Technical Profile
Introduction
SR10-SCHX2, which is based on EBX SBC OXY5739A, powered by Intel Skylake i7-6820EQ quad core processor plus QM170 chipset soldered onboard. With CPU soldering onboard, there is less conduction of heat and high density interconnection between the motherboard and the components, which reduces the MB from the crisis of overheating. Apart from overheating, soldering onboard also provides the best level of shock and vibration protection, removing the unnecessary concern about poor connection that CPU socket type may bring. OXY5739A can take the advantages of key components soldering onboard and extended operating temperature from -40 to 85℃ to ensure ultimate durability, utmost resistance to shock & vibration.
SR10-SCHX2 highlights its 6th Generation Skylake Core™ i7 Fanless System with optional easy accessible with SSD storage tray, rugged XR-DIMM RAM, rich I/O with 4 USB 3.0, 1 Com Port (optional with 4 Com Ports), 2 LANs (optional with 4 LANs) and 3 Video outputs. SR10-SCHX2 can operate effectively in harsh environment under temp range from -40 to 70°C and is a perfect solution for military, transportation, factory automation and digital signage applications.
Wide Range DC input
For military and heavy duty vehicle applications, instable voltage always brings headaches about damaging the electric components. SR10-SCHX2 could supporting 9V to 36V DC-in, the flexible acceptance of inconsistent power input makes it capable of surviving tough engine cranks and transient over-voltage situations.
CPU
The rugged MIL-STD compliant system, SR10-SCH-X2 is equipped with highly effectively heat conductive and heat convective thermal solutions to meet extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system via 8.0 mm copper heat pipes. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.
Device Model | SR10-SCH-X2 |
Tester | Robin Chang |
Test Result | Pass |
Test Temperature | High 0°C~70°C / Low –40°C~0°C |
Test Time | 8 Hours / 1 Hour |
Test Standard | Reference IEC60068-2 |
Test Software | Burnin test v8.1 |
Criteria | After testing, system can’t halt. |
Test Configuration
Device | Configuration |
---|
Motherboard | OXY5739A |
CPU | Intel® Core i7-6820EQ, 2.8Ghz (8MB, 45W) |
PCH | Intel QM170 Chipset |
RAM1 | Inodisk 16GB (SK802) DDR4 2133 |
RAM2 | Inodisk SODIM 16GB DDR4 2133 |
SATA port | Apacer onboard SSD 64GB |
LAN1 | Intel(R) i210 Gigabit |
LAN2 | Intel(R) Ethernet i219-LM |
Test software | Burnin test 8.1, CPU-Z, HW monitor 1.38, AS SSD bench |
Chamber | KSON THS-b4t-150, Chipeng SMO-3 |
Thermal Measurement
7starlake provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus 7starlake conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, 7starlake is able to analyse the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 8 hours which at each temperature point we burn in SR10-SCH-X2 for one hour, from -40 to 70°C.
SR10-SCH-X2 System – IO Performance
Point | -40°C | -20°C | 0°C | 25°C | 55°C | 60°C | 65°C | 70°C |
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CPU T-J | 3 | 18 | 32 | 60 | 71 | 77 | 78 | 85 |
CPU Die | -22.7 | -4.7 | 13.3 | 53.9 | 65.9 | 73.7 | 77.5 | 84.5 |
Heatsink | -18.5 | -0.5 | 17.5 | 57.5 | 70.2 | 75.8 | 76.7 | 82.2 |
Δ1=(TJ-Die) | 25.7 | 22.7 | 18.7 | 6.1 | 5.1 | 3.3 | 0.5 | 0.5 |
Δ2=(Die-Sink) | -4.2 | -4.2 | -4.2 | -3.6 | -4.3 | -2.1 | 0.8 | 2.3 |
CPU Frenquency (GHz) | 2.8 | 2.8 | 2.8 | 2.8 | 1.6 | 0.8 | 0.8 | 0.8 |