Refer 1/2 Short ATR (Customization)


  • Intel 9th Gen. Xeon E-2276ME (6 cores, 4.5GHz)
  • High Memory Capacity DDR4 128GB
  • MIL-STD 810 Anti-Vibration, Shock
  • IP65 Rating with M12 Connectors
  • Extreme Temperature -40 to +60 degree
  • 18V~36V DC-DC 300W
  • MIL-STD 810 500.6 Low Pressure Altitude
  • Dimension : (WxHxD) 5″x 6.5″x 12″ (127x163x300 mm)

Intel Gold

Categories: ,

Technical Profile


Artificial Intelligence (AI) is accelerating the tactical capability of the military more than ever before. Many new combat and weapons systems utilize embedded AI, making them more efficient and less dependent on human operation.

Furthermore, SWaP (Reduced Size, Weight, and Power) requirements are also impacting artificial intelligence design. Now and in the future, many military systems will be susceptible to SWaP-constraints, which challenge the assumptions of today’s AI solutions.


Flight Certifiable Applications

F20L is suitable for high-performance computing in the harshest of environments. The combination of Intel and NVIDIA processors in SWaP package ensure it can be used across a wide range of military applications, including object tracking & targeting, data/radar processing, and artificial intelligence (AI).


F20L is designed to meet strict SWaP requirements and to withstand harsh environments, including extreme temperature, shock/vibration, sand/dust, and salt/fog. With ruggedized design and high functionality, the IP65 and MIL-STD resistance F20L is the ideal tactical vehicle on the battlefield.


System main board : EBX SBC-OXY5741A

The EBX SBC OXY5741A provides extraordinary computing performance under extreme environment. It is powered by 9th / 8th Gen Intel® Xeon® / Core ™. Featuring Intel’s Xeon E-2276ME and ruggedized open-standard EBX architecture, PERFECTRON EBX series is built tentatively and triumphs on environmental testing. It still operates effectively under harsh environments ranging from -40 to 85°C so that it is a perfect solution for defence, transportation, and automation applications. More key functions such as stackable PCIe/104 expansion ability, flexible I/O, and NVMe Gen 3.0 PCIex4 for fast and large capacity storage, all contribute to this versatile architecture that can meet clients’ needs.

Choosing an embedded architecture for computer systems can be a formidable task. This kind of stackable and mezzanine architecture often results in tradeoffs that include off-the-shelf or custom design requirements. PCIe/104 compact, ruggedized, easily expandable traits support a lot of expansion flexibility in systems. This architecture evolved to address these resulting issues by keeping the common background while eliminating limitations. OXY5741 employs PCIe/104 technology to reduce constraints and create flexibility of expansion. Its M.2 extension offers M-key (M-Key 2280 optional), and PCIe 3.0 x 4 NVMe. Additionally, OXY5741 provides 3.0 ports for data redundancy by supporting RAID 0/1.




F20L supports NVIDIA® QUADRO® RTX 5000™ which is powered by the NVIDIA Turing™ architecture, it’s compact, slim and reliable design makes it suitable for mission critical environment.

Shatter the boundaries of what’s possible with NVIDIA® Quadro RTX™ 5000. Powered by the NVIDIA Turing™ architecture and the NVIDIA RTX™ platform, it fuses ray tracing, deep learning, and advanced shading to supercharge next-generation workflows. Creative and technical professionals can make more informed decisions faster and tackle demanding design and visualization workloads with ease. Combined with NVIDIA NVLink™ technology, RTX 5000 scales graphics memory and performance to drive the most demanding rendering, AI, and visual computing workloads. And the all-new VirtualLink® provides connectivity to next-generation, high-resolution VR HMDs to let you view your work in the most compelling virtual environments. Welcome to the future of professional visual computing.






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CPUIntel® 9th Gen. Xeon E-2276ME (6 cores, 4.5GHz, 45W)
Memory type4x DDR4 SO-DIMM 2666 MHz, up to 128GB


Storage 11x M.2 NVMe, up to 2TB
Storage 21x mSATA, up to 1TB

Front I/O

USB2x USB, Rugged M12 connector
Ethernet4x LAN, Rugged M12 connectors
SDI4x BNC Connector
5G Network2x BNC connector
DC-IN1x 18V~36V DC-IN, Rugged M12 connector


Dimension (W x D x H)123.95(W) X 180(L)X 300(H) mm

Power Requirement

Power Input18V~36V DC-DC 300W

Applications & Operating System



MIL-STD-810 TestMethod 500.5, Procedures I and II (Altitude, Operation):

12,192M, (40,000 ft) for the initial cabin altitude (18.8Kpa or 2.73 Psia)

Method 500.5, Procedures III and IV (Altitude, Non-Operation):

15,240, (50,000 ft) for the initial cabin altitude (14.9Kpa or 2.16 Psia)

Method 501.5, Procedure I (Storage/High Temperature)

Method 501.5, Procedure II (Operation/High Temperature)

Method 502.5, Procedure I (Storage/Low Temperature)

Method 502.5, Procedure II (Operation/Low Temperature)

Method 503.5, Procedure I (Temperature shock)

Method 507.5, Procedure II (Temperature & Humidity)

Method 514.6, Vibration Category 24/Non-Operating (Category 20 & 24,Vibration)

Method 514.6, Vibration Category 20/Operating (Category 20 & 24,Vibration)

Method 516.6, Shock-Procedure V Non-Operating (Mechanical Shock)

Method 516.6, Shock-Procedure I Operating (Mechanical Shock)

ReliabilityNo Moving Parts; Passive Cooling.

Designed & Manufactured using ISO 9001 Certified Quality Program.


CE102 basic curve, 10kHz – 30 MHz

RE102-4, (1.5 MHz) -30 MHz – 5 GHz

RS103, 200 MHz – 3.2 GHz, 50 V/m equal for all frequencies

EN 61000-4-2: Air discharge: 8 kV, Contact discharge: 6kV

EN 61000-4-3: 10V/m

EN 61000-4-4: Signal and DC-Net: 1 kV

EN 61000-4-5: Leads vs. ground potential 1kV, Signal und DC-Net: 0.5 kV

CE and FCC


US20160231790A1 – PCI-104_0_2.pdf (1.14 MB)1.14 MB