SCH-X401

Micro-Grid Computer with Intel® 10th Gen (Cometlake-S) i9-10900TE processor, Extended range of Temperature Support from -20°C to 60°C

 

  • 10th Gen Core i Comet Lake-S
  • DDR4 SODIMM up to 64GB
  • 2x Swap SSD –  Support RAID 0/1
  • TPM2.0 Security on Board
  • Multi Display with DisplayPort, HDMI
  • 2 x COM, 2 x LAN, 6 x USB
  • 110V AC-IN with Redundant
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Technical Profile

A.Introduction

A Microgrid is a small scale, a type of local electric subsystem that combines power from distributed energy generation sources, connected to the general grid at a single point. A Microgrid is a self-contained power system that has the ability to locally generate, distribute, and store energy. It also is a localised energy grid, which is generally linked to the main grid but can disconnect automatically and function as its own independent grid when necessary. This connection also can be acted as a switch that makes it possible to disconnect a Microgrid from the public grid (should anything happen to the main grid such as a blackout.) and operate it temporarily in island mode.

A Microgrid can be powered by distributed generators, batteries, and/or renewable resources like solar panels. Depending on how its requirements are managed, a Microgrid might run indefinitely.

 

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7Starlake Smart City Green Energy

 

How does Micro-Grid work?

Microgrid is including three essential sections:

  1. Local energy (such as photovoltaic panels, wind turbines, heat pumps, biomass plants, hydroelectric turbines, etc.) and an additional back-up supply of energy (power generators).
  2.  Storage system: batteries, a supply of water for pumped-storage hydroelectricity.
  3. Smart management system to ensure the continuous balance between electricity generation and demand.

ECO Structure

A fully functioning Microgrid computer system is important for ensuring all processes work correctly and that energy is always being distributed in an efficient manner. 7Starlake provides state-of-the-art solutions for substation automation and Micro-Grid applications for both public utilities and enterprises. Our rich experience in this industry, coupled with our innovative work on the latest technologies, enables us to develop market-specific solutions for computing and communication applications in this domain.

SCHX4 is designed especially for Microgrid customer such as SCHNEIDER with a highly efficient and powerful computing performance driven by the Intel 10th Gen, Cometlake-S i9-10900TE, in addition, SCHX4 system also supports a wide range DC-in from 12V to 24V, and accepts the extend range of temperature from -20°C to 60°C (CPU Full Speed with no throttling @ 50°C). SCHX4 passes the MIL-STD 810G compliance which can operate successfully in any harsh environments.

 

B.Architecture

Grid Connected:

The microgrid operates in parallel with the grid, making your community more sustainable and reducing your energy consumption from the grid.

 

Grid Islanded:

In this mode, the microgrid will power all the critical loads in the community on the utility distribution network when there is no grid power. All of the facilities will stay powered during these extreme events.

 

Grid Connected:

The microgrid operates in parallel with grid and has the ability to import and export to the grid in response to appropriate price signals. This configuration requires sophisticated controls, testing, and integration to manage interaction with grid.

 

Grid Islanded:

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C. Drawing

 

 

SCH-X401 拉線圖 Front IO

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Specifications

System

CPU10th Generation Intel® Core™ i9/i7/i5 Processors

Intel® Core™ i9-10900TE(20M Cache, up to 4.60 GHz)

Intel® Core™ i7-10700TE(16M Cache, up to 4.50 GHz)

Intel® Core™ i5-10500TE(12M Cache, up to 3.70 GHz)

MemoryDDR4 SO-DIMM up to 64GB
ChipsetQ470E
 

Display

GPUIntel® UHD Graphics
Display PortDisplayPort 1.4, DP++ Max resolution up to 4096×2160@60Hz
HDMIHDMI 2.0a, Max resolution up to 4096×2160@60Hz
 

Expansion

Expansion1 x M.2 (Key E, 2230) with PCIe x1, USB 2.0 and CNVi for Wireless

1 x M.2 (Key B, 3042 / 3052) with PCIe x1 / USB 3.0 / USB2.0 and SIM for 4G / 5G

 

Storage

Storage1 x M.2 (Key M, 2242 / 2260 / 2280) with PCIE x4 or SATA3
 

Ethernet

Ethernet1 x Intel Gigabit Ethernet LAN Interfaces (10/100/1000 Mbps)

1 x Intel 2.5Gigabit Ethernet LAN Interfaces (10/100/1000/2500 Mbps)

 

Rear I/O

Power Button1 x with backlight
Indicator1 x HDD backlight
USB2 x USB2.0
Storage2 x SSD Tray
 

Front I/O

Power Input2 x 3P C14 Plug
LAN1 x GbE RJ45 LAN

1 x 2.5GbE RJ45 LAN

DisplayPort2 x DP
HDMI1 x HDMI
Audio1 x Mic-in ; 1 x Line out
COM2x RS232/422/485
 

Power

Power InputAC-IN 110V with Redundant
 

OS Support List

WindowsWindows 10 x 64
LinuxLinux Support by request
 

Mechanical and Environmental

Dimension (WxDxH)430 x 300 x 74 mm
Operating Temperature-20°C to 60°C
Storage Temperature-40°C to 85°C
Relative Humidity5% to 95%, non-condensing
EMCCE and FCC Certification
Green ProductRoHS, WEEE compliance
System DesignFanless
Mounting2U Rackmount

CPU

Intel® Core™ i7-10700TE/i9-10900TE Processor 

Thermal Point Testing Temp.

-20°C

0°C

+25°C

+40°C

+50°C

+55°C

+60°C

CPU Frequency (GHz)3.693.693.693.691.99~3.691.99~3.691.99~3.69
CPU Heatsink19.220.16066.471.17581.9
CPU Die24.525.67071.775.57877.3
CPU T-J (℃)39℃42℃89℃90℃78~98℃80~99℃83~100℃
Test Configuration

Device

Configuration

CPU TypeIntel® Core™ i7-10700TE Processor 2.0 GHz
PCHIntel Q470E
MemoryInnodisk 8GB SOD DDR4 2666 X2
SATA port 1InnDisk 3MG2-P SSD 64G
DPDell U2312
LAN1 ~ LAN2LAN (Loopback)
USB1~USB41A cement resistor
COMCom port loopback
Test SoftwareBurnin test v9.0 XTU CPU STRESS,FU MARK
ChamberKSON THS-b4t-150
Chipeng SMO-3
Test EquipmentFSP060-DBAE1、PROVA 11_AC/DC mA clamp meter、Agilent U1252B

Order Information

SCH-X401

Micro-Grid 10th CPU Fanless Computer with Intel. 10th Gen. Core i3/i5/i7/i9 up to 65W Processor, up to 64G SO-DIMM DDR4, 2 × RJ45 GbE, 4 x USB3.0, 2 x USB2.0, 2 x COM, 2 x DP, 1 x HDMI, 2 x SSD Tray, AC–IN 110~240C with redundant, Operating Temperature -20~+60°C

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