3U VPX 5 Slot Conduction Cooled ATR System


  • 5 Slot –3 Payload plus 2 Peripheral
  • Intel 11th Tiger Lake W-11865MRE
  • NVIDIA MXM RTX A4500(5888 CUDA)
  • 28V DC Input MIL-461/1275/704
  • 300W Payload By Forced-Air Cooled
  • 600W Payload By Liquid Cooled
  • Design to Meet MIL-STD-810, MIL-STD-461/1275/704, MIL-S-901D
  • Custom backplanes with VPX and SOSA aligned slot profiles
  • Custom I/O options including MIL-STD Wiring & Connectors
  • Hybrid Conduction Cooled & Heat Exchanger Sidewalls
  • Extreme Temperature -40°C to 60°C

Intel Gold

Technical Profile


7SL-3500 3U-VPX

The 7SL-3500 VPX System is a modular Military Rugged ATR enclosure, geared for 3U OpenVPX designs. The versatile design allows multiple customizable configurations based on proven components and design techniques. 7SL-3500 Hybrid conduction cold plate assisted by forced air sets with aggregate power demands over 300W , assisted by liquid up to 600W. Custom and standard 5 to 6 slot backplanes with VPX and SOSA aligned slot profiles in combinations supporting high speed signal processing applications. Scalable to multi CPU-GPU-FPGA requirements Designed expressly for Gen 4.0 ultra-high wattage military systems.



7StarLake scalable and customizable, rugged VPX ATR System enables compute-intensive, SWaP constrained mission-critical applications for deployment in the world’s most demanding military and aerospace environments.



7SL3500_3 Products_Table


7StarLake Advanced Thermal Solutions

From ships at sea to high-altitude Drone, 7StarLake ATS solutions enable
electronics survivability in the harshest environments. As an ever-increasing number of data acquisition methods are utilized in military and aerospace, the need to convert that rising data tide into precise, real-time action only escalates.
Applications like object targeting , ground vehicles tracking, thermal image monitoring, and multiple simultaneous sensors feeds. When a wealth of such sources need aggregation and immediate analysis, potentially with graphical visualization output to any number of displays, VPX-based systems can ensure proven solutions.


Conduction Cooled_7SL-3500CC


Conduction cooled SBC have traditionally been deployed in applications where heat evacuation with an airflow is impractical.



Conduction Cooled-01

  • As the most common heat-transfer device available, heat pipes can manage the transfer of heat between two solid interfaces effectively. Combining the advantages of thermal-conductivity and phase transition, heat pipes are extremely light-weight compared with traditional cooling methods.
  • For the highest thermal dissipation and thermal density, heat pipes can be very effective in conduction cooled environments.
  • The heat pipes are embedded in a symmetrical topology from the sidewall, allowing the assembly to be less sensible to gravity or acceleration.



Force Air Conduction Cooled_7SL-3500FA



  • 7SL-3500 Hybrid conduction cold plate assisted by forced air sets with aggregate power demands over 300W
  • Internal recirculation fans ensure dry air is forced across conduction or air-cooled payload modules, minimizing hot-spots and dissipating heat homogeneously




Liquid Cooled_7SL-3500LC


Advanced conduction liquid cooling systems that enables higher powered, compact electronics in ruggedized military, aerospace applications.


7SL-3500-LC is a VPX-REDI Liquid-cooled enclosure utilizing
side-wall cooling within the enhanced wedge-lock guide rails
(increased 50% contact area) cooling of standard conduction
Liquid Cooling Hardware Implementations. In order to effectively
reduce overall temperature and prevent the leakage of the liquid,
7StarLake innovated a unique heat exchanger which integrating
Conduction Liquid Cold Plate (C.L.C.P.) building in most advanced
” Gun Drilled “, which with 4 pipes (each pipe 10mm x 10mm x
400mm) to dissipate max 1KW heat on the 3/4 ATR system.



Product Appearance7SL-3500_Appearance




CPUIntel® Xeon® W-11865MRE processor (formerly Tiger Lake-H)

Up to 8 cores (TDP 45W)

Memory typeUp to 64 GB DDR4-2666 soldered with ECC
GPUOption 1 : NVIDIA RTX A4500, 16GB GDDR6, 5,888 CUDA

Option 2 : NVIDIA RTX 5000, 16GB GDDR6, 3,072 CUDA

BIOSDual 256Mbit SPI flash


TPMDiscrete TPM 2.0 chip


M.21x M.2 2242 on top side (M-key)

Side I/O (D38999)

X1/X22x USB3.0
X3/X42x GbE
X51x DVI
X61x DC-IN
Secure1x AES KEY
Power Button1x

OS support list

OSWindows 10, Linux (kernel 5.4 and higher)


ApplicationMilitary Platforms Requiring Compliance MIL-STD-810

Embedded Computing and applications subject to Harsh Temperture, Shock, Vibration, Atitude, Dust and EMI Conditions.



Power Requirement18V~36V DC-IN
Dimension192.9 x 389.5 x 269 mm
Weight13 KG
Operating Temp.-40°C to 60°C
Storage Temp.-40°C to 85°C
MIL-STD-810 TestMethod 500.5, Procedures I and II (Altitude, Operation):

12,192M, (40,000 ft) for the initial cabin altitude (18.8Kpa or 2.73 Psia)

Method 500.5, Procedures III and IV (Altitude, Non-Operation):

15,240, (50,000 ft) for the initial cabin altitude (14.9Kpa or 2.16 Psia)

Method 501.5, Procedure I (Storage/High Temperature)

Method 501.5, Procedure II (Operation/High Temperature)

Method 502.5, Procedure I (Storage/Low Temperature)

Method 502.5, Procedure II (Operation/Low Temperature)

Method 503.5, Procedure I (Temperature shock)

Method 507.5, Procedure II (Temperature & Humidity)

Method 509.7 Salt Spray (50±5)g/L

Method 514.6, Vibration Category 24/Non-Operating (Category 20 & 24,Vibration)

Method 514.6, Vibration Category 20/Operating (Category 20 & 24,Vibration)

Method 516.6, Shock-Procedure V Non-Operating (Mechanical Shock)

Method 516.6, Shock-Procedure I Operating (Mechanical Shock)



No Moving Parts; Passive Cooling.

Designed & Manufactured using ISO 9001 Certified Quality Program.


Safety & EMC

EMCEN 61000-4-2: Air discharge: 8 kV, Contact discharge: 6kV

EN 61000-4-3: 10V/m

EN 61000-4-4: Signal and DC-Net: 1 kV

EN 61000-4-5: Leads vs. ground potential 1kV, Signal und DC-Net: 0.5 kV

MIL-STD-461CE102 basic curve, 10kHz – 30 MHz

RE102-4, (1.5 MHz) -30 MHz – 5 GHz

RS103, 200 MHz – 3.2 GHz, 50 V/m equal for all frequencies

MIL-STD-1275Steady State – 20V~33V,

Surge Low – 18V/500ms,

Surge High – 100V/500ms

Emitted spikes

Injected Voltage surges

Emitted voltage surges

Voltage ripple (2V)

Voltage spikes

Starting Operation

Reverse polarity

Order Information

Ordering Information