlight
2.5″ SSD/HDD Tray2x

Rear I/O

USB4x USB3.0
DisplayPort2x DP (From NVIDIA GeForce GTX 950M/1050TI)
VGA1x VGA (Only on GTX950M Model)
Ethernet4x RJ45 GbE
Serial Port1x RS232/422/485
2x RS232/422/485 on GTX1050Ti Model }
CAN bus2x DB9 connector
DC-IN2x 4P Rugged Terminal connector

OS support list

WindowsWindows 10
LinuxFedora 20、Ubuntu 13.04、Ubuntu 13.10、Ubuntu 14.04

Mechanical and Environment

Power Requirement9V~36V DC-IN
Dimension (WxDxH)342.0 x 228.4 x 83.6 mm
Weight>6.20 kg
Operating Temp.-20°C to 50°C (ambient with air flow)
Storage Temp.-40°C to 85°C
Relative Humidity10% to 90%, non-condensing

Test Standard

EMCCE, FCC compliant
Green ProductRoHS, WEEE compliance


 The HORUS330-X2 offers highly effectively heat conductive and heat convective thermal solutions to meet the demands of customers’ extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.


Device Model



Robin Chang

Test Result


Test Temperature

High 0°C~50°C / Low -20°C~0°C

Test Time

8 Hours / 1.5 Hours

Test Standard

Reference IEC60068-2

Test Software

Burnin test v6.0


After testing, system can’t halt.


Test Configuration



CPUIntel® Xeon® D-1548 Processor 2.6 GHz
Memory DIMMInnodisk 8GB DDR4 SODIMM
SATA Port1Innodisk 3ME4 2.5″ SATA SSD 64GB
SATA Port2Innodisk 3MG2 2.5″ SATA SSD 512GB
Graphic CardAetina MXM GeForce GTX 1050 Ti
LAN1Intel® I210 Gigabit Network
LAN2Intel® I210 Gigabit Network
Test SoftwareBurnin test v7.1、AS SSD、
Intel Extreme Tuning Utility、iperf
ChamberKSON THS-b4t-150


Thermal Measurement

7starlake provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus 7starlake conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, 7starlake is able to analyses the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 5.5 hours which at each temperature point we burn in HORUS330-X2 for two hour, from 40°C to 50°C.



Horus330-X2 CPU Performance







CPU T-J3153829098
CPU Die23.545.874.382.893.5
CPU Heatsink9.531.860.367.176.6
CPU Frenquency (GHz)

Thermal Solution

Effective cooling solution for maximum heat dissipation:

7starlake implements unique cooling solution with copper heat spreader, pure copper heat pipe and aluminum heat sink for maximum heat dissipation. With the aluminum heat sink enclosure allows dual-sided heat dissipation. We especially adopt the physical property of copper and aluminum, the heat spreader touches the heat source – processor and chipset and absorbs the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid, the aluminum heat sink dissipates the heat into surrounding air promptly. With the benefits of fanless design, HORUS330-X2 can ensure high reliability and stability while working under wide range temperature from-20°C up to 50°C.

1090206_ HORUS330-X2 _靜態3D爆炸圖_有材質版本0309_3.png