Technical Profile
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Appearance
Dimension
System
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CPU | Ampere® Altra® MAX M128-30 SoC, 128 cores, 3.0 GHz, 95W TDP, Ampere Altra | |||
Memory Type | 16 x DIMM sockets with individual memory channels Up to 4TB (16x 256 GB) DDR4 RDIMM memory, up to 3200 MT/s | |||
GPU | ||||
Graphics Card | RTX MXM A4500 (5888 CUDA Cores) | |||
Storage | ||||
SSD | TBD | |||
Ethernet | ||||
Ethernet | 2 x 1 Gigabit Ethernet with RJ45 2 x 10G SFP+ | |||
Side I/O | ||||
RJ45 GLAN | 2 | |||
10 GbE SFP+ | 2 | |||
COM | 1 | |||
CAN | 2 | |||
USB3.0 | 4 | |||
DP | 4 | |||
VGA | 1 | |||
DC-IN | 1 | |||
Power Button | 1 x Power Button with LED backlight | |||
OS support list | ||||
OS | Linux RedHat ,Ubuntu | |||
Power Requirement | 28V DC-IN (18V-36V) | |||
Dimension | TBD | |||
Weight | 10 KG | |||
Operating Temp. | 0°C to 60°C | |||
Storage Temp. | -40°C to 85°C | |||
Relative Humidity | 5% to 95%, non-condensing | |||
Environmental | ||||
MIL-STD-810 Test | Method 500.5, Procedures I and II (Altitude, Operation): 12,192M, (40,000 ft) for the initial cabin altitude (18.8Kpa or 2.73 Psia) Method 500.5, Procedures III and IV (Altitude, Non-Operation): 15,240, (50,000 ft) for the initial cabin altitude (14.9Kpa or 2.16 Psia) Method 501.5, Procedure I (Storage/High Temperature) Method 501.5, Procedure II (Operation/High Temperature) Method 502.5, Procedure I (Storage/Low Temperature) Method 502.5, Procedure II (Operation/Low Temperature) Method 503.5, Procedure I (Temperature shock) Method 507.5, Procedure II (Temperature & Humidity) Method 509.7 Salt Spray (50±5)g/L Method 514.6, Vibration Category 24/Non-Operating (Category 20 & 24,Vibration) Method 514.6, Vibration Category 20/Operating (Category 20 & 24,Vibration) Method 516.6, Shock-Procedure V Non-Operating (Mechanical Shock) Method 516.6, Shock-Procedure I Operating (Mechanical Shock) | |||
Reliability | Conduction Cooling. Designed & Manufactured using ISO 9001 Certified Quality Program. | |||
EMC | EN 61000-4-2: Air discharge: 8 kV, Contact discharge: 6kV EN 61000-4-3: 10V/m EN 61000-4-4: Signal and DC-Net: 1 kV EN 61000-4-5: Leads vs. ground potential 1kV, Signal und DC-Net: 0.5 kV |
TEC300P-M128 | ||
CPU | Ampere® MAX M128-30 | Ampere® M128-28 |
GPU-1 | MXM RTXA4500 | MXM RTXA4500 |
RAM | Up to DDR4-1.5TB | |
USB3.0 | 4 | |
VGA | 1 | |
DP | 4 | |
CAN BUS | 2 | |
COM | 1 | |
GLAN | 2 | |
10G SFP+LAN | 2 | |
Power | DC 18V~36V |
Attachment | |
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Datasheet | |