Military Mission GPU Computer, Data Recorder


  • MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions
  • Data Recorder up to 32TB storage with RAID 0/1/5
  • Intel® 9th Gen. Coffee Lake (H) Xeon® E-2276ML processor
  • Up to 128GB DDR4 SO-DIMM, non-ECC and ECC
  • NVIDIA RTX™ A1000, 2048 CUDA® cores, 4GB GDDR6 memory
  • NVMe 3.0 512GB.(MB/sec, Max.) 3,400/3,200 MB
  • MIL-STD-461 18V~36V DC-Input (Options for MIL-704/1275)
  • Extreme Temperature : -40°C to +60°C
  • Optional with External GPU Turbo Kit
  • Dimensions : 250(W) x 325 (L) x 100 (H) mm

 Special Request :

  • Frame Grabber : 4xCH HD-SDI
  • Discrete IO : 4xDI 4xDO
  • Dual Redundant MIL-STD-1553 connections
  • Dual ARINC 429 input connections
  • Data Recorder: Up to 32TB SATA III SSD

Intel Gold

Technical Profile


AV600X-CH is driven by Intel® 9 Gen. Coffee Lake-H Xeon Processors. These processors are manufactured on Intel’s most up-to-date and optimized 14 nm technology, up to 6 CPU cores. It is high computing performance and flexibility for heavier IoT workloads. The H-series processors are ideally suited for space-constrained and purpose-built designs. Multiple offerings for scalable performance, enhanced performance over previous generation with up to 6 cores.

Designed for Harsh Environment
AV600X-CH highlights on its rugged design and high functionality, the system especially installed MIL-STD Amphenol type connectors and full IP65 protection allow system withstand in any kind of harsh environment. AV600X-CH supports extended temperature from -40°C to 55°C and MIL-STD-461 18V~36V DC-input Power supply which can protect system from damages caused by sudden surge of voltage, thus further secure the reliability of its critical components and the system itself. 
Block Diagram
AV600X-CH Block Diagram


CE Verification

CE Verification




CPUIntel® Xeon® E-2276ME, 45W Coffee Lake 9th Gen, 6C , Freq. 2.8 /4.5 GHz, 12MB cache

Intel® Xeon® E-2276ML, 25W Coffee Lake 9th Gen, 6C , Freq. 2.0 / 4.2 GHz, 12MB cache

Memory type4 x 260 Pin DDR4 2400MHz SO-DIMM (up to 128GB, XEON®SKU support ECC)
GPUNVIDIA RTX™ A1000/A2000 embedded graphics

– Standard MXM 3.1 Type A (82 x 70 mm)

– 2048/2560 CUDA® cores, 16 RT Cores, and 64 Tensor Cores

– 6.66TFLOPS peak FP32 performance

– 4GB/8GB GDDR6 memory, 128-bit

On board StorageNVMe 3.0 512GB.(MB/sec, Max.) 3,400/3,200 MB
Expansion Slot1 x M.2(M-key,Type: 2280 , SATA/PCIe 3.0 x 4 NVMe)

2 x Mini PCIe Full size (USB / PCIe and 1 x micro SIM Card)

1 x PCIe/104, 1 x FPE

TPMTPM 2.0 (SLB9665)
VIDEO INPUT4 Channel capture module for 4 x SMA male connectors >(optional)


SATA1x 2.5” SSD, Up to 4x SSD for Data recorder
M.21x 2280 M key (SATA only)

Front I/O

DC-in1x DC-in , with D38999 connector
X11x DVI , with D38999 connector
X21x DVI , with D38999 connector
X32x GLAN + 3 x USB 2.0, with D38999 connector
X44x RS232/422/485 + 4 BIT DIO, with D38999 connector
LED1x SSD/HDD LED indicator
switch1x IP65 power button , with LED indicator


Power inputMIL-STD -461 18V~36V DC-Input

Application, Operating System

ApplicationMilitary Platforms Requiring Compliance to MIL-STD-810 Where Harsh Temperature, Shock, Vibration, Altitude, Dust and MIL-461 EMI Conditions.
Operating SystemWindows® 10 64-bit / Linux (support by request)


Dimension250(W) x 325 (L) x 100 (H)mm, (L=395mm for Data recorder, Options)
Weight10.5 Kg
ChassisAluminum Alloy
HeatsinkHeatsink Aluminum Alloy, Corrosion Resistant


Green ProductRoHS, WEEE compliance
Operating Temp.-40°C to +60°C
Storage Temp.-40°C to +85°C
Relative Humidity5% to 95%, non-condensing
MIL-STD-810Method 507.5, Procedure II ( Temperature & Humidity )
Method 516.6 Shock-Procedure V Non-Operating ( Mechanical Shock )
Method 516.6 Shock-Procedure I Operating ( Mechanical Shock )
Method 514.6 Vibration Category 24/Non-Operating ( Category 20 & 24, Vibration )
Method 514.6 Vibration Category 20/Operating ( Category 20 & 24, Vibration )
Method 501.5, Procedure I ( Storage/High Temperature )
Method 501.5, Procedure II ( Operation/High Temperature )
Method 502.5, Procedure I ( Storage/Low Temperature )
Method 502.5, Procedure II ( Operation/Low Temperature )
Method 503.5, Procedure I ( Temperature shock )
ReliabilityNo Moving Parts; Passive Cooling.
Designed & Manufactured using ISO 9001 / 2000 Certified Quality Program.
CE102  :   10 KHz – 10 MHz
RE102-4 : 1.5 MHz -30 MHz – 5 GHz
RS103 :    200 MHz – 3.0 GHz – 5.0 GHz, 50 V/m equal for all frequencies

Designed to Meet Items ( Options )

CS101, CS114, CS115, CS116
CE106, RE103, RS101
MIL-STD-1275Steady State20V-33V
Surge Low18V/500ms
Surge High100V/500ms

Order Information


Verification of Compliance

Thermal Solution