SK517-T7LCC COM Express Type 7

COM Express Type 7 carrier board w/PCIe 104, MXM, 9V~36V DC-IN, Extended Temp. -40 to 85°C

 

  • COM Express Type 7 Support Intel Ice Lake D-LCC Family Processor
  • Standard MXM Type 3.1 Support NVIDIA® Quadro® RTX/ Intel® Arc™
  • PCIe/104 Express Expansion Slot for Modular Open Structure
  • Multi-Expansion Slots include Dual Mini PCIe Express Slots, 1x M.2 Slot
  • Extreme Temperature Support -40 to 85°C
  • GPU can be targeted for 4 Displayport outputs
  • Intel Gold
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Technical Profile

Introduction

Computer-On-Module (COM), is a highly integrated board with CPU, chipset, memory, and peripherals designed into a component module.

COM Express Type 7 has also become the most versatile and most scalable COM standard supporting everything from small-scaled and cost-sensitive applications up to high-end computing and graphics-intensive solutions.

7StarLake’s SK517 COM Express defines Open Scalable Modular Architecture platform which is ensuring amazing computing performance and offering a broad range of I/O interfaces including intense graphics support, Digital Display Interfaces (Display Port, HDMI) and super-fast USB 3.0 to serve all kind of different application requirements.

SK517 pin-out Type 7 is replacing the graphics support by offering multiple 10GbE-KR ports and defining 32 PCIe lanes. The Type 7 is an ideal definition to design server-grade platforms for applications requesting high data and network throughput.

SK517 support a wide range of Intel processors, from Ice Lake D-LCC porcessors  to Atom C3000 series, feature advanced hybrid architecture with Performance and Efficient cores for optimized power usage. What’s more, SK517 has the capability to operate in harsh environment. It accepts the extend range of temperature from -40 to 85°C. With outstanding computing capability and efficient thermal design, SK517 is very suitable for industrial, military/aerospace and transportation.

 

Rich Expansion Slot

SK517 provides rich expansion to make the whole solutions easier. We could use PCIe 104 related product SK506, SK303, SK1050 and SK1660S：

12

 

 

  • SK506/SK506P:

  1. StackPC-FPE form factor
  2. PCIe/104 stackable bus structure
  3. Reliable Ethernet technology from Intel i350-AM4 controllers
  4. Total 6 independent LAN connections (2 from host board, 4 from Intel controllers)
  5. Flexible options for Ethernets through RJ45 or 10 pin headers
  6. High-performing bridgeless design supporting PCI Express Gen 2.1 5GT/s
  7. Extended temperature -40 to 85°C

 

  • SK401:

  1. Stack PC form factor
  2. PCIe/104 stackable bus structure
  3. Reserve PCI/104 connector for different stacking criteria
  4. Extended temperature -40 to 85°C

 

401

3

  • SK303:

  1. PCI/104-Express, PCI & PCIe connectors (w/StackPC design)
  2. PCIe/104 stackable bus structure
  3. PCIe to PCI adapter function
  4. COM: 4 x RS232/422/485 with 5V/12V selectable and isolation function
  5. Extended temperature -40 to 85°C

 

 

  • NVIDIA Ampere RTXA2000/A4500 MXM 3.1 Graphics Module:

  1. Powered by NVIDIA RTX® A2000/A4500
  2. MXM 3.1Type-B Module
  3. A2000 High-speed 8GB GDDR6 Memory
  4. A4500 High-speed 16GB GDDR6 Memory
  5. A2000 2,560 new-gen. Pascal architecture CUDA cores
  6. A4500 5,888 new-gen. Pascal architecture CUDA cores
  7. Outputs 4 Channel Support
  8. Display Port 1.4 Ready
  9. Support NVIDIA CUDATM, OptimusTM, DirectX® 12, OpenGL® 4.5

MXM A2000

2060S

  • NVIDIA GeForce RTX2060S MXM 3.1 Graphics Module:

  1. Powered by NVIDIA GeForce® RTX 2060SUPER
  2. MXM 3.1 Type-B Graphics Module
  3. High-speed 8GB GDDR6 Memory
  4. 2,176 new-gen. Pascal architecture CUDA cores
  5. 1 x Display Port 1.4 and 3 x HDMI 2.0 Ready
  6. Support NVIDIA CUDA, DirectX® 12, OpenGL® 4.6

 

 

1660S

  • NVIDIA GeForce GTX1660S MXM 3.1 Graphics Module:

  1. Powered by NVIDIA GeForce® GTX 1060SUPER
  2. MXM 3.1 Type-B Graphics Module
  3. High-speed 6GB GDDR6 Memory
  4. 1,048 new-gen. Pascal architecture CUDA cores
  5. 1 x Display Port 1.4 and 3 x HDMI 2.0 Ready
  6. Support NVIDIA CUDA, DirectX® 12, OpenGL® 4.6

Specifications

System

 

COM Express CPU Options(Type7)Intel® Xeon® D-1700 processor (Ice Lake-D LCC)
GPU Module OptionsNVIDIA® Quadro® A4500, 80/130W, 16GB GDDR6 256bit, 5,888 CUDA Cores

NVIDIA® Quadro® A2000, 35/60/80W, 8GB GDDR6 128bit, 2,560 CUDA Cores

NVIDIA® RTX3080Tim, 110/160W, 16GB GDDR6 256bit, 7424 CUDA cores

NVIDIA® RTX3060m, 75/110W, 12GB GDDR6 192bit, 3584 CUDA cores

COM Express CompatibilityCOM Express® Type 7
 

Expansion

Mini PCIe Expansion2x Full-size Mini PCIe
M.2 Expansion1x 2280 M-key (PCIe Gen3, x4 NVMe)
PCIe/104 Expansion4x PCIe x1+ 2x PCIe x4
SATAIII2x SATAIII
 

Display

Display Port4x Display Port outputs from GPU(Port A/B/C/D)

2x Display Port outputs from GPU(Port E/F)

VGA1x (AST2500)
 

Ethernet

LAN11x GbE from CPU module
LAN21x GbE (Intel i210IT)
LAN3~610GbE SFP+ Filber PHY (Intel C827 10G Retimer)
 

Internal I/O

USB4x USB3.0, 2x USB2.0
Audio1x Line-out, 1x MIC-In
SATA Power2x SATA Power
Display Port Header(1x20pin)2x
VGA(2x5pin)1x (AST2500)
SATA Port (standard 7pin)2x (up t 6Gb/s)
SATA Power2x
RJ45 GbE LAN2x (One from module; One from AST2500 for remote management)
COM Port(1x 10pin)6x RS232/422/485 (2 TX/RX form COMe module)
DI/DO4x DI/4x DO
CPU FAN1x CPU FAN
MXM FAN1x MXM FAN
Battery1x Battery Header
 

Power System

Input Power_SYS9V~36V (1x 4P Terminal Block)
Input Power_MXM12V (ATX 4P)
Power ConsumptionVaries per COM Express /MXM with different CPU and GPU models
RTC Battery3V CR2032
 

Mechanical and Environment

Dimensions190mm x 210mm
Operating Temperature-40°C to 85°C
Storage Temperature-40°C to 85°C
Relative Humidity10% to 90%, non-condensing
 

Standard Compliance

Standard ComplianceCE/FCC
 

OS

OS SupportWindows®10 64-bit

Linux(Support by request)

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Attachment
Datasheet