Technical Profile
Introduction
Computer-On-Module (COM), is a highly integrated board with CPU, chipset, memory, and peripherals designed into a component module. COM Express Type 6 has become the most versatile and most scalable COM standard supporting everything from small-scaled and cost-sensitive applications up to high-end computing and graphics-intensive solutions.
7StarLake’s SK515-T6 COM Express defines Open Scalable Modular Architecture and pin-out Type 6 platform which is ensuring amazing computing performance and offering a broad range of I/O interfaces including intense graphics support, Digital Display Interfaces (Display Port, HDMI) and super-fast USB 3.0 to serve all kind of different application requirements.
SK515-T6 pin-out Type 6 is a complementary specification to the existing Type 6 pin-out. It is replacing the graphics support by offering multiple 10GbE-KR ports and defining 32 PCIe lanes. The Type 6 is an ideal definition to design server-grade platforms for applications requesting high data and network throughput.
SK515-T6 support a wide range of Intel processors, including 13th Gen core i7-13800HE and Industrial Temp grade of i7-13800HRE, feature advanced hybrid architecture with Performance and Efficient cores for optimized power usage. What’s more, SK515-T6 has the capability to operate in harsh environment. It accepts the extend range of temperature from -40 to 85°C. With outstanding computing capability and efficient thermal design, SK515-T6 is very suitable for industrial, military/aerospace and transportation.
![515](https://7starlake.com/sites/default/files/inline-images/%E6%8B%89%E7%B7%9A%E5%9C%96%E7%B6%9C%E5%90%88%28%E5%AE%98%E7%B6%B2%29.jpg)
SK506/SK506P:
- StackPC-FPE form factor
- PCIe/104 stackable bus structure
- Reliable Ethernet technology from Intel i350-AM4 controllers
- Total 6 independent LAN connections (2 from host board, 4 from Intel controllers)
- Flexible options for Ethernets through RJ45 or 10 pin headers
- High-performing bridgeless design supporting PCI Express Gen 2.1 5GT/s
- Extended temperature -40 to 85°C
SK401:
- Stack PC form factor
- PCIe/104 stackable bus structure
- Reserve PCI/104 connector for different stacking criteria
- Extended temperature -40 to 85°C
![3](https://7starlake.com/sites/default/files/inline-images/SK303_01.png)
SK303:
- PCI/104-Express, PCI & PCIe connectors (w/StackPC design)
- PCIe/104 stackable bus structure
- PCIe to PCI adapter function
- COM: 4 x RS232/422/485 with 5V/12V selectable and isolation function
- Extended temperature -40 to 85°C
NVIDIA Ampere RTXA2000/A4500 MXM 3.1 Graphics Module:
- Powered by NVIDIA RTX® A2000/A4500
- MXM 3.1Type-B Module
- A2000 High-speed 8GB GDDR6 Memory
- A4500 High-speed 16GB GDDR6 Memory
- A2000 2,560 new-gen. Pascal architecture CUDA cores
- A4500 5,888 new-gen. Pascal architecture CUDA cores
- Outputs 4 Channel Support
- Display Port 1.4 Ready
- Support NVIDIA CUDATM, OptimusTM, DirectX® 12, OpenGL® 4.5
Targeting & Surveillance GPU Computer For Joint Battle Command Platform (JBC-P) , MIL-STD Fanless Rugged Computer with Intel® Core™i7-6822EQ , NVIDIA®GTX1050Ti CUDA 768 GDDR5-4GB/Quadro® RTX3000 CUDA 1920 GDDR6-6GB,IP65 protection, MIL-STD D38999 Connectors, 18~36V DC-in, Extended Temp. -40 to 70°C
- GPGPU IP65 Mission Computer Design for Joint Battle Command Platform (JBC-P)
- NVIDIA®GTX1050Ti CUDA 768 GDDR5-4GB/Quadro® RTX3000 CUDA 1920 GDDR6-6GB
- Intel® Core™ i7-6822EQ Processor
- Up To 32GB DDR4 Memory 1 x VGA, 2 x Gigabit Ethernet,2 x USB, 2 x COM
- Rugged MIL-DTL-38999 connectors
- 9~36V DC-in Options for DC/DC 18~36V DC-in (MIL461/1275)
- Extended Temperature -40 to 70°C
- Intel® 9th Coffee-Lake i7-9850HE (2.7 GHz, up to 4.4 GHz, 6-cores, 12 threads)
- NVIDIA MXM Graphic Engine support up to GTX1080(CUDA2560,8 GB GDDR5X)
- NVIDIA MXM Support Up to 180W
- Dual 10 GbE SFP+
- DDR4 Up to 64GB (ECC for Options)
- 2 x LAN, 4 x USB, 2 x DVI ,
- Rugged MIL-DTL-38999 connectors
- MIL-STD-461/1275 18~36V DC-in
- Operating Temperature -20 to 55°C