SR10-SCH-X2

Intel® Core™ i7 Skylake Processor Fanless Rugged System 9V~36V DC-IN, Extended Temp. -40°C to 60°C

 

  • Design for reliability under demanding
  • MIL-STD-810 Thermal conditions
  • 6th Gen Intel® Core™ i7 Skylake processor (BGA)
  • DDR4 Up to 32GB
  • Onboard uSSD SATAIII 64 GB
  • Multi-Displays by 2x DP, 1x DVI-I
  • 4x USB3.0, 1x RS232/422/485
  • 1x Line-out /1x MIC-in
  • 9V~36V DC-IN
  • Extended Temperature -40°C to 60 °C

Intel Gold

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Technical Profile

Introduction

SR10-SCHX2, which is based on EBX SBC OXY5739A, powered by Intel Skylake i7-6820EQ quad core processor plus QM170 chipset soldered onboard. With CPU soldering onboard, there is less conduction of heat and high density interconnection between the motherboard and the components, which reduces the MB from the crisis of overheating. Apart from overheating, soldering onboard also provides the best level of shock and vibration protection, removing the unnecessary concern about poor connection that CPU socket type may bring. OXY5739A can take the advantages of key components soldering onboard and extended operating temperature from -40 to 85℃ to ensure ultimate durability, utmost resistance to shock & vibration.

SR10-SCHX2 highlights its 6th Generation Skylake Core™ i7 Fanless System with optional easy accessible with SSD storage tray, rugged XR-DIMM RAM, rich I/O with 4 USB 3.0, 1 Com Port (optional with 4 Com Ports), 2 LANs (optional with 4 LANs) and 3 Video outputs. SR10-SCHX2 can operate effectively in harsh environment under temp range from -40 to 70°C and is a perfect solution for military, transportation, factory automation and digital signage applications.

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Wide Range DC input

For military and heavy duty vehicle applications, instable voltage always brings headaches about damaging the electric components. SR10-SCHX2 could supporting 9V to 36V DC-in, the flexible acceptance of inconsistent power input makes it capable of surviving tough engine cranks and transient over-voltage situations.

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Advanced Thermal Technology and Rapid Heat-Dissipation

SR10-SCHX2’s thermal solution designed with copper plus aluminum heat sink and 4 copper vacuum tube liquid-vapors (Heat-Pipe) which have high efficiency for heat dissipation. The rugged mechanical structure improves the cooling efficiency to secure SR10-SCHX2 maintains superior computing performance as customers desired.

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MIL-STD-810G Certified

MIL-STD-810 standard is a Military Standard established by United States Department of Defense ( DoD ) considered the utmost principle for military ruggedness request. It provides a series of testing procedures for resistance to water proof, shock, vibration, dust, humidity, and extreme temperatures and SR10-SCHX2 is designed to comply to the series of tests concerning on sustainable in such harsh environment.

 

System main board: EBX SBC-OXY5739A

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1. Intel® Core i7 CPU soldering onboard

SR10-SCHX2 is based on EBX SBC—OXY5739A, powered by Intel Skylake i7-6820EQ quad core processor plus QM170 chipset soldered onboard. With CPU soldering onboard, there is less conduction of heat and high density interconnection between the motherboard and the components, which reduces the MB from the crisis of overheating. Apart from overheating, soldering onboard also provides the best level of shock and vibration protection, removing the unnecessary concern about poor connection that CPU socket type may bring.

 

2. Wide Range DC input

For military and heavy duty vehicle applications, instable voltage always brings headaches about damaging the electric components. SR10-SCHX2 supports 9V to 36V DC-in, the flexible acceptance of inconsistent power input makes it capable of surviving tough engine cranks and transient over-voltage situations

Specifications

Operating Temp

-40°C to 60°C
 

System

ModelSR10-SCHX2
CPUIntel® 6th Gen Core™ i7-6820EQ (Frequency 2.8GHz, Turbo Boost up to 3.5GHz),

Quad-Core, 8 Thread Support, 8MB SmartCache. Build-in HD Graphics 530 for excellent 3D,

Turbo Boost Technology 2.0, VPro and Hyper-Threading support.

