Military MXM GPU Computer  


  • MIL-STD 810 Thermal, Vibration, Shock
  • 7th Gen Intel® Core™ Kaby Lake i7-7820EQ, 4C, 8T, 3.0/3.7GHz, 8Mb cache, TDP45W
  • DDR4 Up to 32GB
  • MXM GTX 1050Ti (768CUDA, 4GBGDDR5)
  • Options : RTX A2000 (2560CUDA, 8GB GDDR6)
  • 2x mPCIe expansion slot (One supports mSATA)
  • 2x Intel® Gigabit Ethernet
  • 4x USB3.0, 1x COM port
  • 12V DC-Input
  • Extended Temperature -40°C to 60°C

Technical Profile


AV200, EBX rugged system is a powerful system that is driven by Intel® 7th generation Kabylake CPU and chipset soldering onboard, integrated with Nvidia GPU GTX 1660S/1050Ti that supports 2 independent DisplayPort. Processor i7-7820EQ plus Intel® QM175 chipset supports clock speed 3.0GHz, up to 3.7GHz. Quad cores, turbo up to 8 cores to cope with enormous data computing. Apart from computing power, the system is able to survive in harsh environment from -40 to 60°C, and ruggedness for vibration and shock is proven to pass MIL-810G standard. With the combination of high CPU computing power and rich display inputs, AV200 is a perfect portable solution for rugged consoles & workstations, transportation, defense control room to share instant and accurate information on huge screen for in-time solutions.



Thermal solution for fanless system design


1090205_ AV200 _動態3D爆炸圖_有材質版本.89-1.png

7starlake designs a unique enclosure that is able to stack together both horizontally and vertically. The aluminum heat sink enclosure allows dual-sided heat dissipation. 7starlake exclusively adopts special heat radiating material and combining with special CNC cutting, further forged into a lavish sophisticated metal. Apart from the special heat sink enclosure, AV200 innovatively adopts two kinds of copper heat spreader. The shape and the size of the spreader are tailor-made based on the heat sources placement of CPU module and graphic module. In view of the gap difference between motherboard and heat sink, 7starlake builds two heat spreaders in different thicknesses. Combining all these exclusive thermal designs can alternatively replace traditional fan, and also ensures high reliability and stability while working under wide range temperature from -40°C to 60°C.


Support OpenVINO™

The  AV200 is an AI hardware ready system ideal for deep learning inference computing, AV200 support Intel OpenVINO™(Open Visual Inference & Neural Network Optimization),Intel® architecture-based processor (CPU) and Integrated GPU and deep learning accelerator (FPGA, Movidius ™ VPU) deep learning acceleration chip to enhance vision system functions and performance. It’s also runs great with the Intel Neural Compute Stick , and helps developers to create cost-effective and robust computer vision applications. It enables deep learning inference at the edge and supports heterogeneous execution across computer vision accelerators.



System main board: EBX SBC-OXY5740A

1. Intel® Core i7 CPU soldering onboard

AV200 is based on EBX SBC—OXY5740A, powered by Intel Kabylake i7-7820EQ quad core processor plus QM175 chipset soldered onboard. With CPU soldering onboard, there is less conduction of heat and high density interconnection between the motherboard and the components, which reduces the MB from the crisis of overheating. Apart from overheating, soldering onboard also provides the best level of shock and vibration protection, removing the unnecessary concern about poor connection that CPU socket type may bring.


2. Two Independent DisplayPort

AV200 has added on NVIDIA graphic card through PCIe/104 interface, supporting 2 independent DisplayPort which is driven by GPU GTX1050Ti. GTX1050Ti itself has 768 CUDA Cores, representing its high computing performance and consumes power at 75W maximum. Connecting by PCIe/104 interface which enhance the resistance of shock and vibration as the connector allows nearly seamless connecting.


3. Wide Range DC input

For military and heavy duty vehicle applications, instable voltage always brings headaches about damaging the electric components. AV200 supports 9V to 36V DC-in, the flexible acceptance of inconsistent power input makes it capable of surviving tough engine cranks and transient over-voltage situations.


Supporting NVIDIA GTX 1660S/1050 Ti


Powered by NVIDIA, CUDA® is a parallel computing platform and programming model developed by NVIDIA for general computing on graphical processing units (GPUs). With CUDA, developers are able to dramatically speed up computing applications by harnessing the power of GPUs. In GPU-accelerated applications, the sequential part of the workload runs on the CPU – which is optimized for single-threaded performance – while the compute intensive portion of the application runs on thousands of GPU cores in parallel.

