Technical Profile
Introduction
SR10-SCH is a powerful and high efficiency computing system driven by Intel 4th Gen, 4 Core, 8 Thread processor, that can smoothly operate with high speed processing program. Besides, there are three independent display output ports supporting the system, including two DisplayPort and one DVI-I. What’s more, SR10-SCH is equipped with four USB3.0 and one COM port, providing the best input/output efficiency. The system also supports wide DC input voltage range, from 9V to 36V, and the extended temperature ranges from -40°C to 70°C. SR10-SCH passes the MIL-STD 810G compliance and is able to operate successfully in harsh environments.
Thermal solution for fanless system design
7starlake exclusively adopts special heat radiating materials combining special CNC cutting, forging a lavish sophisticated metal. Further, 7starlake designs an unique enclosure that is able to stack together both horizontally and vertically. The aluminum heat sink enclosure allows perfect heat dissipation. Apart from the unique heat sink enclosure, SR10-SCH innovatively adopts copper heat spreaders. The shape and the size of the spreader are tailor-made based on the heat sources placement of CPU module and graphic module. The exclusive thermal designs combined are able to replace traditional fan, as well as ensure high reliability and stability while working under wide range temperature from -40 to 70°C.
MIL-STD-810G standard designed for shock and vibration
SR10-SCH is designed to meet MIL-STD-810G standard for shock and vibration. MIL-STD-810G standard is considered the upmost principle, which guarantees the system to achieve superior quality and stability when operating under extreme harsh environment. We have conducted a series of testing, including resistance to shock, vibration, dust, humidity, and extreme temperatures.
CPU
The rugged MIL-STD compliant system, SR10-SCH is equipped with highly effectively heat conductive and heat convective thermal solutions to meet extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system via 8.0 mm copper heat pipes. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.
Device Model | SR10-SCH |
Tester | Robin Chang |
Test Result | Pass |
Test Temperature | High 0°C~70°C / Low –40°C~0°C |
Test Time | 7 Hours / 1 Hour |
Test Standard | Reference IEC60068-2 |
Test Software | Burnin test v8.1 |
Criteria | After testing, system can’t halt. |
Test Configuration
Device | Configuration |
---|
Motherboard | OXY5737A |
CPU | Intel® Core™ i7-4700EQ 2.4 GHz (6MB, 47W) |
PCH | Intel® QM87 Chipset |
Memory DIMM1 | Swissbit XR DIMM 8GB DDR3 1600 |
SATA port | Apacer onboard SSD 64GB |
LAN1 | Intel®I210IT GbE LAN |
LAN2 | Intel® I217LM GbE LAN |
Test software | Burnin test 8.1, CPU-Z, HW monitor 1.38, AS SSD bench |
Chamber | KSON THS-b4t-150, Chipeng SMO-3 |
Thermal Measurement
7starlake provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus 7starlake conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, 7starlake is able to analyse the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 7 hours which at each temperature point we burn in SR10-SCH for one hour, from -40°C to 70°C.
SR10-SCH System – IO Performance
Point | -40°C | -20°C | 25°C | 55°C | 60°C | 65°C | 70°C |
---|
CPU T-J | 0 | 7 | 81 | 99 | 99 | 98 | 99 |
CPU Die | -10 | -3 | 71 | 89 | 89 | 88 | 89 |
Heatsink | -20 | -13 | 61 | 79 | 79 | 78 | 79 |
Δ1=(TJ-Die) | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
Δ2=(Die-Sink) | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
CPU Frenquency (GHz) | 2.79 | 2.79 | 2.79 | 2.59 | 2.19 | 2.39 | 1.9 |