Memory1x DDR4 XR-DIMM, 1x DDR4 SO-DIMM Total up to 32 GB
ChipsetIntel® QM170 Chipset supporting 6th generation Intel® Core™ processor families.
Expansion Slot1x Full-size miniPCIe / mSATA with SIM card holder 1x Half-size miniPCIe
 

Display

Display PortResolution up to 3840 x 2160
DVI-IResolution up to 1920 x 1200
 

Storage

mSATA1x mSATA Solid State Disk ( SSD ) – up to 512GB Capacity.
 

Rear I/O

DisplayPort2x 20Pin External connectors ( Female )
DVI-I1x 29Pin DVI-I connector ( Female )
Ethernet2x RJ45 Gigabit Ethernet LAN ( Female )
Audio2x 3.5mm Audio Jacks ( 1x MIC, 1x Line-Out )
Serial Port1x RS232 / 422 / 485
USB Port2x USB3.0 standard-A connectors
DC-IN1x 4Pin ugged terminal block
 

Front I/O

ButtonPower Button w/cover
Indicator LEDPower, HDD, LAN ( Link / Active / Speed )
USB Port2x USB3.0 standard-A connectors
 

Applications, Operating System

Applications1x Secure Erase Button ( SSD2 support AES Secure Erase )

1x Power Switch with Dedicated LED

USB2x USB3.0
 

Power Requirement

Power InputMIL-STD-1275, MIL-STD 704 and DO-160 power supply ,12V~40V ( 150W max )
 

Applications, Operating System

ApplicationsCommercial and Military Platforms Requiring Compliance to MIL-STD-810 Embedded Computing,

Process Control, Intelligent Automation and manufactur-ing applications where Harsh Temperature,

Shock, Vibration, Altitude, Dust and EMI Conditions.

Operating SystemWindows 8 , Windows 8.1 , Windows 10

Ubuntu14.04, Ubuntu 16.04

 

Physical

Dimension ( WxDxH )308 x 149 x 58 mm
Weight2.96 Kg ( 6.52 lbs )
ChassisAluminum Alloy, Corrosion Resistant.
FinishAnodic aluminum oxide ( Color Iron gray )
CoolingNatural Passive Convection / Conduction. No Moving Parts.
 

Environmental

ReliabilityNo Moving Parts; Passive Cooling. Designed &

Manufactured using ISO 9001/2000 Certified Quality Program.

EMCCE and FCC compliance
Green ProductRoHS, WEEE compliance

CPU

 The rugged MIL-STD compliant system, SR10-SCH-X2 is equipped with highly effectively heat conductive and heat convective thermal solutions to meet extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system via 8.0 mm copper heat pipes. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.

 

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Device ModelSR10-SCH-X2
TesterRobin Chang
Test ResultPass
Test TemperatureHigh 0°C~70°C / Low –40°C~0°C
Test Time8 Hours / 1 Hour
Test StandardReference IEC60068-2
Test SoftwareBurnin test v8.1
CriteriaAfter testing, system can’t halt.

 

Test Configuration

Device

Configuration

MotherboardOXY5739A
CPUIntel® Core i7-6820EQ, 2.8Ghz (8MB, 45W)
PCHIntel QM170 Chipset
RAM1Inodisk 16GB (SK802) DDR4 2133
RAM2Inodisk SODIM 16GB DDR4 2133
SATA portApacer onboard SSD 64GB
LAN1Intel(R) i210 Gigabit
LAN2Intel(R) Ethernet i219-LM
Test softwareBurnin test 8.1, CPU-Z,
HW monitor 1.38, AS SSD bench
ChamberKSON THS-b4t-150, Chipeng SMO-3

 

Thermal Measurement

7starlake provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus 7starlake conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, 7starlake is able to analyse the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 8 hours which at each temperature point we burn in SR10-SCH-X2 for one hour, from -40 to 70°C.

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SR10-SCH-X2 System – IO Performance

Point-40°C-20°C0°C25°C55°C60°C65°C70°C
CPU T-J318326071777885
CPU Die-22.7-4.713.353.965.973.777.584.5
Heatsink-18.5-0.517.557.570.275.876.782.2
Δ1=(TJ-Die)25.722.718.76.15.13.30.50.5
Δ2=(Die-Sink)-4.2-4.2-4.2-3.6-4.3-2.10.82.3
CPU Frenquency (GHz)2.82.82.82.81.60.80.80.8

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