AV600X-CH

Military Mission GPU Computer, Data Recorder

MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions
Data Recorder up to 32TB storage with RAID 0/1/5
Intel^® 9th Gen. Coffee Lake (H) Xeon^® E-2276ML processor
Up to 128GB DDR4 SO-DIMM, non-ECC and ECC
NVIDIA RTX™ A1000, 2048 CUDA^® cores, 4GB GDDR6 memory
NVMe 3.0 512GB.(MB/sec, Max.) 3,400/3,200 MB
MIL-STD-461 18V~36V DC-Input (Options for MIL-704/1275)
Extreme Temperature : -40°C to +60°C
Optional with External GPU Turbo Kit
Dimensions : 250(W) x 325 (L) x 100 (H) mm

Special Request :

Frame Grabber : 4xCH HD-SDI
Discrete IO : 4xDI 4xDO
Dual Redundant MIL-STD-1553 connections
Dual ARINC 429 input connections
Data Recorder: Up to 32TB SATA III SSD

Intel Gold

Categories: 1-CPU 1-GPU, Defense, GPU System, IP65 Mission Computer

Technical Profile

Introduction

AV600X-CH is driven by Intel^® 9 Gen. Coffee Lake-H Xeon Processors. These processors are manufactured on Intel’s most up-to-date and optimized 14 nm technology, up to 6 CPU cores. It is high computing performance and flexibility for heavier IoT workloads. The H-series processors are ideally suited for space-constrained and purpose-built designs. Multiple offerings for scalable performance, enhanced performance over previous generation with up to 6 cores.

Designed for Harsh Environment

AV600X-CH highlights on its rugged design and high functionality, the system especially installed MIL-STD Amphenol type connectors and full IP65 protection allow system withstand in any kind of harsh environment. AV600X-CH supports extended temperature from -40°C to 55°C and MIL-STD-461 18V~36V DC-input Power supply which can protect system from damages caused by sudden surge of voltage, thus further secure the reliability of its critical components and the system itself.

Block Diagram

Appearance

CE Verification

Specifications

System

CPU

Intel® Xeon® E-2276ME, 45W Coffee Lake 9th Gen, 6C , Freq. 2.8 /4.5 GHz, 12MB cache

Intel® Xeon® E-2276ML, 25W Coffee Lake 9th Gen, 6C , Freq. 2.0 / 4.2 GHz, 12MB cache

Memory type

4 x 260 Pin DDR4 2400MHz SO-DIMM (up to 128GB, XEON®SKU support ECC)

CHIPSET

CM246

GPU

NVIDIA RTX™ A1000/A2000 embedded graphics

– Standard MXM 3.1 Type A (82 x 70 mm)

– 2048/2560 CUDA^® cores, 16 RT Cores, and 64 Tensor Cores

– 6.66TFLOPS peak FP32 performance

– 4GB/8GB GDDR6 memory, 128-bit

On board Storage

NVMe 3.0 512GB.(MB/sec, Max.) 3,400/3,200 MB

Expansion Slot

1 x M.2(M-key,Type: 2280 , SATA/PCIe 3.0 x 4 NVMe)

2 x Mini PCIe Full size (USB / PCIe and 1 x micro SIM Card)

1 x PCIe/104, 1 x FPE

TPM

TPM 2.0 (SLB9665)

VIDEO INPUT

4 Channel capture module for 4 x SMA male connectors >(optional)

Storage

SATA

1x 2.5” SSD, Up to 4x SSD for Data recorder

M.2

1x 2280 M key (SATA only)

Front I/O

DC-in

1x DC-in , with D38999 connector

1x DVI , with D38999 connector

2x GLAN + 3 x USB 2.0, with D38999 connector

4x RS232/422/485 + 4 BIT DIO, with D38999 connector

LED

1x SSD/HDD LED indicator

switch

1x IP65 power button , with LED indicator

Power

Power input

MIL-STD -461 18V~36V DC-Input

Application, Operating System

Application

Military Platforms Requiring Compliance to MIL-STD-810 Where Harsh Temperature, Shock, Vibration, Altitude, Dust and MIL-461 EMI Conditions.

Operating System

Windows^® 10 64-bit / Linux (support by request)

Physical

Dimension

250(W) x 325 (L) x 100 (H)mm, (L=395mm for Data recorder, Options)

Weight

10.5 Kg

Chassis

Aluminum Alloy

Heatsink

Heatsink Aluminum Alloy, Corrosion Resistant

Environmental

Green Product

RoHS, WEEE compliance

Operating Temp.

-40°C to +60°C

Storage Temp.

-40°C to +85°C

Relative Humidity

5% to 95%, non-condensing

MIL-STD-810

Method 507.5, Procedure II ( Temperature & Humidity )
Method 516.6 Shock-Procedure V Non-Operating ( Mechanical Shock )
Method 516.6 Shock-Procedure I Operating ( Mechanical Shock )
Method 514.6 Vibration Category 24/Non-Operating ( Category 20 & 24, Vibration )
Method 514.6 Vibration Category 20/Operating ( Category 20 & 24, Vibration )
Method 501.5, Procedure I ( Storage/High Temperature )
Method 501.5, Procedure II ( Operation/High Temperature )
Method 502.5, Procedure I ( Storage/Low Temperature )
Method 502.5, Procedure II ( Operation/Low Temperature )
Method 503.5, Procedure I ( Temperature shock )

Reliability

No Moving Parts; Passive Cooling.
Designed & Manufactured using ISO 9001 / 2000 Certified Quality Program.

MIL-STD-461

CE102 : 10 KHz – 10 MHz
RE102-4 : 1.5 MHz -30 MHz – 5 GHz
RS103 : 200 MHz – 3.0 GHz – 5.0 GHz, 50 V/m equal for all frequencies

Designed to Meet Items ( Options )

CS101, CS114, CS115, CS116

CE106, RE103, RS101

MIL-STD-1275

Steady State

20V-33V

Surge Low

18V/500ms

Surge High

100V/500ms

Order Information

VERIFICATION of COMPLIANCE

Thermal Solution

Video

Download

Attachment	Size
AV600 MIL-810 514.6 Operation_2.pdf (1.4 MB)	1.4 MB
AV600 MIL-810 514.6 None-Operation_2.pdf (1.38 MB)	1.38 MB
7Starlake_AV600X-CH_QTP_20230131.pdf (5.42 MB)	5.42 MB
7Starlake_CE_Safety Report.pdf (2.64 MB)	2.64 MB
7StarLake_CE_EMI-EMC_Test Report_AV600.pdf (5.81 MB)	5.81 MB
Datasheet
e-DM