MXM GPU_20200624


Related Products

SK1660-NVIDIA GTX1660SUPER MXM 3.1 Graphics Module

  • Powered by NVIDIA GeForce GTX 1660 SUPER
  • NVIDIA CUDA technology with 1408 Cores
  • MXM 3.1 Type B Support DirectX 12, OpenGL 4.6, Vulkan API
  • Support for 4 outputs
  • 192-bit width, 6GB , GDDR6 High-Speed Memory
  • Power Consumption: 120W



Related Products II

SK1050-NVIDIA GTX1050Ti MXM 3.1 Graphics Module

  • Powered by NVIDIA GeForce® GTX1050Ti
  • MXM 3.1Type-A Module
  • High-speed 4GB GDDR5 Memory
  • 768 new-gen. Pascal architecture CUDA cores
  • Outputs 4 Channel Support DisplayPort 1.2 Certified.
  • DisplayPort 1.3/1.4 Ready
  • Support NVIDIA CUDATM, OptimusTM, DirectX® 12, OpenGL® 4.5

SK250-NVIDIA GTX1050Ti MXM 3.1 Graphics Module_01.jpg


Operating Temp.

-40°C to 60°C (ambient with air flow)


CPUIntel® Core™ Kaby Lake
Intel® Core™i7-7820EQ, 4C, 8T, 3.0/3.7GHz, 8Mb cache, TDP45W
GPUGeForce GTX 1050 Ti, 768 CUDA Cores, 4GB GDDR5
Memory TypeDDR4 SDRAM, Up to 32GB
Expansion Slot1x Full-size mPCIe (w/ SIM card and mSATA supported)
1x Half-size mPCIe
Storage DeviceOnboard uSSD SATAIII 64GB
1x 2.5 Easy swap HDD/SSD Tray

Front I/O

USB2x USB3.0
2.5″ SSD/HDD Tray1x
Power button1x System On/Off
Indicator LED1x Power, 1x HDD, 1x LAN (Link/Active/Speed)

Rear I/O

USB2x USB 3.0
Display4x DP
1x DVI-I
Audio2x 3.5mm Audio Jacks (1x MIC, 1x Line-Out)
Serial Port1x RS232/422/485
Ethernet2x RJ45
Power Input1x 4P Rugged Terminal connector

OS support list

WindowsWindows 10
LinuxFedora 20、Ubuntu 13.04、Ubuntu 13.10、Ubuntu 14.04

Mechanical and Environment

Power Requirement9V~36V DC-IN
Dimension (WxDxH)315.2 x 150 x 120 mm
Weight6 Kg (13.23 lbs)
Operating Temp.-40°C to 60°C (ambient with air flow)
Storage Temp.-40°C to 70°C
Relative Humidity10% to 90%, non-condensing

Test Standard

EMCCE, FCC compliant
EMCCE and FCC compliance
Green ProductRoHS, WEEE compliance



AV200 - NVIDIA GTX950M GPGPU Server_CPU_01

The AV200 offers highly effectively heat conductive and heat convective thermal solutions to meet the demands of customers’ extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.


AV200  CPU i7-7820EQ ,NVIDIA GTX1660S  Performance




CPU  Temperature95100100100
CPU Frequency(Ghz)3.39Ghz3.08Ghz2.84Ghz2.65Ghz
GPU Temperature88909090
GPU Frequency(Ghz)1.68Ghz1.44Ghz1.2Ghz600Mhz


Test Configuration



CPU TypeIntel® Core i7-6820EQ 2.8 GHz, Intel® Core i7-7820EQ 3.7 GHz
Memory1 x DDR4 2400 XR-DIMM up to 16GB w/ECC
Memory1 x DDR4 2400 SO-DIMM up to 16GB w/ECC
GraphicNVIDIA GTX1050ti, GTX1660S
LAN1Intel® I219 GbE LAN
LAN2Intel® I210 GbE LAN
Test SoftwareBurnin test v6.0、AS SSD、 Intel Extreme Tuning Utility、
iperf GPU-Z、FurMark v1.9.2
ChamberKSON THS-b4t-150
Chipeng SMO-3


Thermal Measurement
7STARLAKE provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus 7STARLAKE conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, 7STARLAKE is able to analyses the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 9 hours which at each temperature point we burn in AV200 for two hour, from 40°C to 60°C.


Device ModelAV200
TesterRobin Chang
Test ResultPass
Test TemperatureHigh 0°C~60°C / Low -40°C~0°C
Test Time11.5Hours / 3Hours
Test StandardReference IEC60068-2
Test SoftwareBurnin test v6.0
CriteriaAfter testing, system can’t halt.

Thermal Solution

Effective cooling solution for maximum heat dissipation:

7STARLAKE implements unique cooling solution with heat spreader and aluminum heat sink for maximum heat dissipation. With the aluminum heat sink enclosure allows dual-sided heat dissipation. We especially adopt the physical property of aluminum, the heat spreader touches the heat source – processor and chipset and absorbs the heat rapidly, the aluminum heat sink dissipates the heat into surrounding air promptly. With the benefits of fanless design, AV200 can ensure high reliability and stability while working under wide range temperature from -40 up to 60°C.




SR200_Shcok_Test Report_6.pdf (1.22 MB)1.22 MB