AV710-VM-D

12 CH Video Management FPGA-GPU Based System

 

  • 12 Video Input Includes 4 HD-SDI and 8 Composite (PAL)
  • Support up to 4 videos output channels.
  • Support Output channel a Bird’s-Eye-View
  • 360 Stitching View from 4 Digital Videos Channel
  • Picture-In-Picture (PIP) up to 2 videos on top screen
  • Intel Xeon D For Data Storage , Input, Output
  • FPGA For Video Input, Video Output
  • Nvidia Jetson Orin For AI Object Detection
  • IP65 Sealed with External Cooling Blade
  • MIL-STD-810G Thermal, Shock, Vibration, Humidity
  • Power : 18V~36V EMI Filter DC Input
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Technical Profile

Introduction

Artificial intelligence is quickly becoming one of the most crucial elements of business success. Today, deploying powerful computing platforms to accelerate and scale AI-based products and services while adapting them to harsh environments has become vital in many successful military applications. 7Starlake is innovating to address the emerging high-throughput inference market driven by IoT edge devices which are generating huge amounts of data. The combination of FPGA and NVIDIA Jetson AGX is a powerful solution for demanding and latency-sensitive workloads.

Video Processing & Management UnitTank

 

Main Feature

  • Connection to 12 Video Input channels, including 4 HD-SDI video channels and 8 composite (PAL) Channels.
  • Generate from 2 up to 4 video output channels.
  • Keep Low Latency between input video channels and generated output video channels.
  • Generated Output channel a Bird’s-Eye-View created from 4 SDI input channels.
  • Each output channel can be selected into one main channel
  • Up to 2 videos inserted on top screen – Picture-In-Picture (PIP).

Video Processing & Management Unit-02

 

System DiagramSystem Diagram

 

System I/O

Front I/O

Front IO

 

Rear I/O

Rear IO

Specifications

System

CPUIntel® Xeon® D-2733NT, 8 core, 16 thread, 15MB Cache, 2.1GHz

Max Turbo up to 3.2GHz., up to 80W TDP

Intel® Xeon® D-2712T, 4 core, 8 thread, 15MB Cache, 1.9GHz

Max Turbo up to 3.0GHz., up to 65W TDP

Memory TypeUp to 128GB ECC RDIMM, DDR4-2666MHz

Up to 128GB ECC/non-ECC , DDR4-2666MHz

ChipsetIntel® SoC Intergrated
Ethernet ControllerDual LAN with 25G LAN via SoC

Dual LAN with 10G LAN via Intel® X550-AT2

LAN2x 10GBase-T LAN(Option) Or 2 x 25GBase-T LAN(Option)
Storage2x 2.5”SATA SSD hot-swap

1x NVMe M.2 2280 by PCIe

Power Type18V~36V EMI DC Input
Dimension250 x 350 x 100mm (WxDxH)
 

Front I/O

COM2x RS232/485
LAN2x 10GbE (Option) or 2 x 25GbE(Option)
USB 3.01x
USB 2.02x
Power1x DC-IN 18-36V
LED1x SSD LED
PW ButtonPower Switch with LED Indicator
SSD1x SSD swap tray
 

Rear I/O

PAL8x PAL Input
SDI Input4x
SDI Output2x
 

Environmental

MIL-STD-810 TestMethod 500.5, Procedures I and II (Altitude, Operation):

12,192M, (40,000 ft) for the initial cabin altitude (18.8Kpa or 2.73 Psia)

Method 500.5, Procedures III and IV (Altitude, Non-Operation):

15,240, (50,000 ft) for the initial cabin altitude (14.9Kpa or 2.16 Psia)

Method 501.5, Procedure I (Storage/High Temperature)

Method 501.5, Procedure II (Operation/High Temperature)

Method 502.5, Procedure I (Storage/Low Temperature)

Method 502.5, Procedure II (Operation/Low Temperature)

Method 503.5, Procedure I (Temperature shock)

Method 507.5, Procedure II (Temperature & Humidity)

Method 509.7 Salt Spray (50±5)g/L

Method 514.6, Vibration Category 24/Non-Operating (Category 20 & 24,Vibration)

Method 514.6, Vibration Category 20/Operating (Category 20 & 24,Vibration)

Method 516.6, Shock-Procedure V Non-Operating (Mechanical Shock)

Method 516.6, Shock-Procedure I Operating (Mechanical Shock)

ReliabilityConduction Cooling.

Designed & Manufactured using ISO 9001 Certified Quality Program.

Operating Temp.0 to +50°C
Storage Temp.-40 to +85°C
Relative Humidity5% to 95%, non-condensing
 

Operating System

Operating SystemWindows 10 64 Bit, Linux by option
RoHSRoHS compliant

Order Information

AV710-VM-D_Ordering Information.jpg

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Attachment
Datasheet