12 CH Video Management FPGA-GPU Based System


  • 12 Video Input Includes 4 HD-SDI and 8 Composite (PAL)
  • Support up to 4 videos output channels.
  • Support Output channel a Bird’s-Eye-View
  • 360 Stitching View from 4 Digital Videos Channel
  • Picture-In-Picture (PIP) up to 2 videos on top screen
  • Intel Xeon D For Data Storage , Input, Output
  • FPGA For Video Input, Video Output
  • Nvidia Jetson Orin For AI Object Detection
  • IP65 Sealed with External Cooling Blade
  • MIL-STD-810G Thermal, Shock, Vibration, Humidity
  • Power : 18V~36V EMI Filter DC Input

Technical Profile


Artificial intelligence is quickly becoming one of the most crucial elements of business success. Today, deploying powerful computing platforms to accelerate and scale AI-based products and services while adapting them to harsh environments has become vital in many successful military applications. 7Starlake is innovating to address the emerging high-throughput inference market driven by IoT edge devices which are generating huge amounts of data. The combination of FPGA and NVIDIA Jetson AGX is a powerful solution for demanding and latency-sensitive workloads.

Video Processing & Management UnitTank


Main Feature

  • Connection to 12 Video Input channels, including 4 HD-SDI video channels and 8 composite (PAL) Channels.
  • Generate from 2 up to 4 video output channels.
  • Keep Low Latency between input video channels and generated output video channels.
  • Generated Output channel a Bird’s-Eye-View created from 4 SDI input channels.
  • Each output channel can be selected into one main channel
  • Up to 2 videos inserted on top screen – Picture-In-Picture (PIP).

Video Processing & Management Unit-02


System DiagramSystem Diagram


System I/O

Front I/O

Front IO


Rear I/O

Rear IO



CPUIntel® Xeon® D-2733NT, 8 core, 16 thread, 15MB Cache, 2.1GHz

Max Turbo up to 3.2GHz., up to 80W TDP

Intel® Xeon® D-2712T, 4 core, 8 thread, 15MB Cache, 1.9GHz

Max Turbo up to 3.0GHz., up to 65W TDP

Memory TypeUp to 128GB ECC RDIMM, DDR4-2666MHz

Up to 128GB ECC/non-ECC , DDR4-2666MHz

ChipsetIntel® SoC Intergrated
Ethernet ControllerDual LAN with 25G LAN via SoC

Dual LAN with 10G LAN via Intel® X550-AT2

LAN2x 10GBase-T LAN(Option) Or 2 x 25GBase-T LAN(Option)
Storage2x 2.5”SATA SSD hot-swap

1x NVMe M.2 2280 by PCIe

Power Type18V~36V EMI DC Input
Dimension250 x 350 x 100mm (WxDxH)

Front I/O

COM2x RS232/485
LAN2x 10GbE (Option) or 2 x 25GbE(Option)
USB 3.01x
USB 2.02x
Power1x DC-IN 18-36V
PW ButtonPower Switch with LED Indicator
SSD1x SSD swap tray

Rear I/O

PAL8x PAL Input
SDI Input4x
SDI Output2x


MIL-STD-810 TestMethod 500.5, Procedures I and II (Altitude, Operation):

12,192M, (40,000 ft) for the initial cabin altitude (18.8Kpa or 2.73 Psia)

Method 500.5, Procedures III and IV (Altitude, Non-Operation):

15,240, (50,000 ft) for the initial cabin altitude (14.9Kpa or 2.16 Psia)

Method 501.5, Procedure I (Storage/High Temperature)

Method 501.5, Procedure II (Operation/High Temperature)

Method 502.5, Procedure I (Storage/Low Temperature)

Method 502.5, Procedure II (Operation/Low Temperature)

Method 503.5, Procedure I (Temperature shock)

Method 507.5, Procedure II (Temperature & Humidity)

Method 509.7 Salt Spray (50±5)g/L

Method 514.6, Vibration Category 24/Non-Operating (Category 20 & 24,Vibration)

Method 514.6, Vibration Category 20/Operating (Category 20 & 24,Vibration)

Method 516.6, Shock-Procedure V Non-Operating (Mechanical Shock)

Method 516.6, Shock-Procedure I Operating (Mechanical Shock)

ReliabilityConduction Cooling.

Designed & Manufactured using ISO 9001 Certified Quality Program.

Operating Temp.0 to +50°C
Storage Temp.-40 to +85°C
Relative Humidity5% to 95%, non-condensing

Operating System

Operating SystemWindows 10 64 Bit, Linux by option
RoHSRoHS compliant

Order Information

AV710-VM-D_Ordering Information.jpg