Military IP66 Mission GPU Computer


  • MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
  • IP66 Chassis with D38999 connectors
  • Intel® 11th Gen. Tiger Lake(H) W-11865MLE Processors, up to 8 cores
  • 64GB DDR4 SO-DIMM ECC or non ECC support
  • NVIDIA RTX™ A2000 MXM 8GB GDDR6 2560 CUDA cores
  • 2.5” SATA SSD
  • 1x 3G-SDI Capture Card (Options)
  • MIL-STD-461 18V~36V DC-Input
  • Extreme Temperature: -20°C to +60°C degree

 Special Request :


  • Frame Grabber : 4 x CH HD-SDI
  • Discrete IO : 4 x DI + 4 x DO
  • 10GbE : Dual 10GbE (Intel X710) Ethernet Ports
  • Dual Redundant MIL-STD-1553 connections
  • Dual ARINC 429 input connections
  • Conformal coating on electronics

Intel Gold

Technical Profile


AV600TH-A20-PA1 is driven by Intel® 11 Gen. Tiger Lake-H Processors, integrated Intel® UHD Graphics (Xe architecture). Tiger Lake H processor is built on 10nm SuperFin Technology, up to 8 CPU cores and 4.5 GHz frequency. It is high computing performance and flexibility for heavier IoT workloads, the platform posts significant performance gains gen-over-gen with up to 32 percent gain in single-thread performance. It also features in high-bandwidth, high speed I/Os for expansion and peripherals.

AV600TH-A20-PA1 highlights on its rugged design and high functionality, the system especially installed MIL-STD Amphenol type connector and full IP66 protection allow system withstand in any kind of harsh environment. AV600TH-A20-PA1 supports extended temperature from -40°C to 70°C and MIL-STD-461 18V~36V DC-input Power supply which can protect system from damages caused by sudden surge of voltage, thus further secure the reliability of its critical components and the system itself.


ARINC 429 is the worldwide standard for data transmission in aircraft electronics. It is adopted mostly for commercial aircraft and transport aircraft network protocol standard. Communications, guidance, altitude, altitude reference, flight management, and more are all needed to work together to accomplish a successful flight. The physical connection wires are twisted pairs carrying balanced differential signaling.

The ARINC 429 unit of transmission is a fixed-length 32-bit frame, which the standard refers to as a ‘word’. The bits within an ARINC 429 word are serially identified from Bit Number 1 to Bit Number or simply Bit 1 to Bit 32.





CPUIntel® 11th  Gen. Tiger Lake-H Processors, up to 8 cores, integrated Intel® UHD Graphics

Intel® Xeon® W-11865MLE, 25W Tiger Lake 11th Gen, 8C, Freq. 1.5/4.5 GHz, 24MB cache

Memory typeUp to 96GB DDR4 SO-DIMM, non-ECC and ECC
CHIPSETIntel® RM590E (support ECC, with Xeon CPU) /QM580E

4GB/8GB GDDR6 memory, 2048/2560 CUDA cores

Expansion Slot2 x Full-size mini PCIe (1 with mSATA supported)

1 with mSATA/USB2.0/PCIeX1 support

1 with SIM/USB2.0/PCIeX1 support

1 x 2280 M key (SATA only)



SATA1 x 2.5” SSD, Hot Swappable SSD/HDD slot
M.21 x 2280 M key (SATA only)


Ethernet (Internal)2 x 10/100/1000 Ethernet Ports

Front I/O

X12 x GbE LAN + 2 x USB2.0 + 1 x COM(RS232) with D38999 connector
X21 x VGA+ 4 x DI/4 x DO +3 x RS422, with D38999 connector
X31 x USB3.0, with D38999 connector
X41 x USB3.0, with D38999 connector
X51 x DC-in, with D38999 connector
LED1 x SSD/HDD LED indicator
switch1 x IP65 power button, with LED indicator
SSD2 x 2.5”Easy swap SSD Tray


Power inputMIL-STD -461 18V~36V DC-Input

Application, Operating System

ApplicationMilitary Platforms Requiring Compliance to MIL-STD-810 Where Harsh Temperature, Shock, Vibration, Altitude, Dust and MIL-461 EMI Conditions.
Operating SystemWindows® 10 64-bit / Linux (support by request)


Dimension250 x 325 x 100 mm (LxWxH)
Weight11 KG
ChassisAluminum Alloy
HeatsinkHeatsink Aluminum Alloy, Corrosion Resistant


Green ProductRoHS, WEEE compliance
Operating Temp.-20°C to +60°C
Storage Temp.-40°C to +85°C
Relative Humidity5% to 95%, non-condensing
MIL-STD-810Method 507.5, Procedure II ( Temperature & Humidity )
Method 516.6 Shock-Procedure V Non-Operating ( Mechanical Shock )
Method 516.6 Shock-Procedure I Operating ( Mechanical Shock )
Method 514.6 Vibration Category 24/Non-Operating ( Category 20 & 24, Vibration )
Method 514.6 Vibration Category 20/Operating ( Category 20 & 24, Vibration )
Method 501.5, Procedure I ( Storage/High Temperature )
Method 501.5, Procedure II ( Operation/High Temperature )
Method 502.5, Procedure I ( Storage/Low Temperature )
Method 502.5, Procedure II ( Operation/Low Temperature )
Method 503.5, Procedure I ( Temperature shock )
ReliabilityNo Moving Parts; Passive Cooling.
Designed & Manufactured using ISO 9001 / 2000 Certified Quality Program.
MIL-STD-461CE102  :   10 KHz – 10 MHz
RE102-4 : 1.5 MHz -30 MHz – 5 GHz
RS103 :    200 MHz – 3.0 GHz – 5.0 GHz, 50 V/m equal for all frequencies

Designed to Meet Items ( Options )

CS101, CS114, CS115, CS116
CE106, RE103, RS101
MIL-STD-1275Steady State20V-33V
Surge Low18V/500ms
Surge High100V/500ms

Order Information

Order Information

Model Name


AV600TH-A10Intel® 11th Gen. Tiger Lake(H) W-11865MLE, RTX A1000 MXM, 1x 2.5” SATA SSD Easy Swap Tray, 18V-36V DC-IN, support MIL-STD-461, MIL-STD-810. with MIL-DTL-D38999 Connectors, Operating Temp. -40 to +60°C
AV600TH-A20-PA1Intel® 11th Gen. Tiger Lake(H) W-11865MLE, RTX A2000 MXM, 1x 2.5” SATA SSD Easy Swap Tray, 1x 3D-SDI Capture Card, 18V-36V DC-IN, support MIL-STD-461, MIL-STD-810. with MIL-DTL-D38999 Connectors, Operating Temp. -40 to +60°C

Thermal Solution